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SN74ALS2967FN3

Texas Instruments

SN74ALS2967FN3 by Texas Instruments

SN74ALS2967FN3 by Texas Instruments is a Memory Controller with 68 terminals, operating at 5V. It features TTL technology, J Bend terminal form, and supports a max supply current of 200mA. Ideal for commercial applications requiring a temperature range of 0-70°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,882 parts In-Stock

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6,882

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Digiode

USA . 3,445 parts In-Stock

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3,445

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 337 parts In-Stock

1+ parts

$8.000

100+ parts

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337

$8.000

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AZTECH Wire

Italy . 481 parts In-Stock

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$9.971

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481

$9.971

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Corohmni

South Africa . 232 parts In-Stock

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$40.003

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232

$40.003

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Parana Technologies

USA . 788 parts In-Stock

1+ parts

$55.668

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788

$55.668

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IDEA Electronic Components Group

UK . 1,870 parts In-Stock

1+ parts

$62.548

100+ parts

$59.421

1k+ parts

$56.293

10k+ parts

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1,870

$62.548

$59.421

$56.293

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ChromeModa Solutions

Germany . 14 parts In-Stock

1+ parts

$62.548

100+ parts

$51.289

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14

$62.548

$51.289

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Corphita

USA . 3,379 parts In-Stock

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DigiPath Technology Company

USA . 1,418 parts In-Stock

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$56.393

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1,418

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$56.393

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Overview

Unlock the power of advanced memory control with the SN74ALS2967FN3 by Texas Instruments. Trust in the industry-leading quality and reliability that comes with every product from Texas Instruments, a brand known for delivering top-notch technology solutions. This memory controller is perfect for a wide range of applications, offering unparalleled value and benefits to customers looking for seamless integration and high performance. Upgrade your systems with the SN74ALS2967FN3 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the memory controller easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for compact and efficient placement of the memory controller on a circuit board.

Screening Level: 38535Q/M;38534H;883B

The high screening level ensures reliability and quality control in the manufacturing process of the memory controller.

Package Shape: SQUARE

The square shape of the package maximizes space efficiency when integrating the memory controller into a design.

Power Supplies (V): 5

Operating at 5 volts allows for compatibility with a wide range of electronic devices and systems.

No. of Terminals: 68

Having 68 terminals provides flexibility in connecting the memory controller to various other components in a system.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers efficient heat dissipation and protection for the memory controller.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the memory controller can withstand harsh environmental conditions.

Minimum Operating Temperature: 0 °C

The memory controller can function effectively in a wide range of temperatures, making it versatile for different applications.

Terminal Position: QUAD

The quad terminal position allows for easy installation and maintenance of the memory controller in a circuit.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable performance in typical commercial applications.

Technology: TTL

TTL technology offers fast switching speeds and low power consumption, enhancing the efficiency of the memory controller.

Terminal Form: J BEND

The J bend terminal form simplifies soldering and connection of the memory controller to a circuit board.

Maximum Supply Current: 200 mA

The maximum supply current of 200 mA ensures stable power delivery to the memory controller for optimal performance.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 volts is a standard voltage level in electronic systems, ensuring compatibility and ease of integration.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27 mm allows for high-density mounting of the memory controller in a compact space.

Technical Specifications

Memory Controllers SN74ALS2967FN3 attributes and parameters. Explore more Memory Controllers devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J68

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Memory Controllers

Maximum Supply Current:

200 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SN74ALS2967FN3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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