Loading...

SN74ALS6302JD

Texas Instruments

SN74ALS6302JD by Texas Instruments

SN74ALS6302JD by Texas Instruments is a MEMORY CONTROLLER IC with 1M X 16 memory organization. It operates at 5V, has an address bus width of 20, and supports up to 4 banks. This BIPOLAR technology chip is ideal for DRAM applications in commercial-grade devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,468 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,468

-

-

-

-

Digiode

USA . 1,053 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,053

-

-

-

-

J & M Industries LLC

USA . 1 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 257 parts In-Stock

1+ parts

$7.912

100+ parts

-

1k+ parts

-

10k+ parts

-

257

$7.912

-

-

-

One Stop Electronics

USA . 210 parts In-Stock

1+ parts

$8.000

100+ parts

-

1k+ parts

-

10k+ parts

-

210

$8.000

-

-

-

Corohmni

South Africa . 83 parts In-Stock

1+ parts

$17.181

100+ parts

-

1k+ parts

-

10k+ parts

-

83

$17.181

-

-

-

Parana Technologies

USA . 108 parts In-Stock

1+ parts

$40.382

100+ parts

$3,750.078

1k+ parts

$36.344

10k+ parts

-

108

$40.382

$3,750.078

$36.344

-

DigiPath Technology Company

USA . 1,326 parts In-Stock

1+ parts

$44.466

100+ parts

-

1k+ parts

-

10k+ parts

-

1,326

$44.466

-

-

-

ChromeModa Solutions

Germany . 3,689 parts In-Stock

1+ parts

$45.373

100+ parts

$37.206

1k+ parts

-

10k+ parts

-

3,689

$45.373

$37.206

-

-

IDEA Electronic Components Group

UK . 743 parts In-Stock

1+ parts

$45.373

100+ parts

$43.104

1k+ parts

$40.836

10k+ parts

-

743

$45.373

$43.104

$40.836

-

Corphita

USA . 3,191 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,191

-

-

-

-

Overview

Enhance your memory controller performance with the SN74ALS6302JD by Texas Instruments. Crafted with precision and reliability, this product offers seamless integration into a variety of applications. From industrial automation to consumer electronics, the SN74ALS6302JD delivers unmatched quality and efficiency. Trust in Texas Instruments' reputation for excellence and innovation. Unlock the full potential of your systems with this versatile and dependable memory controller. Experience the difference today.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material ensures durability and reliability for the memory controller.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in power supply options for the memory controller.

Address Bus Width: 20

With a wide address bus width of 20, this memory controller can handle large amounts of data efficiently.

Package Shape: RECTANGULAR

The rectangular package shape makes it easy to integrate this memory controller into various electronic devices.

No. of Terminals: 52

The high number of terminals allows for versatile connectivity options for the memory controller.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures that the memory controller can operate within a wide range of power supply voltages.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this memory controller can withstand relatively high temperatures without malfunctioning.

Minimum Operating Temperature: 0 °C

The ability to operate at temperatures as low as 0°C makes this memory controller suitable for various environmental conditions.

Terminal Position: DUAL

The dual terminal position allows for better stability and connectivity when installing the memory controller.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that this memory controller is suitable for typical commercial applications.

Maximum Supply Current: 220 mA

The maximum supply current of 220 mA ensures efficient power consumption for the memory controller.

Memory Organization: 1M X 16

The memory organization of 1M X 16 provides a good balance between storage capacity and data access speed for the memory controller.

No. of Banks: 4

Having 4 banks allows for efficient data storage and retrieval operations in the memory controller.

Terminal Pitch: 2.54 mm

The terminal pitch of 2.54 mm enables easy and secure connections for the memory controller.

Technical Specifications

Memory Controllers SN74ALS6302JD attributes and parameters. Explore more Memory Controllers devices from Texas Instruments

Specs

Address Bus Width:

20

Boundary Scan:

NO

External Data Bus Width:

0

JESD-30 Code:

R-CDIP-T52

Low Power Mode:

NO

Memory Organization:

1M X 16

No. of Banks:

4

No. of Terminals:

52

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Equivalence Code:

DIP52,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Memory Controllers

Maximum Supply Current:

220 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Trade Compliance

SN74ALS6302JD Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 19