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SN74ACT2226DW

Texas Instruments

SN74ACT2226DW by Texas Instruments

SN74ACT2226DW by Texas Instruments is a FIFO with 64x1 organization, operating at 60MHz clock frequency. It features a cycle time of 45.45ns and operates on a nominal voltage of 5V. Ideal for industrial applications requiring fast data storage and retrieval in a compact small outline package.

Median Price

$7.237

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 8,261 parts In-Stock

1+ parts

-

100+ parts

$5.790

1k+ parts

$5.180

10k+ parts

$4.870

8,261

-

$5.790

$5.180

$4.870

DigiKey

USA . 8,261 parts In-Stock

1+ parts

-

100+ parts

$7.610

1k+ parts

-

10k+ parts

-

8,261

-

$7.610

-

-

Verical

USA . 3,575 parts In-Stock

1+ parts

-

100+ parts

$7.237

1k+ parts

$6.475

10k+ parts

$6.088

3,575

-

$7.237

$6.475

$6.088

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,344 parts In-Stock

1+ parts

$5.050

100+ parts

-

1k+ parts

-

10k+ parts

-

4,344

$5.050

-

-

-

Digiode

USA . 2,156 parts In-Stock

1+ parts

$5.310

100+ parts

-

1k+ parts

-

10k+ parts

-

2,156

$5.310

-

-

-

Lighthouse Electronics, Inc.

USA . 646 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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646

-

-

-

-

Bristol Electronics

USA . 229 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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229

-

-

-

-

Atlantic Semiconductor

USA . 229 parts In-Stock

1+ parts

-

100+ parts

-

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-

229

-

-

-

-

LWI Electronics Inc

India . 82 parts In-Stock

1+ parts

-

100+ parts

-

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82

-

-

-

-

Prism Electronics

USA . 17 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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17

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$4.128

100+ parts

$3.756

1k+ parts

$3.385

10k+ parts

-

500

$4.128

$3.756

$3.385

-

Parana Technologies

USA . 1,411 parts In-Stock

1+ parts

$4.619

100+ parts

-

1k+ parts

$5.090

10k+ parts

-

1,411

$4.619

-

$5.090

-

Component Stockers USA

USA . 7,917 parts In-Stock

1+ parts

$5.010

100+ parts

$4.710

1k+ parts

$4.260

10k+ parts

-

7,917

$5.010

$4.710

$4.260

-

Corphita

USA . 2,821 parts In-Stock

1+ parts

$5.031

100+ parts

-

1k+ parts

-

10k+ parts

-

2,821

$5.031

-

-

-

DigiPath Technology Company

USA . 1,991 parts In-Stock

1+ parts

$5.086

100+ parts

$4.679

1k+ parts

-

10k+ parts

-

1,991

$5.086

$4.679

-

-

ChromeModa Solutions

Germany . 6,290 parts In-Stock

1+ parts

$5.190

100+ parts

$4.256

1k+ parts

-

10k+ parts

-

6,290

$5.190

$4.256

-

-

IDEA Electronic Components Group

UK . 243 parts In-Stock

1+ parts

$5.190

100+ parts

-

1k+ parts

$4.671

10k+ parts

-

243

$5.190

-

$4.671

-

Microchip USA

USA . 1,136 parts In-Stock

1+ parts

$14.140

100+ parts

$13.940

1k+ parts

$13.840

10k+ parts

$13.740

1,136

$14.140

$13.940

$13.840

$13.740

Overview

Experience unparalleled efficiency and reliability with the Texas Instruments SN74ACT2226DW FIFO. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and cutting-edge technology in their products. Ideal for a wide range of applications, this FIFO offers seamless operation and high performance. With fast cycle times and a synchronous operating mode, this product ensures smooth data transfer and precision. Trust in Texas Instruments to provide superior solutions for your electronic needs, and elevate your projects to new heights with the SN74ACT2226DW.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and thermal resistance, suitable for industrial applications.

Cycle Time: 45.45 ns

Fast operation speed for efficient data transfer and processing.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage for compatibility with various systems and devices.

Maximum Operating Temperature: 85 °C

Can handle high temperature environments, ideal for industrial settings.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity.

No. of Words: 64 words

Sufficient memory capacity for storing and retrieving data efficiently.

Memory IC Type: OTHER FIFO

Specifically designed for First In, First Out data storage and retrieval.

Technical Specifications

FIFO SN74ACT2226DW attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

20 ns

Maximum Clock Frequency (fCLK):

60 MHz

Cycle Time:

45.45 ns

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

15.4 mm

Memory Density:

64 bit

Memory IC Type:

Memory Width:

1

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

24

No. of Words:

64 words

No. of Words Code:

64

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64X1

Output Characteristics:

TOTEM POLE

Output Enable:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Standby Current:

.0004 Amp

Sub-Category:

FIFOs

Maximum Supply Current:

.4 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

SN74ACT2226DW Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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