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SN54LS601J

Texas Instruments

SN54LS601J by Texas Instruments

SN54LS601J by Texas Instruments is a Memory Controller with 20 terminals, operating at 5V. It features MILITARY grade temperature range from -55°C to 125°C. This TTL technology chip in CERAMIC package is ideal for military applications requiring reliable memory control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,973 parts In-Stock

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Digiode

USA . 2,782 parts In-Stock

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One Stop Electronics

USA . 498 parts In-Stock

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$13.000

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498

$13.000

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AZTECH Wire

Italy . 681 parts In-Stock

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$18.136

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Parana Technologies

USA . 243 parts In-Stock

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$56.390

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$56.390

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Corohmni

South Africa . 931 parts In-Stock

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$60.175

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931

$60.175

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DigiPath Technology Company

USA . 2,312 parts In-Stock

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$62.092

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$62.092

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ChromeModa Solutions

Germany . 4,103 parts In-Stock

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$63.359

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$51.954

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4,103

$63.359

$51.954

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IDEA Electronic Components Group

UK . 695 parts In-Stock

1+ parts

$63.359

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$60.191

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$57.023

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695

$63.359

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Corphita

USA . 3,895 parts In-Stock

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Overview

Discover the innovative SN54LS601J by Texas Instruments, a top-quality memory controller that offers unmatched reliability and performance. Manufactured with precision and expertise, this product is ideal for a wide range of applications, providing seamless operation and efficiency. With its MILITARY temperature grade and TTL technology, customers can trust in its durability and dependability. Experience the value and benefits of this product, designed to exceed expectations and enhance your projects. Choose the SN54LS601J for exceptional quality and excellence in memory control technology.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package body material provides excellent thermal performance, durability and reliability, making this product suitable for rugged environments.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy integration into various electronic systems and designs, providing versatility in application.

Power Supplies (V): 5

Operating at 5V provides standard voltage compatibility with many electronic devices, ensuring easy integration and power supply requirements.

No. of Terminals: 20

Having 20 terminals allows for multiple connections and interfaces, increasing the flexibility and functionality of the memory controller.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this memory controller can function reliably in high-temperature environments without performance degradation.

Minimum Operating Temperature: -55 °C

Capable of operating at temperatures as low as -55°C, this memory controller is suitable for use in a wide range of temperature conditions.

Temperature Grade: MILITARY

Military-grade temperature grade ensures that the memory controller can withstand extreme temperature variations and operate in harsh conditions.

Technology: TTL

Incorporating TTL technology ensures reliable and fast data transmission, making this memory controller ideal for high-speed applications.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard electronic systems and components, making integration seamless.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54mm, this memory controller allows for easy connections and reduces the risk of interference, enhancing overall performance.

Technical Specifications

Memory Controllers SN54LS601J attributes and parameters. Explore more Memory Controllers devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T20

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Memory Controllers

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN54LS601J Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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