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SN74ALS2968FN3

Texas Instruments

SN74ALS2968FN3 by Texas Instruments

SN74ALS2968FN3 by Texas Instruments is a Memory Controller with 68 terminals, operating at 5V. It features TTL technology, J Bend terminal form, and supports commercial temperature grade. This chip carrier package is ideal for applications requiring a max operating temperature of 70°C in a surface-mount configuration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,550 parts In-Stock

1+ parts

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5,550

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Digiode

USA . 1,738 parts In-Stock

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1,738

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 289 parts In-Stock

1+ parts

$5.419

100+ parts

-

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289

$5.419

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One Stop Electronics

USA . 1,026 parts In-Stock

1+ parts

$23.000

100+ parts

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1,026

$23.000

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Parana Technologies

USA . 2,050 parts In-Stock

1+ parts

$33.313

100+ parts

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$123.052

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2,050

$33.313

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$123.052

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DigiPath Technology Company

USA . 960 parts In-Stock

1+ parts

$36.681

100+ parts

$33.747

1k+ parts

-

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960

$36.681

$33.747

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IDEA Electronic Components Group

UK . 1,610 parts In-Stock

1+ parts

$37.430

100+ parts

$35.558

1k+ parts

$33.687

10k+ parts

-

1,610

$37.430

$35.558

$33.687

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ChromeModa Solutions

Germany . 308 parts In-Stock

1+ parts

$37.430

100+ parts

$30.693

1k+ parts

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308

$37.430

$30.693

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Corohmni

South Africa . 749 parts In-Stock

1+ parts

$55.795

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749

$55.795

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Corphita

USA . 4,808 parts In-Stock

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4,808

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Overview

Enhance your electronic designs with the SN74ALS2968FN3 by Texas Instruments, a top-quality memory controller that offers unmatched performance and reliability. Manufactured by the trusted brand Texas Instruments, this product guarantees superior functionality and durability. Ideal for a wide range of applications, this chip carrier package is perfect for those looking for high-quality memory controllers. Upgrade your projects with the SN74ALS2968FN3 today and experience the benefits of cutting-edge technology at its best.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes this product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easy integration onto circuit boards, saving space and simplifying the manufacturing process.

Screening Level: 38535Q/M; 38534H; 883B

The multiple screening levels ensure high reliability and quality standards for the product.

Package Shape: SQUARE

The square package shape is efficient for space utilization and placement on PCBs.

Power Supplies (V): 5

Operating at a standard voltage of 5V makes it compatible with a wide range of systems and applications.

No. of Terminals: 68

Having 68 terminals provides flexibility in connecting to various components and peripherals.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers good thermal performance and allows for easy heat dissipation.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can perform reliably in various environmental conditions.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures functionality even in low-temperature environments.

Terminal Position: QUAD

The quad terminal position provides stability and ease of connection in the circuit.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grades makes this product suitable for regular consumer electronics applications.

Technology: TTL

Utilizing TTL technology ensures compatibility with a wide range of digital systems and devices.

Terminal Form: J BEND

The J bend terminal form allows for secure and reliable connections in the circuit.

Maximum Supply Current: 200 mA

With a maximum supply current of 200mA, this product is designed to operate efficiently without drawing excessive power.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V is standard and widely compatible with many electronic systems.

Terminal Pitch: 1.27 mm

The fine terminal pitch of 1.27mm enables high-density mounting and precise connections on the PCB.

Technical Specifications

Memory Controllers SN74ALS2968FN3 attributes and parameters. Explore more Memory Controllers devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J68

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Memory Controllers

Maximum Supply Current:

200 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SN74ALS2968FN3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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