Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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SNJ54ALS229AJ by Texas Instruments is a FIFO with 16x5 organization, 80-bit memory density, and 35ns max access time. It operates synchronously at 5V and is ideal for military-grade applications requiring fast data storage and retrieval.
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Corphita
This material ensures durability and reliability, making the product suitable for harsh environments.
Fast cycle time allows for efficient data handling and processing.
Synchronous operation ensures accurate and coordinated data transfer.
Standard supply voltage for easy integration with existing systems.
Can withstand high temperatures, suitable for demanding applications.
CMOS technology offers low power consumption and high noise immunity.
Output enable feature provides flexibility in controlling data output.
FIFO SNJ54ALS229AJ attributes and parameters. Explore more FIFO devices from Texas Instruments
Maximum Access Time:
Additional Features:
Cycle Time:
JESD-30 Code:
Length:
Memory Density:
Memory IC Type:
Memory Width:
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Output Enable:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
Screening Level:
Maximum Seated Height:
Sub-Category:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Temperature Grade:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
SNJ54ALS229AJ Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
LL4148
Transys Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
M39029/58-360
Carlisle Interconnect Technologies
GENERAL CONN ACCESSORY; Associated Military - Specifications: MIL-C-55302/69, MIL-C-38999; Maximum Operating Temperature: 200 Cel; MIL-Connector Accessory: CONTACT; Terminal Type: CRIMP; MIL Conformity: YES;
1N4148WS
General Instrument
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Weitronic Enterprise
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
FDC5614P
Onsemi
FDC5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 20A Max IDM and 0.105 ohm RDS(ON), operating in ENHANCEMENT MODE at -55 to 150 °C. This SMALL OUTLINE transistor has a built-in diode, GULL WING terminals, and METAL-OXIDE SEMICONDUCTOR technology.
NE555/D
General Electric Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; Maximum Operating Temperature: 70 Cel; Technology: BIPOLAR; Package Equivalence Code: DIE OR CHIP; Qualification: Not Qualified;
OPA2227UA
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
Sensitron Semiconductor
261
Mercury Systems
Other Interface ICs; Temperature Grade: MILITARY; Terminal Form: FLAT; No. of Terminals: 14; Package Code: DFP; Package Shape: SQUARE;
BAV99
Nexperia
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
FDLL4148
FDLL4148 by Onsemi is a single rectifier diode with a max reverse recovery time of 0.004 us. With a max forward voltage of 1V and output current of 0.2A, it is ideal for applications requiring fast switching speeds in electronic circuits. The diode's glass package body material and isolated case connection make it suitable for surface mount designs operating at temperatures up to 175°C.
DS18B20Z
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Housing: PLASTIC; Maximum Accuracy (Cel): 0.50;
BSS138
Zetex Plc
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Style (Meter): SMALL OUTLINE; Maximum Operating Temperature: 150 Cel;
SS14
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
OPA2277UA/2K5
Texas Instruments
OPA2277UA/2K5 by Texas Instruments is a dual operational amplifier with low offset voltage of 100 uV and micropower consumption of 0.004 uA. Ideal for industrial applications, it offers high common mode rejection ratio of 140 dB and unity gain bandwidth of 1 MHz. With a compact rectangular package style, it is suitable for surface mount designs in various electronic systems.
OHN3020U
Optek Technology
MAGNETIC FIELD SENSOR,HALL EFFECT; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Output Type: ANALOG CURRENT; Package Shape or Style: RECTANGULAR; Output Range: 25mA;
SMBJ18CA
Changzhou Starsea Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Philips Components
LM555CMX
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
IRLML6401TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Minimum Operating Temperature: -55 Cel; Avalanche Energy Rating (EAS): 33 mJ;
5962-9560901QYA
The Texas Instruments 5962-9560901QYA is a MILITARY-grade BI-DIRECTIONAL FIFO memory IC with 64x36 organization, 20 ns cycle time, and 50 MHz clock frequency. It operates synchronously at -55 to 125 °C and is ideal for high-speed data buffering in military applications.
