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SN74ACT2236-40PAG

Texas Instruments

SN74ACT2236-40PAG by Texas Instruments

SN74ACT2236-40PAG by Texas Instruments is a 2Kx9 FIFO with 3-STATE output, operating at 5V. It features a flatpack package style, 0.5mm terminal pitch, and GULL WING terminals. Ideal for synchronous applications requiring high memory density and parallel data transfer in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,529 parts In-Stock

1+ parts

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2,529

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Digiode

USA . 290 parts In-Stock

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290

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,374 parts In-Stock

1+ parts

$4.188

100+ parts

$388.951

1k+ parts

$3.770

10k+ parts

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2,374

$4.188

$388.951

$3.770

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DigiPath Technology Company

USA . 889 parts In-Stock

1+ parts

$4.612

100+ parts

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889

$4.612

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ChromeModa Solutions

Germany . 6,391 parts In-Stock

1+ parts

$4.706

100+ parts

$3.859

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6,391

$4.706

$3.859

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IDEA Electronic Components Group

UK . 1,694 parts In-Stock

1+ parts

$4.706

100+ parts

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$4.235

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1,694

$4.706

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$4.235

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AZTECH Wire

Italy . 667 parts In-Stock

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$17.669

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667

$17.669

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One Stop Electronics

USA . 1,153 parts In-Stock

1+ parts

$25.000

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1,153

$25.000

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Corphita

USA . 2,616 parts In-Stock

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2,616

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Overview

Upgrade your electronics with the high-quality SN74ACT2236-40PAG by Texas Instruments. Designed for applications requiring fast data transfer, this FIFO device offers unparalleled reliability and performance. With Texas Instruments' reputation for excellence in semiconductor manufacturing, you can trust that this product will meet your needs with precision and efficiency. Whether you're working on telecommunications equipment, industrial automation systems, or consumer electronics, this FIFO device provides the value, benefits, and advantages you need to stay ahead of the competition. Trust Texas Instruments for superior technology solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material ensures durability and protection for the internal components.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on PCBs, saving space and simplifying assembly.

Package Shape: SQUARE

The square package shape provides uniformity and efficient use of space on the circuit board.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures synchronized data transfers, enhancing overall system performance.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage is common and readily available in many applications, making integration easier.

No. of Terminals: 64

With 64 terminals, this FIFO product can handle multiple data inputs and outputs efficiently.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The flatpack, thin profile, and fine pitch package style allows for high-density mounting and optimal use of board space.

Organization: 2KX9

The 2Kx9 organization provides a balance between storage capacity and efficient data retrieval for various applications.

Output Characteristics: 3-STATE

The 3-state output characteristics enable the device to drive multiple loads, offering flexibility in system design.

Terminal Position: QUAD

The quad terminal position facilitates easy connection and ensures secure placement on the PCB.

Maximum Seated Height: 1.2 mm

The low seated height of 1.2mm minimizes space requirements and enhances compatibility with compact designs.

Width: 10 mm

The 10mm width offers a compact form factor, suitable for applications where space is limited.

Length: 10 mm

With a length of 10mm, this FIFO product maintains a square shape for consistent and efficient board layout.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption, high-speed operation, and reliability in data processing.

Parallel or Serial: PARALLEL

The parallel configuration enables fast data transfer between the FIFO and other components, ideal for demanding applications.

Terminal Form: GULL WING

The gull wing terminal form offers mechanical stability and easy soldering during assembly, enhancing overall product reliability.

No. of Words: 2048 words

With a capacity of 2048 words, this FIFO product can handle a significant amount of data for diverse computing tasks.

Memory Width: 9

The 9 memory width allows for efficient data storage and retrieval, contributing to overall system performance.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch offers a fine pitch design, enabling high-density mounting and improved signal integrity.

No. of Words Code: 2K

The 2K words code signifies the product's high data storage capacity, meeting the requirements of data-intensive applications.

Memory Density: 18432 bit

With a memory density of 18432 bits, this FIFO product can efficiently store and retrieve data, supporting complex computing tasks.

Technical Specifications

FIFO SN74ACT2236-40PAG attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Memory Density:

18432 bit

Memory Width:

9

No. of Functions:

1

No. of Terminals:

64

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

SYNCHRONOUS

Organization:

2KX9

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

SN74ACT2236-40PAG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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