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SN74ALS2968JD

Texas Instruments

SN74ALS2968JD by Texas Instruments

SN74ALS2968JD by Texas Instruments is a Memory Controller with 18-bit Address Bus, 1M X 16 Memory Organization, and operates at temperatures b/w 0 to 70 °C. It has a package style of IN-LINE and requires a supply voltage b/w 4.5V to 5.5V. Ideal for applications requiring DRAM memory control in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,112 parts In-Stock

1+ parts

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5,112

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Digiode

USA . 4,445 parts In-Stock

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4,445

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 258 parts In-Stock

1+ parts

$17.800

100+ parts

-

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258

$17.800

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One Stop Electronics

USA . 509 parts In-Stock

1+ parts

$27.000

100+ parts

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509

$27.000

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Corohmni

South Africa . 657 parts In-Stock

1+ parts

$73.170

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657

$73.170

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Parana Technologies

USA . 2,334 parts In-Stock

1+ parts

$76.633

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2,334

$76.633

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DigiPath Technology Company

USA . 835 parts In-Stock

1+ parts

$84.383

100+ parts

$77.632

1k+ parts

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835

$84.383

$77.632

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ChromeModa Solutions

Germany . 2,840 parts In-Stock

1+ parts

$86.105

100+ parts

$70.606

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2,840

$86.105

$70.606

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IDEA Electronic Components Group

UK . 124 parts In-Stock

1+ parts

$86.105

100+ parts

$81.800

1k+ parts

$77.494

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124

$86.105

$81.800

$77.494

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Corphita

USA . 2,416 parts In-Stock

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Overview

Unlock the potential of your electronic devices with the SN74ALS2968JD by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality memory controllers that offer unparalleled performance and reliability. Ideal for a wide range of applications, this product ensures seamless operation and efficient data management. Experience the value and benefits of Texas Instruments' innovation with the SN74ALS2968JD, providing customers with a competitive edge in today's fast-paced technological landscape.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The package material ensures durability and reliability, making this product suitable for a wide range of applications.

Maximum Supply Voltage: 5.5 V

The higher maximum supply voltage allows for flexibility in power supply options, accommodating various systems and environments.

Address Bus Width: 18

The wide address bus width enhances the memory addressing ability of the controller, enabling efficient data processing and access.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easy integration and installation, optimizing space utilization in electronic systems.

Power Supplies (V): 5

The standard power supply voltage of 5V ensures compatibility with common power sources, simplifying system design and deployment.

No. of Terminals: 48

The ample number of terminals provides connectivity options for various external components, enhancing the versatility of the memory controller.

Package Style (Meter): IN-LINE

The in-line package style offers a compact form factor, enabling efficient board layout and space-saving in electronic assemblies.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage specification ensures a stable operating range, safeguarding the memory controller against voltage fluctuations.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature tolerance allows for reliable performance in challenging environmental conditions, ensuring system robustness.

Minimum Operating Temperature: 0 °C

The wide operating temperature range ensures functionality in both low and high-temperature environments, enhancing the product's usability.

Terminal Position: DUAL

The dual terminal position enhances the connectivity options and flexibility, making it easier to integrate the memory controller into various system architectures.

Temperature Grade: COMMERCIAL

The commercial temperature grade specification indicates suitability for standard commercial applications, ensuring broad compatibility and usability.

Peripheral IC Type: MEMORY CONTROLLER, DRAM

The integration of memory controller and DRAM peripheral ICs simplifies system design and reduces component count, enhancing efficiency.

Technology: TTL

The TTL technology used in the memory controller ensures fast and reliable data processing, delivering high-performance capabilities for demanding applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies installation and soldering processes, making it easier to secure and connect the memory controller in electronic circuits.

Maximum Supply Current: 200 mA

The maximum supply current specification indicates the power consumption of the memory controller, helping users optimize power management in their systems.

Nominal Supply Voltage: 5 V

The nominal supply voltage specification ensures stable and reliable operation, promoting consistent performance of the memory controller under normal operating conditions.

Memory Organization: 1M X 16

The memory organization of 1M X 16 signifies the memory capacity and data width of the controller, enabling efficient data storage and retrieval in memory-intensive tasks.

No. of Banks: 4

The presence of multiple memory banks allows for concurrent access and data processing, enhancing the overall performance and throughput of the memory controller.

Terminal Pitch: 2.54 mm

The standard terminal pitch of 2.54mm facilitates compatibility with commonly used connectors and sockets, enabling easy integration into existing electronic systems.

Technical Specifications

Memory Controllers SN74ALS2968JD attributes and parameters. Explore more Memory Controllers devices from Texas Instruments

Specs

Address Bus Width:

18

Boundary Scan:

NO

External Data Bus Width:

0

JESD-30 Code:

R-CDIP-T48

Low Power Mode:

NO

Memory Organization:

1M X 16

No. of Banks:

4

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Equivalence Code:

DIP48,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Memory Controllers

Maximum Supply Current:

200 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Trade Compliance

SN74ALS2968JD Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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