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TMS4500A-25FN

Texas Instruments

TMS4500A-25FN by Texas Instruments

TMS4500A-25FN by Texas Instruments is a Memory Controller with 16-bit Address Bus, operating at 5V. It comes in a 44-terminal Chip Carrier package suitable for DRAM applications. This CMOS technology device has a temperature range of 0-70°C and supports up to 140mA supply current.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,773 parts In-Stock

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Digiode

USA . 1,514 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,423 parts In-Stock

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$3.000

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$3.000

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AZTECH Wire

Italy . 280 parts In-Stock

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$10.609

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Corohmni

South Africa . 2,009 parts In-Stock

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$41.275

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Parana Technologies

USA . 59 parts In-Stock

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$50.497

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59

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DigiPath Technology Company

USA . 648 parts In-Stock

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$55.603

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648

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ChromeModa Solutions

Germany . 5,649 parts In-Stock

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$56.738

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$46.525

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$56.738

$46.525

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IDEA Electronic Components Group

UK . 1,795 parts In-Stock

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$56.738

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$53.901

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$51.064

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Corphita

USA . 3,635 parts In-Stock

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Overview

Unlock the power of seamless memory control with the TMS4500A-25FN by Texas Instruments. As a trusted industry leader, Texas Instruments delivers quality products that ensure reliability and performance. The TMS4500A-25FN is perfect for a wide range of applications in memory controllers, offering customers unmatched value and benefits. Experience superior efficiency and functionality with this innovative product, designed to elevate your projects to new heights. Choose Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the memory controller, making it a good choice for long-term usage.

Surface Mount: YES

Being surface mountable allows for easy installation and space-saving on PCBs, making this memory controller convenient for compact designs.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this memory controller can handle fluctuations in power supply without compromising on performance.

Address Bus Width: 16

Having a wide address bus width allows for efficient communication between the memory controller and the connected devices, enhancing data transfer speeds.

Package Shape: SQUARE

The square package shape makes it easy to integrate the memory controller into various PCB layouts, offering versatility in design options.

Power Supplies (V): 5

The memory controller operates on a standard 5V power supply, ensuring compatibility with common power sources in electronic systems.

No. of Terminals: 44

Having a higher number of terminals allows for more connections and interfaces, enabling the memory controller to support multiple components simultaneously.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures stable operation even under low power conditions, making this memory controller reliable in various scenarios.

Maximum Operating Temperature: 70 °C

The memory controller can function effectively at high temperatures, making it suitable for use in industrial or outdoor environments where heat levels may vary.

Minimum Operating Temperature: 0 °C

With a low minimum operating temperature, this memory controller can be used in cold environments without risk of malfunctions, ensuring consistent performance.

Terminal Position: QUAD

The quad terminal position provides secure connections and ease of soldering, enhancing the reliability and durability of the memory controller in electronic circuits.

Maximum Seated Height: 4.57 mm

The compact seated height allows for easy integration of the memory controller in tight spaces, making it ideal for applications with size constraints.

Width: 16.5862 mm

The specific width measurement ensures compatibility with standard PCB layouts, facilitating seamless integration of the memory controller in electronic systems.

Length: 16.5862 mm

The specified length measurement offers a compact form factor for the memory controller, making it suitable for devices with limited space availability.

Temperature Grade: COMMERCIAL

Designed for commercial use, this memory controller meets industry standards for temperature tolerance and reliability in typical operating environments.

Peripheral IC Type: MEMORY CONTROLLER, DRAM

Combining memory control and DRAM functions in one chip enhances the efficiency and performance of the memory controller, making it a versatile solution for memory management in electronic devices.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high-speed operation of the memory controller, optimizing energy efficiency in electronic systems.

Terminal Form: J BEND

The J bend terminal form offers secure connections and ease of soldering, enhancing the reliability and durability of the memory controller in electronic circuits.

Maximum Supply Current: 140 mA

With a maximum supply current of 140 mA, this memory controller can deliver sufficient power to connected components for reliable and stable operation.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures consistent and stable power delivery to the memory controller, maintaining performance levels over extended periods of use.

No. of Banks: 2

Having multiple banks in the memory controller allows for efficient organization and management of data, enhancing memory access speeds and overall performance.

Terminal Pitch: 1.27 mm

The small terminal pitch enables compact and efficient connections on the memory controller, optimizing space usage on PCBs and enhancing overall design flexibility.

Technical Specifications

Memory Controllers TMS4500A-25FN attributes and parameters. Explore more Memory Controllers devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-J44

Length:

16.5862 mm

Low Power Mode:

NO

No. of Banks:

2

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Memory Controllers

Maximum Supply Current:

140 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

16.5862 mm

Peripheral IC Type:

Trade Compliance

TMS4500A-25FN Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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