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SN74LS601AN

Texas Instruments

SN74LS601AN by Texas Instruments

SN74LS601AN by Texas Instruments is a Memory Controller with 8-bit Address Bus, operates at 5V, and supports DRAM technology. It has 20 terminals in an IN-LINE package style suitable for commercial applications requiring a max supply voltage of 5.25V and operating temperature range of 0-70°C.

Median Price

$8.600

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 640 parts In-Stock

1+ parts

-

100+ parts

$6.880

1k+ parts

$6.150

10k+ parts

$5.790

640

-

$6.880

$6.150

$5.790

DigiKey

USA . 640 parts In-Stock

1+ parts

-

100+ parts

$9.050

1k+ parts

-

10k+ parts

-

640

-

$9.050

-

-

Verical

USA . 640 parts In-Stock

1+ parts

-

100+ parts

$8.600

1k+ parts

$7.688

10k+ parts

$7.237

640

-

$8.600

$7.688

$7.237

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 868 parts In-Stock

1+ parts

$7.258

100+ parts

-

1k+ parts

-

10k+ parts

-

868

$7.258

-

-

-

Vyrian

USA . 4,981 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,981

-

-

-

-

R&J Components

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

DF Sales Co.

USA . 220 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

220

-

-

-

-

DF Sales Co.

USA . 220 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

220

-

-

-

-

Component Electronics Inc.

Canada . 80 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

80

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 144 parts In-Stock

1+ parts

$6.490

100+ parts

$6.328

1k+ parts

$6.295

10k+ parts

-

144

$6.490

$6.328

$6.295

-

Corphita

USA . 1,331 parts In-Stock

1+ parts

$6.876

100+ parts

-

1k+ parts

-

10k+ parts

-

1,331

$6.876

-

-

-

Parana Technologies

USA . 1,433 parts In-Stock

1+ parts

$22.757

100+ parts

-

1k+ parts

$23.422

10k+ parts

-

1,433

$22.757

-

$23.422

-

ChromeModa Solutions

Germany . 4,788 parts In-Stock

1+ parts

$25.570

100+ parts

$20.967

1k+ parts

-

10k+ parts

-

4,788

$25.570

$20.967

-

-

IDEA Electronic Components Group

UK . 966 parts In-Stock

1+ parts

$25.570

100+ parts

$24.292

1k+ parts

$23.013

10k+ parts

-

966

$25.570

$24.292

$23.013

-

Corohmni

South Africa . 2,850 parts In-Stock

1+ parts

$62.679

100+ parts

-

1k+ parts

-

10k+ parts

-

2,850

$62.679

-

-

-

Assy Fe

Spain . 95 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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95

-

-

-

-

DigiPath Technology Company

USA . 21 parts In-Stock

1+ parts

-

100+ parts

$23.054

1k+ parts

-

10k+ parts

-

21

-

$23.054

-

-

Overview

Unlock the power of efficient memory control with the SN74LS601AN from Texas Instruments. Designed with precision and reliability, this memory controller offers unparalleled performance in a compact package. Ideal for a wide range of applications, this innovative product is sure to streamline your operations and enhance productivity. Trust in Texas Instruments for quality you can rely on. Experience the difference with the SN74LS601AN.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable applications.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for flexibility in power supply options, accommodating various system requirements.

Address Bus Width: 8

With an address bus width of 8, the memory controller can handle a large amount of addressable memory, suitable for high-performance systems.

Package Shape: RECTANGULAR

The rectangular package shape enables efficient placement and mounting on PCBs, optimizing space usage.

Power Supplies (V): 5

Operating at a standard power supply voltage of 5V ensures compatibility with a wide range of systems and components.

No. of Terminals: 20

The 20 terminals provide sufficient connectivity options for interfacing with other components and peripherals in the system.

Package Style (Meter): IN-LINE

The in-line package style allows for easy integration into existing circuit layouts, simplifying the overall system design.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage ensures stable operation even in situations where the power supply fluctuates slightly.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the memory controller can withstand moderate heat levels, suitable for most operating environments.

Minimum Operating Temperature: 0 °C

The memory controller can operate effectively at lower temperatures, ensuring reliable performance in various climate conditions.

Terminal Position: DUAL

The dual terminal position offers flexibility in PCB mounting options, allowing for versatile installation in different system configurations.

Maximum Seated Height: 5.08 mm

The compact maximum seated height enables the memory controller to be used in space-constrained applications without sacrificing performance.

Width: 7.62 mm

The narrow width of 7.62mm facilitates a compact design for the memory controller, saving valuable space on the PCB.

Length: 24.325 mm

The relatively short length of 24.325mm further contributes to the space-efficient design of the memory controller, making it suitable for compact systems.

Temperature Grade: COMMERCIAL

The commercial-grade temperature rating ensures reliable operation within standard temperature ranges, making the memory controller suitable for commercial applications.

Peripheral IC Type: MEMORY CONTROLLER, DRAM

The memory controller is specifically designed for managing DRAM memory modules, ensuring optimal performance and compatibility with DRAM-based systems.

Technology: TTL

Utilizing TTL technology offers fast and reliable data transmission, enhancing the overall efficiency and responsiveness of the memory controller.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies the soldering process during PCB assembly, ensuring secure and durable connections for long-term reliability.

Maximum Supply Current: 85 mA

With a maximum supply current of 85mA, the memory controller operates efficiently without drawing excessive power, contributing to energy efficiency.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures stable performance and compatibility with standard power sources.

No. of Banks: 2

Having 2 banks allows the memory controller to support multiple memory modules simultaneously, enabling efficient data processing and storage capabilities.

Terminal Pitch: 2.54 mm

The 2.54mm terminal pitch provides adequate spacing for easy connections and soldering, facilitating smooth integration into the system architecture.

Technical Specifications

Memory Controllers SN74LS601AN attributes and parameters. Explore more Memory Controllers devices from Texas Instruments

Specs

Address Bus Width:

8

Boundary Scan:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T20

Length:

24.325 mm

Low Power Mode:

NO

No. of Banks:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Memory Controllers

Maximum Supply Current:

85 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Peripheral IC Type:

Trade Compliance

SN74LS601AN Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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