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TACT83442-33

Texas Instruments

TACT83442-33 by Texas Instruments

TACT83442-33 by Texas Instruments is a Memory Controller with 100 terminals, operating at 0-70°C. It has a supply voltage of 5V and current of 0.1mA, suitable for commercial applications requiring CMOS technology in a surface-mount rectangular package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,893 parts In-Stock

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5,893

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Digiode

USA . 2,859 parts In-Stock

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2,859

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 922 parts In-Stock

1+ parts

$4.000

100+ parts

-

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922

$4.000

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AZTECH Wire

Italy . 252 parts In-Stock

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$6.525

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252

$6.525

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Corohmni

South Africa . 425 parts In-Stock

1+ parts

$47.832

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425

$47.832

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Parana Technologies

USA . 585 parts In-Stock

1+ parts

$59.699

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585

$59.699

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ChromeModa Solutions

Germany . 778 parts In-Stock

1+ parts

$67.077

100+ parts

$55.003

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778

$67.077

$55.003

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IDEA Electronic Components Group

UK . 433 parts In-Stock

1+ parts

$67.077

100+ parts

$63.723

1k+ parts

$60.369

10k+ parts

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433

$67.077

$63.723

$60.369

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DigiPath Technology Company

USA . 1,144 parts In-Stock

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$60.477

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1,144

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$60.477

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Corphita

USA . 565 parts In-Stock

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565

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Overview

Enhance your electronic designs with the TACT83442-33 by Texas Instruments, a top-tier memory controller that delivers exceptional performance and reliability. Manufactured by Texas Instruments, a trusted name in the industry, this product is a game-changer for various applications in the technology sector. With its advanced features and high-quality construction, the TACT83442-33 offers unparalleled value to customers seeking cutting-edge solutions for their projects. Upgrade your devices today with this innovative memory controller and experience the benefits of superior functionality and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is both lightweight and durable, making the memory controller easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Package Shape: RECTANGULAR

The rectangular shape ensures compatibility with standard PCB layouts and facilitates efficient use of space on the board.

Power Supplies (V): 5

Operating at 5V provides a stable power supply for the memory controller, ensuring reliable performance.

No. of Terminals: 100

Having a high number of terminals allows for versatile connectivity options, enabling the memory controller to interface with various components.

Package Style (Meter): FLATPACK

The flatpack style is space-saving and facilitates easy integration into circuit designs, making the memory controller a preferred choice for compact devices.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the memory controller can withstand demanding environmental conditions and maintain stable performance.

Minimum Operating Temperature: 0 °C

The memory controller can operate effectively in a wide range of temperature environments, ensuring consistent functionality in various applications.

Terminal Position: QUAD

The quad terminal position provides enhanced stability and connectivity, making the memory controller suitable for high-speed data transmission and communication.

Temperature Grade: COMMERCIAL

Designed for commercial use, this memory controller meets industry standards for performance and reliability in typical operating environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the memory controller energy-efficient and reliable in data processing.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and secure solder connections, ensuring long-term durability and stable operation of the memory controller.

Maximum Supply Current: 0.1 mA

With a low maximum supply current, the memory controller minimizes power consumption and heat generation, contributing to energy efficiency and prolonged lifespan.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources and stable performance of the memory controller.

Terminal Pitch: 0.635 mm

The small terminal pitch allows for high-density mounting of the memory controller on PCBs, enabling efficient use of space and enhancing connectivity options.

Technical Specifications

Memory Controllers TACT83442-33 attributes and parameters. Explore more Memory Controllers devices from Texas Instruments

Specs

JESD-30 Code:

R-PQFP-G100

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.7X1.0

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Memory Controllers

Maximum Supply Current:

.1 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Trade Compliance

TACT83442-33 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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