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SN54LS603AJ

Texas Instruments

SN54LS603AJ by Texas Instruments

SN54LS603AJ by Texas Instruments is a Memory Controller with 20 terminals, operating at 5V. It features MILITARY grade temperature range from -55°C to 125°C and uses TTL technology. This rectangular package in CERAMIC material has a max supply current of 85mA, making it ideal for military-grade applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,609 parts In-Stock

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6,609

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Digiode

USA . 1,607 parts In-Stock

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1,607

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,231 parts In-Stock

1+ parts

$1.000

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1,231

$1.000

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AZTECH Wire

Italy . 190 parts In-Stock

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$5.243

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190

$5.243

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Parana Technologies

USA . 1,380 parts In-Stock

1+ parts

$58.108

100+ parts

$5,396.218

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$52.297

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1,380

$58.108

$5,396.218

$52.297

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DigiPath Technology Company

USA . 369 parts In-Stock

1+ parts

$63.984

100+ parts

$58.865

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-

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369

$63.984

$58.865

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IDEA Electronic Components Group

UK . 1,547 parts In-Stock

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$65.290

100+ parts

$62.026

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$58.761

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1,547

$65.290

$62.026

$58.761

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ChromeModa Solutions

Germany . 787 parts In-Stock

1+ parts

$65.290

100+ parts

$53.538

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787

$65.290

$53.538

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Corohmni

South Africa . 5,184 parts In-Stock

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$66.449

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Corphita

USA . 3,691 parts In-Stock

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Overview

Unlock the power of reliable memory control with the SN54LS603AJ from Texas Instruments. Crafted with precision and quality materials, this military-grade memory controller offers unparalleled performance in a compact rectangular package. Whether you're designing aerospace systems or industrial machinery, this TTL technology marvel guarantees seamless operation in extreme temperatures while consuming minimal power. Elevate your projects with the unbeatable value and efficiency of the SN54LS603AJ.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages offer excellent thermal conductivity and high mechanical strength, ensuring reliable operation in various environments.

Power Supplies (V): 5

Operating at 5 volts ensures compatibility with a wide range of electronic devices and systems, making this memory controller versatile.

No. of Terminals: 20

Having 20 terminals provides ample connectivity options for interfacing with other components, enhancing the flexibility of this memory controller.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this memory controller can withstand elevated temperature conditions, increasing its durability.

Technology: TTL

Utilizing TTL technology ensures fast and reliable data transmission, making this memory controller suitable for high-performance applications.

Technical Specifications

Memory Controllers SN54LS603AJ attributes and parameters. Explore more Memory Controllers devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T20

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Memory Controllers

Maximum Supply Current:

85 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN54LS603AJ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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