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SN74LS600N3

Texas Instruments

SN74LS600N3 by Texas Instruments

SN74LS600N3 by Texas Instruments is a Memory Controller with 20 terminals, operating at 5V. It has a max supply current of 85mA and operates b/w 0-70°C. Ideal for commercial applications requiring TTL technology in an in-line package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,109 parts In-Stock

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8,109

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Digiode

USA . 2,252 parts In-Stock

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2,252

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 240 parts In-Stock

1+ parts

$7.101

100+ parts

-

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240

$7.101

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One Stop Electronics

USA . 248 parts In-Stock

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$24.000

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248

$24.000

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Parana Technologies

USA . 2,366 parts In-Stock

1+ parts

$31.336

100+ parts

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$77.520

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2,366

$31.336

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$77.520

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DigiPath Technology Company

USA . 1,747 parts In-Stock

1+ parts

$34.505

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1,747

$34.505

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ChromeModa Solutions

Germany . 6,430 parts In-Stock

1+ parts

$35.209

100+ parts

$28.871

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6,430

$35.209

$28.871

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IDEA Electronic Components Group

UK . 977 parts In-Stock

1+ parts

$35.209

100+ parts

$33.449

1k+ parts

$31.688

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977

$35.209

$33.449

$31.688

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Corohmni

South Africa . 5,173 parts In-Stock

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$55.069

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5,173

$55.069

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Corphita

USA . 356 parts In-Stock

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356

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Overview

Enhance your electronic projects with the SN74LS600N3 by Texas Instruments, a superior quality memory controller that offers unmatched reliability and precision. Manufactured by one of the industry leaders, this product ensures top-notch performance and durability. Ideal for a wide range of applications, this component provides exceptional value to customers looking for high-quality solutions for their projects. Unlock endless possibilities and elevate your designs with the SN74LS600N3 from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material is durable and lightweight, making the memory controller easy to handle and less prone to damage during handling or installation.

Power Supplies (V): 5

Operating at a standard voltage of 5V ensures compatibility with a wide range of systems and devices, making this memory controller versatile and easily integrable.

No. of Terminals: 20

Having 20 terminals allows for a sufficient number of connections, enabling the memory controller to interface with various components and peripherals effectively.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this memory controller can withstand high levels of heat, ensuring reliable performance even in demanding environments.

Technology: TTL

Utilizing TTL technology ensures fast and efficient data transmission, contributing to the overall speed and responsiveness of the memory controller.

Technical Specifications

Memory Controllers SN74LS600N3 attributes and parameters. Explore more Memory Controllers devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T20

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Sub-Category:

Memory Controllers

Maximum Supply Current:

85 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74LS600N3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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