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SN74ABT7815-15PCB

Texas Instruments

SN74ABT7815-15PCB by Texas Instruments

SN74ABT7815-15PCB by Texas Instruments is a 128x36 bi-directional FIFO memory IC with a max clock frequency of 67 MHz. Operating at 5V, it has a max access time of 10 ns and operates in synchronous mode. This device is ideal for applications requiring fast data transfer and storage in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,327 parts In-Stock

1+ parts

-

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4,327

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Digiode

USA . 3,332 parts In-Stock

1+ parts

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3,332

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,076 parts In-Stock

1+ parts

$3.111

100+ parts

-

1k+ parts

$3.630

10k+ parts

-

2,076

$3.111

-

$3.630

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ChromeModa Solutions

Germany . 5,423 parts In-Stock

1+ parts

$3.495

100+ parts

$2.866

1k+ parts

-

10k+ parts

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5,423

$3.495

$2.866

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IDEA Electronic Components Group

UK . 2,283 parts In-Stock

1+ parts

$3.495

100+ parts

-

1k+ parts

$3.146

10k+ parts

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2,283

$3.495

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$3.146

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One Stop Electronics

USA . 140 parts In-Stock

1+ parts

$12.000

100+ parts

-

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140

$12.000

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AZTECH Wire

Italy . 542 parts In-Stock

1+ parts

$12.776

100+ parts

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542

$12.776

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Corphita

USA . 3,950 parts In-Stock

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3,950

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DigiPath Technology Company

USA . 845 parts In-Stock

1+ parts

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100+ parts

$3.151

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845

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$3.151

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Overview

Unlock the power of seamless data transfer with the SN74ABT7815-15PCB FIFO from Texas Instruments. Designed with precision and reliability in mind, this innovative device offers unmatched performance for a wide range of applications. With a focus on quality and efficiency, Texas Instruments has crafted a product that delivers exceptional value to customers looking for high-speed data storage solutions. Ideal for synchronous operations, this FIFO boasts a 128x36 organization and a maximum clock frequency of 67 MHz, making it perfect for demanding commercial environments. Trust Texas Instruments to provide cutting-edge technology that meets your needs with ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product, making it suitable for various applications.

Surface Mount: YES

The surface mount feature makes installation and integration of the product easier and more compact, saving space on the PCB.

Operating Mode: SYNCHRONOUS

The synchronous operation mode allows for precise and coordinated data transfer, enhancing overall system efficiency.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage ensures compatibility with standard power sources, making the product versatile and easy to use.

Maximum Clock Frequency (fCLK): 67 MHz

The high clock frequency enables fast data processing and transfer speeds, making the product suitable for high-performance applications.

Memory IC Type: BI-DIRECTIONAL FIFO

The bi-directional FIFO memory type allows for efficient data storage and retrieval in both directions, enhancing overall system functionality.

Technical Specifications

FIFO SN74ABT7815-15PCB attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

10 ns

Maximum Clock Frequency (fCLK):

67 MHz

JESD-30 Code:

S-PQFP-G120

Memory IC Type:

Memory Width:

36

No. of Terminals:

120

No. of Words:

128 words

No. of Words Code:

128

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

128X36

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP120,.63SQ,16

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

FIFOs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74ABT7815-15PCB Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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