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TIM99600N

Texas Instruments

TIM99600N by Texas Instruments

TIM99600N by Texas Instruments is a Memory Controller with 20 terminals, operating at 5V. It features TTL technology, 85mA max supply current, and temp range of 0-70°C. Ideal for commercial applications requiring precise memory control in a rectangular plastic package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,584 parts In-Stock

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4,584

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Digiode

USA . 1,906 parts In-Stock

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1,906

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 494 parts In-Stock

1+ parts

$17.306

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494

$17.306

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One Stop Electronics

USA . 1,163 parts In-Stock

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$22.000

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1,163

$22.000

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Parana Technologies

USA . 2,025 parts In-Stock

1+ parts

$23.758

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$24.386

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2,025

$23.758

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$24.386

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ChromeModa Solutions

Germany . 4,005 parts In-Stock

1+ parts

$26.694

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$21.889

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4,005

$26.694

$21.889

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IDEA Electronic Components Group

UK . 2,042 parts In-Stock

1+ parts

$26.694

100+ parts

$25.359

1k+ parts

$24.025

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2,042

$26.694

$25.359

$24.025

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Corohmni

South Africa . 2,895 parts In-Stock

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$47.494

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2,895

$47.494

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Corphita

USA . 1,228 parts In-Stock

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DigiPath Technology Company

USA . 964 parts In-Stock

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$24.067

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964

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$24.067

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Overview

Unlock the power of seamless memory control with the TIM99600N by Texas Instruments. This innovative memory controller offers unparalleled quality and reliability, backed by the trusted reputation of Texas Instruments. Ideal for a wide range of applications, this product provides users with the ultimate convenience and ease of use. Experience the value and benefits of efficient memory management with the TIM99600N, designed to enhance performance and streamline operations for all customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, ideal for portable or rugged applications.

Power Supplies (V): 5

Operating at a standard voltage of 5V ensures compatibility with a wide range of systems and devices.

No. of Terminals: 20

Having 20 terminals allows for connectivity to multiple memory devices or components, increasing versatility and functionality.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, this memory controller can function reliably in various environmental conditions.

Technology: TTL

Using TTL technology ensures fast and accurate data transfer, making the memory controller efficient and reliable.

Nominal Supply Voltage: 5 V

Having a nominal supply voltage of 5V simplifies the power requirements and integration of the memory controller into existing systems.

Technical Specifications

Memory Controllers TIM99600N attributes and parameters. Explore more Memory Controllers devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T20

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Memory Controllers

Maximum Supply Current:

85 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TIM99600N Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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