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SN74ALS6301N3

Texas Instruments

SN74ALS6301N3 by Texas Instruments

SN74ALS6301N3 by Texas Instruments is a Memory Controller with 52 terminals, operating at 5V. It features TTL technology, 220mA max supply current, and operates b/w 0-70°C. This rectangular package is ideal for commercial applications requiring precise memory control.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,792 parts In-Stock

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Digiode

USA . 4,583 parts In-Stock

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4,583

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Distributors (Availability)

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AZTECH Wire

Italy . 427 parts In-Stock

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$7.702

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427

$7.702

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One Stop Electronics

USA . 176 parts In-Stock

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$22.000

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176

$22.000

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Corohmni

South Africa . 3,228 parts In-Stock

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$22.703

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Parana Technologies

USA . 955 parts In-Stock

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$46.188

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955

$46.188

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ChromeModa Solutions

Germany . 1,625 parts In-Stock

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$51.897

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$42.556

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$51.897

$42.556

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IDEA Electronic Components Group

UK . 1,447 parts In-Stock

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$51.897

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$49.302

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$46.707

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$51.897

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$46.707

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Corphita

USA . 4,103 parts In-Stock

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DigiPath Technology Company

USA . 1,040 parts In-Stock

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$46.790

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$46.790

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Overview

Elevate your electronic devices with the SN74ALS6301N3 by Texas Instruments, a top-tier memory controller that guarantees superior performance and reliability. As a trusted industry leader, Texas Instruments ensures that every product meets the highest standards of quality and innovation. This versatile device is ideal for a wide range of applications, offering customers unparalleled value and benefits. Upgrade your projects with the SN74ALS6301N3 and experience the advantages of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the memory controller lightweight and durable, making it suitable for various applications.

Power Supplies (V): 5

The 5V power supply ensures compatibility with standard power sources, making it convenient and easy to integrate into existing systems.

No. of Terminals: 52

Having 52 terminals provides versatility and flexibility in connecting the memory controller to other components, allowing for complex configurations and functionalities.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this memory controller can withstand higher temperature environments, ensuring reliable performance under varying conditions.

Technology: TTL

The TTL technology enhances signal integrity and reliability, ensuring accurate data transfer and communication between the memory controller and connected devices.

Technical Specifications

Memory Controllers SN74ALS6301N3 attributes and parameters. Explore more Memory Controllers devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T52

No. of Terminals:

52

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP52,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Sub-Category:

Memory Controllers

Maximum Supply Current:

220 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74ALS6301N3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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