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SN74ABT7819-30PN

Texas Instruments

SN74ABT7819-30PN by Texas Instruments

SN74ABT7819-30PN by Texas Instruments is a FIFO memory with 512x18 organization, operating at 33.3 MHz clock frequency and 30.03 ns cycle time. It is suitable for applications requiring fast data storage and retrieval in synchronous mode with a supply voltage of 5V.

Median Price

$19.670

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 92 parts In-Stock

1+ parts

-

100+ parts

$19.670

1k+ parts

-

10k+ parts

-

92

-

$19.670

-

-

Rochester

USA . 77 parts In-Stock

1+ parts

-

100+ parts

$17.010

1k+ parts

$15.220

10k+ parts

$14.330

77

-

$17.010

$15.220

$14.330

Verical

USA . 77 parts In-Stock

1+ parts

-

100+ parts

$21.262

1k+ parts

$19.025

10k+ parts

$17.913

77

-

$21.262

$19.025

$17.913

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,195 parts In-Stock

1+ parts

$17.964

100+ parts

-

1k+ parts

-

10k+ parts

-

2,195

$17.964

-

-

-

Vyrian

USA . 4,739 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,739

-

-

-

-

DigiKey Marketplace

USA . 92 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

92

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,609 parts In-Stock

1+ parts

$1.827

100+ parts

-

1k+ parts

$2.379

10k+ parts

-

1,609

$1.827

-

$2.379

-

ChromeModa Solutions

Germany . 6,390 parts In-Stock

1+ parts

$2.053

100+ parts

$1.683

1k+ parts

-

10k+ parts

-

6,390

$2.053

$1.683

-

-

IDEA Electronic Components Group

UK . 1,725 parts In-Stock

1+ parts

$2.053

100+ parts

-

1k+ parts

$1.848

10k+ parts

-

1,725

$2.053

-

$1.848

-

Ampacity Inc.

Singapore . 92 parts In-Stock

1+ parts

$16.070

100+ parts

-

1k+ parts

-

10k+ parts

-

92

$16.070

-

-

-

Corphita

USA . 1,933 parts In-Stock

1+ parts

$17.019

100+ parts

-

1k+ parts

-

10k+ parts

-

1,933

$17.019

-

-

-

Component Stockers USA

USA . 88 parts In-Stock

1+ parts

$19.610

100+ parts

-

1k+ parts

-

10k+ parts

-

88

$19.610

-

-

-

Microchip USA

USA . 403 parts In-Stock

1+ parts

$50.820

100+ parts

$50.090

1k+ parts

$49.730

10k+ parts

$49.370

403

$50.820

$50.090

$49.730

$49.370

DigiPath Technology Company

USA . 1,530 parts In-Stock

1+ parts

-

100+ parts

$1.851

1k+ parts

-

10k+ parts

-

1,530

-

$1.851

-

-

Overview

Experience seamless data transfer with the Texas Instruments SN74ABT7819-30PN FIFO memory IC. With a reputation for reliability and innovation, Texas Instruments delivers a high-quality product that guarantees fast and efficient operation. Whether you're in need of reliable storage solutions for telecommunications equipment, networking devices, or industrial applications, this FIFO memory IC offers unmatched performance and value. Elevate your projects with the trusted technology of Texas Instruments and unlock endless possibilities for your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the components inside, ensuring a longer product lifespan.

Cycle Time: 30.03 ns

Fast cycle time of 30.03 ns allows for quick and efficient data transfer within the FIFO, increasing overall system performance.

Nominal Supply Voltage / Vsup: 5V

Operates at a standard 5V supply voltage, making it compatible with many existing systems and easy to integrate.

Maximum Clock Frequency (fCLK): 33.3 MHz

High maximum clock frequency of 33.3 MHz enables fast data processing and retrieval, improving system responsiveness.

Technology: BICMOS

Utilizes BICMOS technology which combines the strengths of both bipolar and CMOS technologies, offering high performance and low power consumption.

Memory IC Type: BI-DIRECTIONAL FIFO

Bi-directional FIFO allows for data to be read from and written to the memory buffer simultaneously, enhancing data flow efficiency.

Output Enable: YES

Output enable feature provides control over when data is output from the FIFO, allowing for better synchronization with the rest of the system.

Technical Specifications

FIFO SN74ABT7819-30PN attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

14 ns

Maximum Clock Frequency (fCLK):

33.3 MHz

Cycle Time:

30.03 ns

JESD-30 Code:

S-PQFP-G80

Length:

12 mm

Memory Density:

9216 bit

Memory IC Type:

Memory Width:

18

No. of Functions:

1

No. of Terminals:

80

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512X18

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

FIFOs

Maximum Supply Current:

95 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Trade Compliance

SN74ABT7819-30PN Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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