SN74ACT3641-30PCB
SN74ACT3641-30PCB by Texas Instruments is a FIFO memory IC with 1Kx36 organization, operating at 30ns cycle time and 33.4MHz clock frequency. It is designed for parallel applications requiring fast data access and features a 5V nominal voltage.
IDT7208L25JGI8
Integrated Device Technology
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Seated Height: 3.55 mm;
72V02L15JG
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCN; Package Shape: RECTANGULAR; Maximum Seated Height: 2.79 mm;
SN74ACT3631-30PCB
SN74ACT3631-30PCB by Texas Instruments is a FIFO with 512x36 organization, 30 ns cycle time, and 33.4 MHz max clock frequency. It operates synchronously at 5V and is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
IDT7203L15PI
IDT7203L15PI by Integrated Device Technology is a FIFO memory chip with 2Kx9 organization, operating at 40 MHz clock frequency. It has a cycle time of 25 ns and can function in industrial temperature ranges. This chip is suitable for applications requiring fast data storage and retrieval in parallel processing systems.
72V275L10TFG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;
5962-9560901NXD
The Texas Instruments 5962-9560901NXD FIFO operates synchronously at a clock frequency of up to 50 MHz with a cycle time of 20 ns. It features a memory width of 36 bits and a density of 36864 bits, making it ideal for military-grade applications requiring fast data processing and storage in harsh environments. The device is designed for parallel operation with low power consumption and high reliability, suitable for critical military systems where speed and efficiency are paramount.
SN74ACT3641-30PQR
SN74ACT3641-30PQR by Texas Instruments is a FIFO with 1KX36 organization, 30 ns cycle time, and 5V nominal voltage. It is used in applications requiring fast synchronous operation and 3-STATE output characteristics. Ideal for commercial temperature grade environments, this device offers parallel access with a memory width of 36 bits.
SN74ACT7206L25RJ
SN74ACT7206L25RJ by Texas Instruments is a FIFO chip with 16Kx9 organization, operating at 28.5 MHz clock frequency and 35 ns cycle time. It is designed for parallel data transfer applications requiring fast access times and operates on a supply voltage of 4.5V to 5.5V in commercial temperature grades.
SN74ACT7200L-50DVR
SN74ACT7200L-50DVR by Texas Instruments is a FIFO with 256x9 organization, 65 ns cycle time, and 3-STATE output characteristics. It operates asynchronously at a nominal voltage of 5V. This device is commonly used in applications requiring fast data storage and retrieval with parallel access.
72V261LA10TFG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Length: 10 mm;
IDT7201LA12PDG
Renesas Electronics
The Renesas Electronics IDT7201LA12PDG is a FIFO memory chip with 512x9 organization, operating at 50 MHz clock frequency. It features a cycle time of 20 ns and operates on a nominal voltage of 5V. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN74ABT7820-15PNR
SN74ABT7820-15PNR by Texas Instruments is a FIFO with 512x18 organization, operating at 5V. It features a cycle time of 15ns, synchronous mode, and 3-STATE output characteristics. Ideal for applications requiring fast data transfer and storage in commercial temperature environments.
SN74ACT2235-60FNR
SN74ACT2235-60FNR by Texas Instruments is a FIFO chip with 1Kx9 organization, operating at 60 ns cycle time. It features 3-STATE output characteristics and operates in parallel mode. This chip is commonly used in applications requiring fast data storage and retrieval with a memory density of 9216 bits.
CD74HCT40105M
Thomson Consumer Electronics
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; JESD-609 Code: e4;
72V255LA10PFG8
The Renesas Electronics 72V255LA10PFG8 FIFO features a cycle time of 10 ns, operating at a max clock frequency of 100 MHz. With an organization of 8KX18, it is suitable for applications requiring fast data processing and synchronization. This FIFO operates on a nominal voltage of 3.3 V and has a memory density of 147456 bit, making it ideal for commercial-grade projects with parallel data transfer needs.
