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THCT4502BFN

Texas Instruments

THCT4502BFN by Texas Instruments

THCT4502BFN by Texas Instruments is a Memory Controller with 18-bit Address Bus, 5V Power Supplies, and 4 Banks. It is used in DRAM applications, operates b/w 0-70°C, and has a terminal pitch of 1.27mm for surface mount assembly.

Median Price

$6.720

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 1,735 parts In-Stock

1+ parts

$6.720

100+ parts

$2.912

1k+ parts

$2.755

10k+ parts

-

1,735

$6.720

$2.912

$2.755

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Resion

USA . 9,598 parts In-Stock

1+ parts

-

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9,598

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Digiode

USA . 2,332 parts In-Stock

1+ parts

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2,332

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A2Z Electronics, Inc.

USA . 1,735 parts In-Stock

1+ parts

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1,735

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Vyrian

USA . 1,295 parts In-Stock

1+ parts

-

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-

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1,295

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-

-

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MRC Electronics

USA . 194 parts In-Stock

1+ parts

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194

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Electronic Expediters

USA . 171 parts In-Stock

1+ parts

-

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171

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Corel Iberica Componentes, S.L.

Spain . 13 parts In-Stock

1+ parts

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13

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 436 parts In-Stock

1+ parts

$9.185

100+ parts

-

1k+ parts

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10k+ parts

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436

$9.185

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-

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Parana Technologies

USA . 2,321 parts In-Stock

1+ parts

$25.520

100+ parts

-

1k+ parts

$26.140

10k+ parts

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2,321

$25.520

-

$26.140

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ChromeModa Solutions

Germany . 3,527 parts In-Stock

1+ parts

$28.674

100+ parts

$23.513

1k+ parts

-

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3,527

$28.674

$23.513

-

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IDEA Electronic Components Group

UK . 1,990 parts In-Stock

1+ parts

$28.674

100+ parts

$27.240

1k+ parts

$25.807

10k+ parts

-

1,990

$28.674

$27.240

$25.807

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One Stop Electronics

USA . 939 parts In-Stock

1+ parts

$33.000

100+ parts

-

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939

$33.000

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Corohmni

South Africa . 1,080 parts In-Stock

1+ parts

$52.616

100+ parts

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1,080

$52.616

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Corphita

USA . 4,601 parts In-Stock

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4,601

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DigiPath Technology Company

USA . 36 parts In-Stock

1+ parts

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100+ parts

$25.852

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36

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$25.852

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Assy Fe

Spain . 13 parts In-Stock

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13

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Overview

Enhance your electronic projects with the THCT4502BFN by Texas Instruments, a top-tier manufacturer known for quality and reliability. This memory controller offers seamless integration, superior performance, and versatile applications in various industries. With a wide range of benefits and advantages, including ease of use and durability, this product provides exceptional value to customers looking for high-quality components. Upgrade your designs today with the THCT4502BFN and experience the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for long-term use.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards.

Maximum Supply Voltage: 5.5 V

Can handle high supply voltages for stable performance.

Address Bus Width: 18

Provides high address bus width for efficient data transfer.

Power Supplies (V): 5

Runs on standard 5V power supply for compatibility with various systems.

No. of Terminals: 68

Offers multiple terminals for connecting to other components and peripherals.

Minimum Supply Voltage: 4.5 V

Can operate at low supply voltages for energy efficiency.

Maximum Operating Temperature: 70 °C

Can handle high operating temperatures without performance degradation.

Minimum Operating Temperature: 0 °C

Can operate in low temperature environments without issues.

Terminal Position: QUAD

Quad terminal position offers stability and reliability in connections.

Maximum Seated Height: 4.57 mm

Low seated height makes it suitable for compact designs and space-constrained applications.

Width: 24.2316 mm

Compact width for easy integration into circuit layouts.

Length: 24.2316 mm

Compact length for space-saving installations.

Temperature Grade: COMMERCIAL

Designed for commercial-grade applications with reliable performance.

Peripheral IC Type: MEMORY CONTROLLER, DRAM

Designed specifically for memory control and management, enhancing overall system performance.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high speed operation.

Terminal Form: J BEND

J Bend terminal form offers secure connections and ease of installation.

Maximum Supply Current: 15 mA

Low supply current for efficient power usage.

Nominal Supply Voltage: 5 V

Operates at standard 5V supply for compatibility and ease of use.

No. of Banks: 4

Multiple banks for organizing and accessing memory efficiently.

Terminal Pitch: 1.27 mm

Standard terminal pitch for compatibility with various circuit boards.

Technical Specifications

Memory Controllers THCT4502BFN attributes and parameters. Explore more Memory Controllers devices from Texas Instruments

Specs

Address Bus Width:

18

Boundary Scan:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-J68

Length:

24.2316 mm

Low Power Mode:

NO

No. of Banks:

4

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Memory Controllers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24.2316 mm

Peripheral IC Type:

Trade Compliance

THCT4502BFN Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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