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74HC7403D

Philips Semiconductors

74HC7403D by Philips Semiconductors

OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,926 parts In-Stock

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Anansix

USA . 2,397 parts In-Stock

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Digiode

USA . 1,372 parts In-Stock

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ComSIT Distribution GmbH

Germany . 254 parts In-Stock

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Resion

USA . 44 parts In-Stock

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One Stop Electronics

USA . 1,479 parts In-Stock

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$30.000

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Kepictronics

USA . 6,000 parts In-Stock

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Corphita

USA . 4,797 parts In-Stock

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UNI Independent Distributors

Spain . 2,100 parts In-Stock

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Northwest PG Solutions

USA . 1,833 parts In-Stock

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$4.776

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Perfect Parts

USA . 1,154 parts In-Stock

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Native Components

USA . 370 parts In-Stock

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$4.727

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Robosynatics

Brazil . 100 parts In-Stock

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$3.896

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$3.608

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$3.608

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Lucentia Tech

USA . 100 parts In-Stock

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$3.896

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$3.608

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$3.608

100

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Technical Specifications

FIFO 74HC7403D attributes and parameters. Explore more FIFO devices from Philips Semiconductors

Specs

Maximum Access Time:

98 ns

Maximum Clock Frequency (fCLK):

12 MHz

JESD-30 Code:

R-PDSO-G16

Memory IC Type:

Memory Width:

4

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

16

No. of Words:

64 words

No. of Words Code:

64

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64X4

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Sub-Category:

FIFOs

Maximum Supply Current:

1 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

74HC7403D Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Philips Semiconductors

In September 2006, Philips completed the sale of an 80.1% stake in Philips Semiconductors to a consortium of private equity investors consisting of KKR, Bain Capital, Silver Lake Partners, Apax Partners and AlpInvest Partners. The new company name NXP (from Next eXPerience) was announced on August 31, 2006, and the company was officially launched during the Internationale Funkausstellung (IFA) consumer electronics show in Berlin. The newly independent NXP was ranked as one of the world's top 10 semiconductor companies

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