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TIM99600J

Texas Instruments

TIM99600J by Texas Instruments

TIM99600J by Texas Instruments is a Memory Controller with 20 terminals, operating at 5V. It features TTL technology, 85mA max supply current, and operates b/w 0-70°C. This rectangular ceramic package is ideal for commercial applications requiring precise memory control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,818 parts In-Stock

1+ parts

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8,818

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Digiode

USA . 4,450 parts In-Stock

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4,450

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,412 parts In-Stock

1+ parts

$14.000

100+ parts

-

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1,412

$14.000

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AZTECH Wire

Italy . 342 parts In-Stock

1+ parts

$17.301

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342

$17.301

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Corohmni

South Africa . 2,371 parts In-Stock

1+ parts

$44.638

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2,371

$44.638

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Parana Technologies

USA . 217 parts In-Stock

1+ parts

$53.487

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217

$53.487

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DigiPath Technology Company

USA . 1,866 parts In-Stock

1+ parts

$58.896

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1,866

$58.896

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ChromeModa Solutions

Germany . 3,137 parts In-Stock

1+ parts

$60.098

100+ parts

$49.280

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3,137

$60.098

$49.280

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IDEA Electronic Components Group

UK . 1,059 parts In-Stock

1+ parts

$60.098

100+ parts

$57.093

1k+ parts

$54.088

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1,059

$60.098

$57.093

$54.088

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Corphita

USA . 3,312 parts In-Stock

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3,312

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Overview

Unlock the power of your devices with the TIM99600J from Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments brings you a memory controller that surpasses expectations. Perfect for a wide range of applications, this product offers unparalleled value and benefits to customers. Say goodbye to limitations and hello to limitless possibilities with the TIM99600J. Elevate your projects with ease and efficiency, thanks to this cutting-edge technology.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages offer better thermal conductivity, making this memory controller more reliable and efficient in managing heat.

Power Supplies (V): 5

Operating at 5 volts allows for compatibility with a wide range of systems and devices, increasing flexibility for integration.

No. of Terminals: 20

Having 20 terminals enables a high level of connectivity, allowing for versatile configurations and external connections.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, this memory controller can withstand demanding usage scenarios without overheating.

Technology: TTL

Using TTL technology ensures fast and reliable data transfer, enhancing the overall performance of the memory controller.

Technical Specifications

Memory Controllers TIM99600J attributes and parameters. Explore more Memory Controllers devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T20

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Memory Controllers

Maximum Supply Current:

85 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TIM99600J Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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