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TMS4500A-25NL

Texas Instruments

TMS4500A-25NL by Texas Instruments

TMS4500A-25NL by Texas Instruments is a Memory Controller with 16-bit Address Bus, operating at 5V. It has 40 terminals in an IN-LINE package style. Suitable for DRAM memory control applications, it operates b/w 0-70°C temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,037 parts In-Stock

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Digiode

USA . 1,297 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 197 parts In-Stock

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$9.000

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197

$9.000

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AZTECH Wire

Italy . 195 parts In-Stock

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$12.885

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195

$12.885

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Corohmni

South Africa . 1,101 parts In-Stock

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$29.669

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$29.669

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Parana Technologies

USA . 1,456 parts In-Stock

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$46.813

100+ parts

$4,347.307

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$42.132

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1,456

$46.813

$4,347.307

$42.132

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DigiPath Technology Company

USA . 1,176 parts In-Stock

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$51.547

100+ parts

$47.423

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$51.547

$47.423

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ChromeModa Solutions

Germany . 4,747 parts In-Stock

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$52.599

100+ parts

$43.131

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4,747

$52.599

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IDEA Electronic Components Group

UK . 1,717 parts In-Stock

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$52.599

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$49.969

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$47.339

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$47.339

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Corphita

USA . 3,867 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the TMS4500A-25NL by Texas Instruments. This memory controller offers unparalleled quality and reliability, thanks to its renowned manufacturer. Ideal for a wide range of applications, this product provides seamless integration and superior performance. Experience enhanced functionality and efficiency with the TMS4500A-25NL, delivering exceptional value and benefits to customers seeking top-tier solutions for their projects. Embark on a journey towards innovation with Texas Instruments at your side.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in power input, ensuring compatibility with a wide range of systems.

Address Bus Width: 16

A wide address bus width of 16 allows for efficient communication between memory and other components, enhancing overall system performance.

Package Shape: RECTANGULAR

The rectangular shape makes for easy integration into circuit designs and PCB layouts, optimizing space utilization.

Power Supplies (V): 5

With a stable power supply of 5V, the memory controller operates reliably and consistently within specified parameters.

No. of Terminals: 40

The high number of terminals enables connectivity with multiple devices and peripherals, enhancing versatility in system configurations.

Package Style (Meter): IN-LINE

The in-line package style facilitates easy installation and maintenance, simplifying the overall assembly process.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures energy efficiency and helps prevent potential damage to the memory controller during operation.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature allows for reliable performance in a variety of environmental conditions, increasing the product's durability.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures that the memory controller can function effectively even in colder environments, improving overall reliability.

Terminal Position: DUAL

The dual terminal position enhances connectivity options and simplifies integration with other components, providing flexibility in system design.

Maximum Seated Height: 5.08 mm

The low maximum seated height allows for compact and space-efficient designs, especially in applications with size constraints.

Width: 15.24 mm

The moderate width of the memory controller enables easy placement on PCBs and facilitates efficient routing of traces for improved signal integrity.

Length: 52.455 mm

The length of the memory controller provides ample space for necessary components and connections, accommodating various system requirements.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures that the memory controller is suitable for standard operating conditions, making it a versatile choice for a wide range of applications.

Peripheral IC Type: MEMORY CONTROLLER, DRAM

The inclusion of both memory controller and DRAM peripheral IC types in one product enhances functionality and compatibility, offering comprehensive memory management solutions.

Technology: CMOS

The CMOS technology used in the memory controller provides low power consumption, high noise immunity, and compatibility with a wide range of systems and devices.

Terminal Form: THROUGH-HOLE

The through-hole terminal form ensures secure and reliable connections with the PCB, reducing the risk of disconnection or damage during handling or operation.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures consistent and stable power delivery to the memory controller, maintaining reliable performance under varying load conditions.

No. of Banks: 2

Having 2 banks allows for better memory management and organization, enabling efficient data storage and retrieval processes in the system.

Terminal Pitch: 2.54 mm

The standard terminal pitch of 2.54 mm facilitates easy soldering and connection with other components, enhancing overall system reliability and ease of assembly.

Technical Specifications

Memory Controllers TMS4500A-25NL attributes and parameters. Explore more Memory Controllers devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T40

Length:

52.455 mm

Low Power Mode:

NO

No. of Banks:

2

No. of Terminals:

40

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Memory Controllers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

15.24 mm

Peripheral IC Type:

Trade Compliance

TMS4500A-25NL Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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