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SN54LS603J

Texas Instruments

SN54LS603J by Texas Instruments

SN54LS603J by Texas Instruments is a Memory Controller with 20 terminals, operating at 5V. It features TTL technology, MILITARY grade, and operates b/w -55°C to 125°C. This rectangular package in CERAMIC is ideal for military-grade applications requiring reliable memory control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,970 parts In-Stock

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1,970

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Digiode

USA . 1,734 parts In-Stock

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1,734

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Distributors (Availability)

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AZTECH Wire

Italy . 764 parts In-Stock

1+ parts

$10.439

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764

$10.439

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One Stop Electronics

USA . 261 parts In-Stock

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$25.000

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261

$25.000

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Parana Technologies

USA . 642 parts In-Stock

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$33.565

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$128.491

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642

$33.565

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$128.491

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DigiPath Technology Company

USA . 944 parts In-Stock

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$36.959

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944

$36.959

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ChromeModa Solutions

Germany . 4,109 parts In-Stock

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$37.713

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$30.925

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4,109

$37.713

$30.925

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IDEA Electronic Components Group

UK . 704 parts In-Stock

1+ parts

$37.713

100+ parts

$35.827

1k+ parts

$33.942

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704

$37.713

$35.827

$33.942

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Corohmni

South Africa . 389 parts In-Stock

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$50.842

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389

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Corphita

USA . 4,129 parts In-Stock

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Overview

Experience unmatched quality and reliability with the SN54LS603J memory controller by Texas Instruments. Designed for military-grade applications, this product offers superior performance and durability in extreme conditions. With a nominal supply voltage of 5V and maximum operating temperature of 125°C, this device ensures consistent functionality when it matters most. Trust Texas Instruments for cutting-edge technology and innovative solutions that deliver value and peace of mind to our customers.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides excellent thermal conductivity and durability, ensuring reliable performance even in high temperature environments.

Power Supplies (V): 5

Operating at a standard voltage of 5V makes it compatible with a wide range of systems and devices, offering flexibility in integration.

No. of Terminals: 20

Having 20 terminals allows for versatile connectivity options, accommodating various configurations and connections.

Package Style (Meter): IN-LINE

The in-line package style offers easy installation and space-saving design, making it ideal for compact applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this memory controller can withstand demanding conditions without compromising performance.

Minimum Operating Temperature: -55 °C

The wide temperature range ensures reliable operation even in extreme cold environments, making it suitable for diverse applications.

Temperature Grade: MILITARY

Military-grade temperature rating guarantees resilience and stability in harsh environments, making it a reliable choice for mission-critical applications.

Technology: TTL

Using TTL technology ensures fast and accurate data transmission, improving overall efficiency and performance.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and ease of soldering, ensuring durability and hassle-free assembly.

Maximum Supply Current: 85 mA

With a maximum supply current of 85mA, this memory controller consumes low power, resulting in energy efficiency and cost-effectiveness.

Terminal Pitch: 2.54 mm

The standard terminal pitch of 2.54mm enables easy interfacing with other components and PCBs, facilitating integration and compatibility.

Technical Specifications

Memory Controllers SN54LS603J attributes and parameters. Explore more Memory Controllers devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T20

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Memory Controllers

Maximum Supply Current:

85 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN54LS603J Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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