CD74HC40105M
Intersil
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 10 MHz;
SN74ACT2226DWR
SN74ACT2226DWR by Texas Instruments is a FIFO with 64x1 organization, operating at 60MHz clock frequency. It has a cycle time of 45.45ns and can function in industrial temperature grades. This device is ideal for applications requiring high-speed data storage and retrieval in compact electronic systems.
SN74ACT7206L-25DV
SN74ACT7206L-25DV by Texas Instruments is a 16Kx9 FIFO with 35ns cycle time, operating at 5V. It features a max clock frequency of 28.5MHz and offers 3-STATE output characteristics. Ideal for applications requiring fast data transfer and storage in commercial temperature environments.
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DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
SNJ54ALS232AFK
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 20; Package Code: QCCN; Package Shape: SQUARE; Operating Mode: SYNCHRONOUS;
SNJ54ACT3641HFP
BI-DIRECTIONAL FIFO; Temperature Grade: MILITARY; No. of Terminals: 132; Package Code: QFF; Package Shape: SQUARE; Terminal Form: FLAT;
SNJ54ABT7819GB
BI-DIRECTIONAL FIFO; Temperature Grade: MILITARY; No. of Terminals: 84; Package Code: PGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
SNJ54ALS229AFK
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 20; Package Code: QCCN; Package Shape: SQUARE; Output Enable: YES;
SNJ54ACT7881HV
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 68; Package Code: QFF; Package Shape: SQUARE; Power Supplies (V): 5;
SNJ54ACT3632HFP
BI-DIRECTIONAL FIFO; Temperature Grade: MILITARY; No. of Terminals: 132; Package Code: QFP; Package Shape: SQUARE; Cycle Time: 20 ns;
SNJ54ALS232AJ
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Package Equivalence Code: DIP16,.3;
SNJ54ABT3614HFPR
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 132; Package Code: QFP; Package Shape: SQUARE; Width: 24.13 mm;
SNJ54ACT3641PCB
BI-DIRECTIONAL FIFO; Temperature Grade: MILITARY; No. of Terminals: 120; Package Code: QFP; Package Shape: SQUARE; JESD-30 Code: S-PQFP-G120;
SNJ54ABT7819HT
BI-DIRECTIONAL FIFO; Temperature Grade: MILITARY; No. of Terminals: 84; Package Code: QFP; Package Shape: SQUARE; Maximum Access Time: 12 ns;
SNJ54ACT7881PNR
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 80; Package Code: LFQFP; Package Shape: SQUARE; Maximum Operating Temperature: 125 Cel;
SNJ54ACT7881HVR
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 68; Package Code: QFF; Package Shape: SQUARE; Parallel or Serial: PARALLEL;
SNJ54ABT7820GB
BI-DIRECTIONAL FIFO; Temperature Grade: MILITARY; No. of Terminals: 84; Package Code: PGA; Package Shape: SQUARE; Terminal Pitch: 2.54 mm;
SNJ54ABT3614PCBR
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 120; Package Code: HLFQFP; Package Shape: SQUARE; Maximum Seated Height: 1.6 mm;
SNJ54ACT3632HFPR
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 132; Package Code: QFP; Package Shape: SQUARE; Parallel or Serial: PARALLEL;
SNJ54ABT3614HFP
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 132; Package Code: QFP; Package Shape: SQUARE; Length: 24.13 mm;
SNJ54ABT3614PCB
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 120; Package Code: HLFQFP; Package Shape: SQUARE; Terminal Form: GULL WING;
SNJ54ABT7819HTR
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 84; Package Code: QFP; Package Shape: SQUARE; Length: 16.51 mm;
SNJ54ACT7881PN
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 80; Package Code: LFQFP; Package Shape: SQUARE; Package Body Material: CERAMIC, METAL-SEALED COFIRED;
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