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SN74LS602N3

Texas Instruments

SN74LS602N3 by Texas Instruments

SN74LS602N3 by Texas Instruments is a TTL memory controller with 20 terminals, operating at 5V. It has a max supply current of 85mA and operates b/w 0-70°C. This rectangular package is commonly used in commercial applications requiring precise memory control.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,760 parts In-Stock

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6,760

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Digiode

USA . 531 parts In-Stock

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531

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AZTECH Wire

Italy . 555 parts In-Stock

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$17.043

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555

$17.043

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Parana Technologies

USA . 2,001 parts In-Stock

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$31.262

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$75.968

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2,001

$31.262

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$75.968

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DigiPath Technology Company

USA . 1,421 parts In-Stock

1+ parts

$34.423

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$31.670

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1,421

$34.423

$31.670

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One Stop Electronics

USA . 521 parts In-Stock

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$35.000

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521

$35.000

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ChromeModa Solutions

Germany . 3,584 parts In-Stock

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$35.126

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$28.803

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3,584

$35.126

$28.803

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IDEA Electronic Components Group

UK . 886 parts In-Stock

1+ parts

$35.126

100+ parts

$33.370

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$31.613

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886

$35.126

$33.370

$31.613

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Corohmni

South Africa . 7 parts In-Stock

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$63.531

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7

$63.531

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Corphita

USA . 2,650 parts In-Stock

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2,650

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Overview

Upgrade your memory controllers with the SN74LS602N3 by Texas Instruments, a top-quality product that offers unmatched reliability and performance. Designed with precision and expertise, this device is perfect for a wide range of applications in various industries. With a durable plastic/epoxy package body and 20 terminals, this product guarantees seamless integration and optimal functionality. Trust Texas Instruments to deliver cutting-edge technology that exceeds your expectations. Experience the value and benefits of the SN74LS602N3 and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, making it easy to handle and resistant to damage during installation and operation.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space and easy placement on a circuit board, optimizing the layout and design of the overall system.

Power Supplies (V): 5

The 5V power supply ensures compatibility with standard voltage requirements in electronic devices, making it versatile and widely usable in various applications.

No. of Terminals: 20

With 20 terminals, the memory controller allows for connectivity with multiple components and peripherals, enhancing the functionality and integration capabilities of the product.

Package Style (Meter): IN-LINE

The in-line package style simplifies installation and connection in a linear layout, facilitating a neat and organized configuration of the memory controller within the system.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures reliable performance under varying environmental conditions, making the memory controller suitable for use in different settings.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C allows the memory controller to function effectively in cold environments, ensuring consistent operation in diverse temperature ranges.

Terminal Position: DUAL

The dual terminal position provides redundancy and flexibility in connection options, enabling secure and stable connections for optimal performance and reliability.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures that the memory controller meets industry standards for performance and reliability in typical commercial applications, making it a dependable choice for various projects.

Technology: TTL

The TTL technology used in the memory controller offers high-speed and reliable data transmission, enhancing the overall efficiency and performance of the product in data processing and storage.

Terminal Form: THROUGH-HOLE

The through-hole terminal form facilitates easy soldering and secure attachment to the circuit board, ensuring stable connections and reducing the risk of loose connections or signal interference.

Maximum Supply Current: 85 mA

The maximum supply current of 85 mA ensures that the memory controller operates within safe limits, preventing overloading and maintaining the stability of the system during use.

Nominal Supply Voltage: 5 V

The nominal 5V supply voltage is ideal for powering the memory controller and ensures compatibility with standard voltage requirements, making it a convenient choice for integration into various electronic devices.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch provides ample spacing between terminals for easy handling and connection, allowing for efficient installation and maintenance of the memory controller in the system.

Technical Specifications

Memory Controllers SN74LS602N3 attributes and parameters. Explore more Memory Controllers devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T20

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Sub-Category:

Memory Controllers

Maximum Supply Current:

85 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74LS602N3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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