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TIM99602J

Texas Instruments

TIM99602J by Texas Instruments

TIM99602J by Texas Instruments is a Memory Controller with 20 terminals, operating at 5V. It features TTL technology, operates b/w 0-70°C, and draws a max current of 85mA. This rectangular ceramic package is ideal for commercial applications requiring precise memory control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,310 parts In-Stock

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4,310

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Vyrian

USA . 3,791 parts In-Stock

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3,791

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 265 parts In-Stock

1+ parts

$15.908

100+ parts

-

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265

$15.908

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One Stop Electronics

USA . 578 parts In-Stock

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$18.000

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578

$18.000

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Parana Technologies

USA . 643 parts In-Stock

1+ parts

$27.304

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$34.386

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643

$27.304

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$34.386

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DigiPath Technology Company

USA . 1,738 parts In-Stock

1+ parts

$30.065

100+ parts

$27.660

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1,738

$30.065

$27.660

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IDEA Electronic Components Group

UK . 1,816 parts In-Stock

1+ parts

$30.679

100+ parts

$29.145

1k+ parts

$27.611

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1,816

$30.679

$29.145

$27.611

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ChromeModa Solutions

Germany . 477 parts In-Stock

1+ parts

$30.679

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$25.157

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477

$30.679

$25.157

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Corohmni

South Africa . 56 parts In-Stock

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$37.039

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56

$37.039

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Corphita

USA . 2,799 parts In-Stock

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2,799

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Overview

Unlock the potential of your electronic devices with the TIM99602J memory controller from Texas Instruments. Crafted with precision and expertise, this rectangular ceramic package boasts a durable construction and reliable performance. Ideal for a wide range of applications, this in-line package with 20 terminals offers seamless integration and enhanced functionality. With a nominal supply voltage of 5V and maximum supply current of 85mA, this commercial-grade technology ensures optimal power efficiency. Elevate your projects with the TIM99602J and experience unmatched quality and value that Texas Instruments is renowned for.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic provides better thermal conductivity and stability compared to plastic, ensuring reliable performance over a wide temperature range.

Power Supplies (V): 5

Operating at a standard 5V voltage makes it compatible with various systems and power sources, offering versatility and ease of integration.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this memory controller can withstand demanding environmental conditions without compromising performance.

Technology: TTL

Being based on TTL technology ensures fast and reliable signal processing, making this memory controller suitable for high-speed applications.

Maximum Supply Current: 85 mA

The low maximum supply current requirement helps in minimizing power consumption, making this memory controller energy-efficient for various applications.

Technical Specifications

Memory Controllers TIM99602J attributes and parameters. Explore more Memory Controllers devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T20

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Memory Controllers

Maximum Supply Current:

85 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TIM99602J Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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