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SN74LS600NP1

Texas Instruments

SN74LS600NP1 by Texas Instruments

SN74LS600NP1 by Texas Instruments is a Memory Controller with 20 terminals, operating at 5V. It features TTL technology, 85mA max supply current, and operates b/w 0-70°C. Ideal for commercial applications requiring reliable memory control in a rectangular plastic/epoxy package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,461 parts In-Stock

1+ parts

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3,461

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Vyrian

USA . 2,959 parts In-Stock

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2,959

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 895 parts In-Stock

1+ parts

$14.539

100+ parts

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895

$14.539

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One Stop Electronics

USA . 629 parts In-Stock

1+ parts

$27.000

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629

$27.000

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Parana Technologies

USA . 109 parts In-Stock

1+ parts

$42.893

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109

$42.893

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ChromeModa Solutions

Germany . 6,191 parts In-Stock

1+ parts

$48.194

100+ parts

$39.519

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6,191

$48.194

$39.519

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IDEA Electronic Components Group

UK . 242 parts In-Stock

1+ parts

$48.194

100+ parts

$45.784

1k+ parts

$43.375

10k+ parts

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242

$48.194

$45.784

$43.375

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Corohmni

South Africa . 721 parts In-Stock

1+ parts

$85.769

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721

$85.769

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DigiPath Technology Company

USA . 1,956 parts In-Stock

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$43.452

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1,956

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$43.452

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Corphita

USA . 1,403 parts In-Stock

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1,403

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Overview

Unlock the power of seamless memory control with the SN74LS600NP1 by Texas Instruments. Crafted with precision and expertise, this innovative product is designed to enhance performance and reliability in a variety of applications. Whether you're working on industrial automation or telecommunications, this memory controller offers unmatched value and benefits. Trust in Texas Instruments to deliver top-notch quality and cutting-edge technology that will take your projects to the next level. Elevate your designs with the SN74LS600NP1 and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers durability and resistance to physical damage, making the product long-lasting and reliable.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration and fitting into different systems or devices.

Power Supplies (V): 5

Operates at a standard 5V power supply, ensuring compatibility with a wide range of devices and systems.

No. of Terminals: 20

Having 20 terminals provides flexibility and options for connecting to various components efficiently.

Package Style (Meter): IN-LINE

In-line package style saves space and allows for a compact design, suitable for applications with limited space.

Maximum Operating Temperature: 70 °C

Operating at a maximum temperature of 70°C ensures stable performance even under demanding conditions.

Minimum Operating Temperature: 0 °C

Capable of operating at a minimum temperature of 0°C, making it suitable for a wide range of environments.

Terminal Position: DUAL

Dual terminal position provides redundancy and improves reliability in connectivity.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures compatibility with standard commercial applications.

Technology: TTL

Utilizing TTL technology offers fast and reliable data transmission, ideal for memory control applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form allows for easy and secure soldering onto a PCB, ensuring stable connections.

Maximum Supply Current: 85 mA

With a maximum supply current of 85 mA, the product operates efficiently without drawing excessive power.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources.

Terminal Pitch: 2.54 mm

Terminal pitch of 2.54mm offers space-saving design and ease of connection in a compact form factor.

Technical Specifications

Memory Controllers SN74LS600NP1 attributes and parameters. Explore more Memory Controllers devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T20

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Memory Controllers

Maximum Supply Current:

85 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74LS600NP1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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