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SN74LS601N

Texas Instruments

SN74LS601N by Texas Instruments

SN74LS601N by Texas Instruments is a TTL memory controller with 20 terminals and a 5V supply voltage. It operates b/w 0-70°C, drawing a max current of 85mA. This rectangular package is ideal for commercial applications requiring reliable memory control in electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,675 parts In-Stock

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8,675

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Digiode

USA . 3,556 parts In-Stock

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3,556

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Distributors (Availability)

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AZTECH Wire

Italy . 756 parts In-Stock

1+ parts

$7.126

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756

$7.126

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Corohmni

South Africa . 3,208 parts In-Stock

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$20.888

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3,208

$20.888

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One Stop Electronics

USA . 1,086 parts In-Stock

1+ parts

$32.000

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1,086

$32.000

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Parana Technologies

USA . 769 parts In-Stock

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$76.988

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769

$76.988

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DigiPath Technology Company

USA . 1,378 parts In-Stock

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$84.773

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1,378

$84.773

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IDEA Electronic Components Group

UK . 2,140 parts In-Stock

1+ parts

$86.503

100+ parts

$82.178

1k+ parts

$77.853

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2,140

$86.503

$82.178

$77.853

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ChromeModa Solutions

Germany . 1,806 parts In-Stock

1+ parts

$86.503

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$70.932

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1,806

$86.503

$70.932

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Corphita

USA . 4,846 parts In-Stock

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4,846

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Assy Fe

Spain . 10 parts In-Stock

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Overview

Unlock the full potential of your electronic devices with the SN74LS601N by Texas Instruments, a high-quality memory controller designed to optimize performance and efficiency. Manufactured by a trusted industry leader, this product offers unparalleled reliability and durability for a wide range of applications. With its advanced technology and user-friendly design, the SN74LS601N delivers exceptional value and benefits to customers, ensuring smooth operation and seamless integration into any project. Elevate your electronics with this top-of-the-line component and experience superior results like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the memory controller lightweight and durable for long-term use.

Power Supplies (V): 5

Operating at 5 volts ensures compatibility with a wide range of devices and power sources.

No. of Terminals: 20

Having 20 terminals allows for multiple connections and versatility in integrating the memory controller with other components.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this memory controller can withstand high levels of heat without malfunctioning.

Technology: TTL

The use of TTL technology ensures fast and reliable data transmission, making this memory controller suitable for high-performance applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form makes it easy to securely mount the memory controller on a circuit board for stable operation.

Technical Specifications

Memory Controllers SN74LS601N attributes and parameters. Explore more Memory Controllers devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T20

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Memory Controllers

Maximum Supply Current:

85 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74LS601N Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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