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SN74LS601AJ

Texas Instruments

SN74LS601AJ by Texas Instruments

SN74LS601AJ by Texas Instruments is a Memory Controller with 8-bit Address Bus, 64K X 1 Memory Organization, and TTL Technology. It operates at 5V with a supply voltage range of 4.75V to 5.25V. Commonly used in DRAM applications due to its commercial temperature grade and through-hole terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,890 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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8,890

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Digiode

USA . 4,040 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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4,040

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 511 parts In-Stock

1+ parts

$2.000

100+ parts

-

1k+ parts

-

10k+ parts

-

511

$2.000

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-

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AZTECH Wire

Italy . 436 parts In-Stock

1+ parts

$11.337

100+ parts

-

1k+ parts

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436

$11.337

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Corohmni

South Africa . 93 parts In-Stock

1+ parts

$69.986

100+ parts

-

1k+ parts

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10k+ parts

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93

$69.986

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Parana Technologies

USA . 380 parts In-Stock

1+ parts

$73.416

100+ parts

-

1k+ parts

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10k+ parts

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380

$73.416

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-

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DigiPath Technology Company

USA . 2,097 parts In-Stock

1+ parts

$80.840

100+ parts

$74.373

1k+ parts

-

10k+ parts

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2,097

$80.840

$74.373

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ChromeModa Solutions

Germany . 5,523 parts In-Stock

1+ parts

$82.490

100+ parts

$67.642

1k+ parts

-

10k+ parts

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5,523

$82.490

$67.642

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IDEA Electronic Components Group

UK . 770 parts In-Stock

1+ parts

$82.490

100+ parts

$78.366

1k+ parts

$74.241

10k+ parts

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770

$82.490

$78.366

$74.241

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Corphita

USA . 1,020 parts In-Stock

1+ parts

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100+ parts

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1,020

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Overview

Unlock unparalleled performance and reliability with the SN74LS601AJ by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and cutting-edge technology in memory controllers. Whether you're looking to enhance your system's speed, efficiency, or overall functionality, this product provides exceptional value and benefits. From improved data storage to seamless memory organization, the SN74LS601AJ is the perfect solution for your electronic needs. Elevate your experience and take your projects to the next level with this high-quality component.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Ceramic and glass-sealed packaging ensures durability and protection for the memory controller, making it a reliable choice for long-term use.

Maximum Supply Voltage: 5.25 V

With a high maximum supply voltage, this memory controller can handle a wide range of power inputs, providing flexibility in different usage scenarios.

Address Bus Width: 8

An 8-bit address bus width allows for efficient memory addressing and management, enhancing the performance of the memory controller.

Package Shape: RECTANGULAR

Rectangular packaging is space-efficient and easy to integrate into various electronic systems, making this memory controller versatile in its application.

Power Supplies (V): 5

Operating at a standard 5V power supply, this memory controller is compatible with many common electronic devices and systems.

No. of Terminals: 20

Having 20 terminals provides ample connectivity options for interfacing with other components, enabling seamless integration of the memory controller into a system.

Package Style (Meter): IN-LINE

The in-line package style simplifies the assembly process and saves space on a circuit board, making this memory controller user-friendly for manufacturers.

Minimum Supply Voltage: 4.75 V

With a low minimum supply voltage, this memory controller is energy-efficient and can operate effectively even in power-constrained environments.

Maximum Operating Temperature: 70 °C

A high maximum operating temperature tolerance of 70°C ensures that this memory controller can withstand heat-intensive conditions, enhancing its reliability.

Minimum Operating Temperature: 0 °C

Being able to function at a minimum temperature of 0°C makes this memory controller suitable for a wide range of operating environments, from cold to warm climates.

Terminal Position: DUAL

Dual terminal positions offer increased connectivity options and flexibility in circuit board layout, making integration of the memory controller easier and more versatile.

Maximum Seated Height: 5.08 mm

With a low maximum seated height, this memory controller can be compactly installed in a system, optimizing space utilization and enabling sleek design aesthetics.

Width: 7.62 mm

A slim width dimension facilitates installation in tight spaces and compact electronic devices, making this memory controller suitable for a wide range of applications.

Length: 24.195 mm

A moderate length dimension provides a balance between compactness and functionality, allowing this memory controller to fit well in various electronic systems.

Temperature Grade: COMMERCIAL

Designed for commercial use, this memory controller meets industry standards for reliability and performance, making it a dependable choice for business applications.

Peripheral IC Type: MEMORY CONTROLLER, DRAM

As a memory controller specifically designed for DRAM (Dynamic Random Access Memory), this product offers efficient memory management and high-speed data access capabilities.

Technology: TTL

Utilizing TTL (Transistor-Transistor Logic) technology ensures fast data processing speeds and reliable operation, enhancing the overall performance of this memory controller.

Terminal Form: THROUGH-HOLE

Through-hole terminal form simplifies the soldering process during installation, improving the reliability and durability of the connections for this memory controller.

Maximum Supply Current: 85 mA

With a maximum supply current of 85mA, this memory controller operates efficiently without drawing excessive power, contributing to energy savings and better performance.

Nominal Supply Voltage: 5 V

Having a nominal supply voltage of 5V ensures compatibility with standard power sources, making this memory controller easy to integrate into existing electronic systems.

Memory Organization: 64K X 1

Based on a memory organization of 64K X 1, this memory controller offers optimized memory storage and retrieval capabilities, enhancing system performance and efficiency.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54mm provides ample space for connections and soldering, ensuring a secure and reliable interface for this memory controller in a circuit board.

Technical Specifications

Memory Controllers SN74LS601AJ attributes and parameters. Explore more Memory Controllers devices from Texas Instruments

Specs

Address Bus Width:

8

Boundary Scan:

NO

External Data Bus Width:

0

JESD-30 Code:

R-GDIP-T20

Length:

24.195 mm

Low Power Mode:

NO

Memory Organization:

64K X 1

No. of Banks:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Memory Controllers

Maximum Supply Current:

85 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Peripheral IC Type:

Trade Compliance

SN74LS601AJ Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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