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SN74ALS6301JD

Texas Instruments

SN74ALS6301JD by Texas Instruments

SN74ALS6301JD by Texas Instruments is a Memory Controller with 20-bit Address Bus, 5V Power Supply, and 1M x 16 Memory Organization. It operates b/w 0-70°C and has a max supply current of 220mA. This IC is ideal for DRAM applications due to its commercial temperature grade and through-hole terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,665 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,665

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Digiode

USA . 417 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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10k+ parts

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417

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 802 parts In-Stock

1+ parts

$13.235

100+ parts

-

1k+ parts

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10k+ parts

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802

$13.235

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One Stop Electronics

USA . 905 parts In-Stock

1+ parts

$18.000

100+ parts

-

1k+ parts

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10k+ parts

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905

$18.000

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Parana Technologies

USA . 309 parts In-Stock

1+ parts

$33.193

100+ parts

-

1k+ parts

$120.632

10k+ parts

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309

$33.193

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$120.632

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DigiPath Technology Company

USA . 650 parts In-Stock

1+ parts

$36.550

100+ parts

-

1k+ parts

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650

$36.550

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ChromeModa Solutions

Germany . 4,682 parts In-Stock

1+ parts

$37.296

100+ parts

$30.583

1k+ parts

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10k+ parts

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4,682

$37.296

$30.583

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IDEA Electronic Components Group

UK . 2,158 parts In-Stock

1+ parts

$37.296

100+ parts

$35.431

1k+ parts

$33.566

10k+ parts

-

2,158

$37.296

$35.431

$33.566

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Corohmni

South Africa . 5,072 parts In-Stock

1+ parts

$56.329

100+ parts

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5,072

$56.329

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Corphita

USA . 2,313 parts In-Stock

1+ parts

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2,313

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Overview

Unlock the power of efficient memory control with the SN74ALS6301JD by Texas Instruments. Designed with quality and precision, this memory controller offers seamless integration and reliable performance in a variety of applications. From data storage to system optimization, this product ensures maximum value with its advanced features and superior functionality. Trust Texas Instruments for cutting-edge technology that delivers unmatched benefits and advantages to meet your business needs. Elevate your projects with the SN74ALS6301JD and experience a new level of performance and reliability.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides excellent durability and protection for the memory controller, ensuring its longevity and reliability.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with various systems.

Address Bus Width: 20

A wider address bus width enables the memory controller to handle larger amounts of data efficiently, improving overall performance.

Package Shape: RECTANGULAR

The rectangular package shape makes the memory controller easy to handle and install in different systems.

Power Supplies (V): 5

Operating at a standard power supply voltage of 5V makes this memory controller compatible with many existing systems.

No. of Terminals: 52

Having a higher number of terminals allows for more connections and better communication with other components in the system.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures that the memory controller can operate efficiently even in systems with limited power supply capabilities.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this memory controller can perform reliably in a wide range of environmental conditions.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures ensures that the memory controller remains functional even in colder environments.

Terminal Position: DUAL

Dual terminal position allows for more secure connections and better stability within the system.

Technology: BIPOLAR

Bipolar technology offers high-speed performance and energy efficiency, making this memory controller suitable for demanding applications.

Memory Organization: 1M X 16

This memory organization provides a good balance between storage capacity and data retrieval speed, meeting the needs of many systems.

No. of Banks: 4

Multiple memory banks allow for efficient data access and management, enhancing overall system performance.

Terminal Pitch: 2.54 mm

The standard terminal pitch makes it easy to interface with other components and ensures compatibility with a wide range of systems.

Technical Specifications

Memory Controllers SN74ALS6301JD attributes and parameters. Explore more Memory Controllers devices from Texas Instruments

Specs

Address Bus Width:

20

Boundary Scan:

NO

External Data Bus Width:

0

JESD-30 Code:

R-CDIP-T52

Low Power Mode:

NO

Memory Organization:

1M X 16

No. of Banks:

4

No. of Terminals:

52

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Equivalence Code:

DIP52,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Memory Controllers

Maximum Supply Current:

220 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Trade Compliance

SN74ALS6301JD Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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