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SN74ACT2236-60PAG

Texas Instruments

SN74ACT2236-60PAG by Texas Instruments

SN74ACT2236-60PAG by Texas Instruments is a 64-terminal FIFO with 2Kx9 organization, operating at 5V. It features a flatpack, thin profile package and offers 3-state output characteristics. Ideal for synchronous applications requiring high memory density and parallel data transfer in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,924 parts In-Stock

1+ parts

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6,924

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Digiode

USA . 2,833 parts In-Stock

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2,833

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 117 parts In-Stock

1+ parts

$4.426

100+ parts

-

1k+ parts

$4.850

10k+ parts

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117

$4.426

-

$4.850

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DigiPath Technology Company

USA . 2,106 parts In-Stock

1+ parts

$4.874

100+ parts

$4.484

1k+ parts

-

10k+ parts

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2,106

$4.874

$4.484

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ChromeModa Solutions

Germany . 5,456 parts In-Stock

1+ parts

$4.973

100+ parts

$4.078

1k+ parts

-

10k+ parts

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5,456

$4.973

$4.078

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IDEA Electronic Components Group

UK . 1,876 parts In-Stock

1+ parts

$4.973

100+ parts

-

1k+ parts

$4.476

10k+ parts

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1,876

$4.973

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$4.476

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One Stop Electronics

USA . 354 parts In-Stock

1+ parts

$15.000

100+ parts

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354

$15.000

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AZTECH Wire

Italy . 475 parts In-Stock

1+ parts

$15.725

100+ parts

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475

$15.725

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Corphita

USA . 1,147 parts In-Stock

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1,147

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Overview

Experience seamless data processing with the SN74ACT2236-60PAG FIFO by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability. This FIFO device is perfect for applications requiring synchronous operation and features a 3-STATE output for added flexibility. With a memory width of 9 and a memory density of 18432 bits, this product offers high performance and efficiency. Upgrade your system with the SN74ACT2236-60PAG and enjoy faster data transfer and improved overall functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the FIFO, ensuring reliable operation.

Surface Mount: YES

Easy integration onto PCBs without the need for additional components or connectors.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise timing and coordination of data transfer, reducing the risk of errors.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage requirement makes it compatible with common power sources.

No. of Terminals: 64

Sufficient terminals for connecting to other components and systems, enabling versatile usage.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

Compact design with fine pitch terminals saves space and allows for high-density PCB layouts.

Organization: 2KX9

Efficient organization of memory cells for storing and retrieving data in a structured manner.

Output Characteristics: 3-STATE

Three-state outputs provide flexibility in controlling the flow of data, enhancing functionality.

Maximum Seated Height: 1.2 mm

Low profile design minimizes physical footprint and facilitates integration in space-constrained applications.

Width: 10 mm

Compact width dimension fits well within standard PCB layouts, optimizing board space usage.

Length: 10 mm

Square shape with equal length and width dimensions simplifies mounting and alignment on the PCB.

Technology: CMOS

CMOS technology offers low power consumption and high speed performance for efficient data processing.

Parallel or Serial: PARALLEL

Parallel data transfer enables simultaneous handling of multiple bits, leading to faster throughput.

Terminal Form: GULL WING

Gull wing terminals provide secure soldering connections and ease of assembly on PCBs.

No. of Words: 2048 words

Ample storage capacity for retaining a large amount of data within the FIFO buffer.

Memory Width: 9

Wide memory width allows for parallel processing of data, enhancing performance efficiency.

Terminal Pitch: 0.5 mm

Fine terminal pitch distance enables high-density packaging and precise interconnection with other components.

No. of Words Code: 2K

Indicates the specific memory capacity of the FIFO, helping in system integration and compatibility.

Memory Density: 18432 bit

High memory density enables storage of a large volume of data in a compact form factor, improving data handling capabilities.

Technical Specifications

FIFO SN74ACT2236-60PAG attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Memory Density:

18432 bit

Memory Width:

9

No. of Functions:

1

No. of Terminals:

64

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

SYNCHRONOUS

Organization:

2KX9

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

SN74ACT2236-60PAG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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