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THCT4502FN

Texas Instruments

THCT4502FN by Texas Instruments

THCT4502FN by Texas Instruments is a Memory Controller with 68 terminals, operating at 5V. It features CMOS technology, operates b/w 0-70°C, and comes in a square chip carrier package. Ideal for applications requiring memory control in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,767 parts In-Stock

1+ parts

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3,767

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Vyrian

USA . 2,999 parts In-Stock

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2,999

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 651 parts In-Stock

1+ parts

$6.000

100+ parts

-

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651

$6.000

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Parana Technologies

USA . 963 parts In-Stock

1+ parts

$13.811

100+ parts

-

1k+ parts

$14.297

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963

$13.811

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$14.297

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AZTECH Wire

Italy . 632 parts In-Stock

1+ parts

$14.876

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632

$14.876

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DigiPath Technology Company

USA . 1,336 parts In-Stock

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$15.208

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1,336

$15.208

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ChromeModa Solutions

Germany . 3,712 parts In-Stock

1+ parts

$15.518

100+ parts

$12.725

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3,712

$15.518

$12.725

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IDEA Electronic Components Group

UK . 1,799 parts In-Stock

1+ parts

$15.518

100+ parts

$14.742

1k+ parts

$13.966

10k+ parts

-

1,799

$15.518

$14.742

$13.966

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Corohmni

South Africa . 3,143 parts In-Stock

1+ parts

$31.012

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3,143

$31.012

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Corphita

USA . 1,866 parts In-Stock

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1,866

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Overview

Unlock the power of seamless memory control with the THCT4502FN by Texas Instruments. Crafted with precision and expertise, this memory controller boasts unrivaled quality and reliability. Perfect for a wide range of applications, this product offers unparalleled value and benefits to customers. Say goodbye to worries about compatibility and performance issues - experience the Texas Instruments advantage today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on printed circuit boards.

Package Shape: SQUARE

The square shape of the package helps with space-saving and efficient PCB layout designs.

Power Supplies (V): 5

Operating at a standard voltage of 5V makes it compatible with a wide range of systems and applications.

No. of Terminals: 68

The high number of terminals allows for greater connectivity and functionality in memory control operations.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides durability and protection for the memory controller.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the memory controller can reliably function in various environments.

Minimum Operating Temperature: 0 °C

The memory controller can operate efficiently even at low temperatures, ensuring reliability in different conditions.

Terminal Position: QUAD

The quad terminal position allows for easier and more secure connections on the PCB.

Temperature Grade: COMMERCIAL

Designed for commercial use, this memory controller is suitable for a wide range of consumer electronics and computer systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the memory controller efficient and reliable.

Terminal Form: J BEND

The J bend terminal form provides a secure and reliable connection to the PCB.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources and systems.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27mm allows for compact and space-efficient PCB designs.

Technical Specifications

Memory Controllers THCT4502FN attributes and parameters. Explore more Memory Controllers devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J68

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Memory Controllers

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

THCT4502FN Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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