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SN74ABT3613-30PCB

Texas Instruments

SN74ABT3613-30PCB by Texas Instruments

SN74ABT3613-30PCB by Texas Instruments is a FIFO memory with 64x36 organization, 30 ns cycle time, and 33.4 MHz clock frequency. It operates synchronously at 5V and has a low profile flatpack package suitable for commercial temperature grade applications.

Median Price

$18.150

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 899 parts In-Stock

1+ parts

-

100+ parts

$18.150

1k+ parts

-

10k+ parts

-

899

-

$18.150

-

-

Rochester

USA . 884 parts In-Stock

1+ parts

-

100+ parts

$15.710

1k+ parts

$14.060

10k+ parts

$13.230

884

-

$15.710

$14.060

$13.230

Verical

USA . 238 parts In-Stock

1+ parts

-

100+ parts

$19.637

1k+ parts

$17.575

10k+ parts

$16.538

238

-

$19.637

$17.575

$16.538

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,791 parts In-Stock

1+ parts

$16.578

100+ parts

-

1k+ parts

-

10k+ parts

-

1,791

$16.578

-

-

-

Vyrian

USA . 2,977 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,977

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,351 parts In-Stock

1+ parts

$4.976

100+ parts

-

1k+ parts

$5.523

10k+ parts

-

2,351

$4.976

-

$5.523

-

ChromeModa Solutions

Germany . 222 parts In-Stock

1+ parts

$5.591

100+ parts

$4.585

1k+ parts

-

10k+ parts

-

222

$5.591

$4.585

-

-

IDEA Electronic Components Group

UK . 36 parts In-Stock

1+ parts

$5.591

100+ parts

-

1k+ parts

$5.032

10k+ parts

-

36

$5.591

-

$5.032

-

Corphita

USA . 2,230 parts In-Stock

1+ parts

$15.705

100+ parts

-

1k+ parts

-

10k+ parts

-

2,230

$15.705

-

-

-

Component Stockers USA

USA . 1,550 parts In-Stock

1+ parts

$17.650

100+ parts

$16.590

1k+ parts

-

10k+ parts

-

1,550

$17.650

$16.590

-

-

Microchip USA

USA . 230 parts In-Stock

1+ parts

$50.820

100+ parts

$50.090

1k+ parts

$49.730

10k+ parts

$49.370

230

$50.820

$50.090

$49.730

$49.370

DigiPath Technology Company

USA . 72 parts In-Stock

1+ parts

-

100+ parts

$5.041

1k+ parts

-

10k+ parts

-

72

-

$5.041

-

-

Overview

Experience seamless data transfer with the Texas Instruments SN74ABT3613-30PCB FIFO memory IC. Designed with precision and reliability in mind, this high-quality product offers a fast cycle time of 30 ns and operates at a nominal supply voltage of 5V. Perfect for applications requiring synchronous operation, this FIFO memory IC boasts a memory density of 2304 bits and features a bi-directional design. Whether you're working on telecommunications equipment or industrial automation systems, this versatile component provides excellent value and performance for your projects. Trust Texas Instruments to deliver top-notch products that meet your needs effortlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components of the FIFO, ensuring reliable operation.

Cycle Time: 30 ns

With a fast cycle time of 30 ns, this FIFO can efficiently handle data transfer operations, making it suitable for high-speed applications.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures precise timing and coordination of data transfers within the FIFO, enhancing overall system performance.

Output Characteristics: 3-STATE

The 3-STATE output characteristics allow the FIFO to drive multiple loads, increasing flexibility and compatibility within the system.

Technology: BICMOS

The BICMOS technology used in this FIFO combines the advantages of both bipolar and CMOS technologies, offering a balance of speed and power efficiency.

Memory IC Type: BI-DIRECTIONAL FIFO

The bi-directional FIFO design enables simultaneous read and write operations, improving data throughput and efficiency in data handling.

Technical Specifications

FIFO SN74ABT3613-30PCB attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

15 ns

Additional Features:

PARITY GENERATOR/CHECKER; MAILBOX

Maximum Clock Frequency (fCLK):

33.4 MHz

Cycle Time:

30 ns

JESD-30 Code:

S-PQFP-G120

Length:

14 mm

Memory Density:

2304 bit

Memory IC Type:

Memory Width:

36

No. of Functions:

1

No. of Terminals:

120

No. of Words:

64 words

No. of Words Code:

64

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

64X36

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP120,.63SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

FIFOs

Maximum Supply Current:

130 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Trade Compliance

SN74ABT3613-30PCB Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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