Loading...

SN74LS601AN3

Texas Instruments

SN74LS601AN3 by Texas Instruments

SN74LS601AN3 by Texas Instruments is a Memory Controller with 8-bit Address Bus Width and 64K X 1 Memory Organization. It operates at a voltage range of 4.75V to 5.25V, suitable for commercial temperature grades up to 70°C. This TTL technology IC has a package style of IN-LINE and is commonly used in DRAM memory applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,911 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,911

-

-

-

-

Digiode

USA . 3,836 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,836

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 831 parts In-Stock

1+ parts

$8.000

100+ parts

-

1k+ parts

-

10k+ parts

-

831

$8.000

-

-

-

AZTECH Wire

Italy . 448 parts In-Stock

1+ parts

$10.882

100+ parts

-

1k+ parts

-

10k+ parts

-

448

$10.882

-

-

-

Parana Technologies

USA . 1,993 parts In-Stock

1+ parts

$33.999

100+ parts

-

1k+ parts

$139.245

10k+ parts

-

1,993

$33.999

-

$139.245

-

DigiPath Technology Company

USA . 613 parts In-Stock

1+ parts

$37.437

100+ parts

$34.442

1k+ parts

-

10k+ parts

-

613

$37.437

$34.442

-

-

ChromeModa Solutions

Germany . 5,803 parts In-Stock

1+ parts

$38.201

100+ parts

$31.325

1k+ parts

-

10k+ parts

-

5,803

$38.201

$31.325

-

-

IDEA Electronic Components Group

UK . 1,760 parts In-Stock

1+ parts

$38.201

100+ parts

$36.291

1k+ parts

$34.381

10k+ parts

-

1,760

$38.201

$36.291

$34.381

-

Corohmni

South Africa . 806 parts In-Stock

1+ parts

$42.524

100+ parts

-

1k+ parts

-

10k+ parts

-

806

$42.524

-

-

-

Corphita

USA . 2,307 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,307

-

-

-

-

Overview

Unlock the power of efficient memory control with the SN74LS601AN3 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in its products. Memory Controllers like the SN74LS601AN3 are essential for seamless data management in various electronic devices. With a focus on providing value to customers, this product offers unmatched benefits and advantages, making it an ideal choice for your next project. Experience enhanced performance and productivity with the SN74LS601AN3 from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material of the package body provides durability and protection to the memory controller, making it a reliable choice for long-term use.

Maximum Supply Voltage: 5.25 V

With a maximum supply voltage of 5.25 V, this memory controller can handle fluctuations in power supply without getting damaged, ensuring stable performance.

Address Bus Width: 8

An address bus width of 8 allows for efficient communication between the memory controller and other components, enhancing data transfer speeds and overall performance.

Package Shape: RECTANGULAR

The rectangular package shape is space-efficient and easy to install, making the memory controller suitable for a variety of systems and applications.

Power Supplies (V): 5

Operating at a standard power supply voltage of 5 V, this memory controller is compatible with most systems and can be easily integrated into existing setups.

No. of Terminals: 20

With 20 terminals, this memory controller offers multiple connection points for secure and reliable data transmission, ensuring smooth operation.

Package Style (Meter): IN-LINE

The in-line package style is compact and easy to mount, making installation and maintenance of the memory controller hassle-free.

Minimum Supply Voltage: 4.75 V

The minimum supply voltage of 4.75 V ensures that the memory controller can function efficiently even under low power conditions, enhancing its overall reliability.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this memory controller can withstand heat and operate effectively in various environments.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures that the memory controller can function even in cold conditions, making it suitable for a wide range of applications.

Terminal Position: DUAL

The dual terminal position provides flexibility in installation and connectivity options, allowing for easy integration of the memory controller into different systems.

Maximum Seated Height: 5.08 mm

With a maximum seated height of 5.08 mm, this memory controller is compact and can be installed in tight spaces without compromising on performance.

Width: 7.62 mm

The width of 7.62 mm makes the memory controller suitable for systems with space constraints, offering a compact yet powerful solution for memory control.

Length: 24.325 mm

The length of 24.325 mm provides a balance between compactness and functionality, making the memory controller versatile and compatible with various systems.

Temperature Grade: COMMERCIAL

Designed for commercial use, this memory controller meets industry standards for reliability and performance, making it a trusted choice for businesses and organizations.

Peripheral IC Type: MEMORY CONTROLLER, DRAM

Featuring both memory controller and DRAM capabilities, this product offers versatile memory management functions, making it ideal for a wide range of applications.

Technology: TTL

Utilizing TTL technology, this memory controller ensures fast and reliable data transmission, enhancing system efficiency and performance.

Terminal Form: THROUGH-HOLE

The through-hole terminal form offers secure connections and easy soldering, ensuring durability and stability in the memory controller's installation.

Maximum Supply Current: 85 mA

With a maximum supply current of 85 mA, this memory controller consumes low power, making it energy-efficient and cost-effective for long-term use.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 V, this memory controller delivers consistent performance and compatibility with standard power supply systems.

Memory Organization: 64K X 1

The memory organization of 64K x 1 provides efficient data storage and retrieval capabilities, making the memory controller suitable for handling large volumes of information.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54 mm, this memory controller offers easy connectivity and compatibility with standard PCB layouts, simplifying installation and integration processes.

Technical Specifications

Memory Controllers SN74LS601AN3 attributes and parameters. Explore more Memory Controllers devices from Texas Instruments

Specs

Address Bus Width:

8

Boundary Scan:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T20

Length:

24.325 mm

Low Power Mode:

NO

Memory Organization:

64K X 1

No. of Banks:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Memory Controllers

Maximum Supply Current:

85 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Peripheral IC Type:

Trade Compliance

SN74LS601AN3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20