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TMS4500A-200FN

Texas Instruments

TMS4500A-200FN by Texas Instruments

TMS4500A-200FN by Texas Instruments is a memory controller with 44 terminals, operating at 5V. It features MOS technology, J bend terminals, and comes in a square chip carrier package. Ideal for applications requiring precise memory control and high-speed data processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,032 parts In-Stock

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5,032

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Digiode

USA . 2,020 parts In-Stock

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2,020

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Distributors (Availability)

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One Stop Electronics

USA . 233 parts In-Stock

1+ parts

$6.000

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233

$6.000

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AZTECH Wire

Italy . 810 parts In-Stock

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$17.116

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810

$17.116

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Corohmni

South Africa . 3,184 parts In-Stock

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$27.724

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3,184

$27.724

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Parana Technologies

USA . 2,353 parts In-Stock

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$52.418

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2,353

$52.418

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DigiPath Technology Company

USA . 317 parts In-Stock

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$57.719

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$53.102

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317

$57.719

$53.102

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ChromeModa Solutions

Germany . 4,334 parts In-Stock

1+ parts

$58.897

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$48.296

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4,334

$58.897

$48.296

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IDEA Electronic Components Group

UK . 1,845 parts In-Stock

1+ parts

$58.897

100+ parts

$55.952

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$53.007

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1,845

$58.897

$55.952

$53.007

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Corphita

USA . 3,760 parts In-Stock

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3,760

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Overview

Elevate your electronic projects with the TMS4500A-200FN memory controller from Texas Instruments. This cutting-edge device offers unmatched quality and reliability, thanks to the renowned manufacturer's commitment to excellence. Ideal for a wide range of applications, this chip carrier package is designed for seamless integration and superior performance. With a nominal supply voltage of 5V and 44 terminals, the TMS4500A-200FN delivers exceptional value and benefits to customers seeking top-notch memory control solutions. Upgrade your designs today with this innovative technology from Texas Instruments!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on a circuit board, saving time and effort in the assembly process.

Package Shape: SQUARE

The square package shape provides a compact footprint, allowing for efficient use of space on the circuit board.

Power Supplies (V): 5

Operating at a standard 5V power supply makes the product compatible with a wide range of devices and systems.

No. of Terminals: 44

Having a higher number of terminals allows for more connections and flexibility in interfacing with other components in the system.

Package Style (Meter): CHIP CARRIER

The chip carrier package style is known for its high reliability and thermal performance, ensuring stable operation of the memory controller.

Terminal Position: QUAD

The quad terminal position allows for easier routing of connections and improved signal integrity within the system.

Technology: MOS

Utilizing MOS technology provides high-speed performance and low power consumption, making the memory controller energy-efficient.

Terminal Form: J BEND

The J bend terminal form simplifies the soldering process and enhances the mechanical strength of the connections, improving overall reliability.

Nominal Supply Voltage: 5V

Operating at a nominal supply voltage of 5V ensures stability and compatibility with standard power sources, simplifying system integration.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch provides sufficient spacing for routing signals and reduces the risk of short circuits, enhancing the overall reliability of the memory controller.

Technical Specifications

Memory Controllers TMS4500A-200FN attributes and parameters. Explore more Memory Controllers devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J44

No. of Terminals:

44

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Memory Controllers

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

MOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

TMS4500A-200FN Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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