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DP8422AV-20

Texas Instruments

DP8422AV-20 by Texas Instruments

DP8422AV-20 by Texas Instruments is a Memory Controller with 22-bit Address Bus, 20 MHz Clock Frequency, and 5V Nominal Voltage. Ideal for DRAM applications, it features low power mode and operates in commercial temperature grade.

Median Price

$15.380

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 57 parts In-Stock

1+ parts

$15.380

100+ parts

$11.540

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$10.000

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57

$15.380

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$10.000

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Vyrian

USA . 8,798 parts In-Stock

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Digiode

USA . 3,672 parts In-Stock

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Anansix

USA . 2,005 parts In-Stock

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2,005

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Resion

USA . 535 parts In-Stock

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535

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Q Components

USA . 19 parts In-Stock

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GES GmbH

Germany . 9 parts In-Stock

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Mentor Electronics Marketing, LLC

USA . 8 parts In-Stock

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Prism Electronics

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Electronic Expediters

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MRC Electronics

USA . 2 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 213 parts In-Stock

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$2.000

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AZTECH Wire

Italy . 324 parts In-Stock

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$18.007

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Corohmni

South Africa . 1,871 parts In-Stock

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$63.853

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Parana Technologies

USA . 197 parts In-Stock

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$64.132

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DigiPath Technology Company

USA . 678 parts In-Stock

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$70.617

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$64.967

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678

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ChromeModa Solutions

Germany . 1,904 parts In-Stock

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$72.058

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$59.088

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$72.058

$59.088

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IDEA Electronic Components Group

UK . 750 parts In-Stock

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$72.058

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$68.455

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$64.852

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750

$72.058

$68.455

$64.852

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Corphita

USA . 4,349 parts In-Stock

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Northwest PG Solutions

USA . 999 parts In-Stock

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999

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Native Components

USA . 874 parts In-Stock

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874

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Microchip USA

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Perfect Parts

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Overview

Unlock the power of advanced memory control with the DP8422AV-20 by Texas Instruments. Boasting unparalleled quality and reliability, this cutting-edge memory controller is designed to enhance your electronic projects with seamless performance and efficiency. Ideal for a wide range of applications, from consumer electronics to industrial automation, this innovative product offers exceptional value, benefits, and advantages to customers seeking top-notch solutions for their projects. Upgrade your devices with the DP8422AV-20 and experience the difference that superior technology can make in your creations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and minimizes the risk of damage during installation or handling.

Surface Mount: YES

Surface mount option allows for easier and more efficient PCB assembly and reduces the overall size of the final product.

Maximum Supply Voltage: 5.5 V

Can support a high supply voltage which is beneficial for stable and reliable operation in various applications.

Address Bus Width: 22

Wide address bus width allows for efficient data transfer and access to a larger memory range.

Package Shape: SQUARE

Square shape helps in easy PCB layout and optimization of space, making it suitable for compact designs.

Power Supplies (V): 5

Operates at a standard voltage, ensuring compatibility with most systems and power sources.

No. of Terminals: 84

Having a higher number of terminals allows for more connections and functionality, enabling versatile usage.

Package Style (Meter): CHIP CARRIER

Chip carrier style provides a compact and reliable package for the memory controller, suitable for space-constrained applications.

Minimum Supply Voltage: 4.5 V

Supports a range of supply voltages, offering flexibility in various operating conditions and power sources.

Maximum Operating Temperature: 70 °C

Capable of operating at higher temperatures without compromising performance, ensuring reliability in demanding environments.

Minimum Operating Temperature: 0 °C

Operates efficiently even at low temperatures, making it suitable for applications that require extended temperature ranges.

Terminal Finish: TIN LEAD

Tin lead finish provides good solderability and electrical conductivity, ensuring secure connections and stable performance.

Terminal Position: QUAD

Quad terminal position facilitates easy and secure mounting on the PCB, improving overall reliability and robustness.

Maximum Seated Height: 5.08 mm

Low profile design with maximum seated height helps in space-saving and enables the product to be used in slim devices.

Width: 29.3116 mm

Optimal width size for easy integration into different PCB layouts, offering flexibility in design and assembly.

Maximum Clock Frequency: 20 MHz

Supports a high clock frequency, enabling faster data processing and improved performance in memory operations.

Length: 29.3116 mm

Symmetrical length dimensions for balanced design and easier PCB integration, contributing to overall product efficiency.

Temperature Grade: COMMERCIAL

Commercial-grade components are suitable for general applications, providing reliability and consistent performance in standard working environments.

Peripheral IC Type: MEMORY CONTROLLER, DRAM

Integrated memory controller for DRAM improves memory management and access speed, enhancing overall system performance.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems, making it an energy-efficient choice.

Terminal Form: J BEND

J bend terminal form allows for secure connections and ease of soldering during assembly, ensuring robust electrical connections.

Maximum Supply Current: 75 mA

Operates at a low supply current, reducing power consumption and improving energy efficiency of the product.

Nominal Supply Voltage: 5 V

Stable and standard supply voltage ensures consistent performance and compatibility with most systems and power sources.

Memory Organization: 4M X 1

Efficient memory organization for improved data storage and access capabilities, suitable for high-performance memory applications.

No. of Banks: 4

Multiple memory banks allow for parallel data access and faster read/write operations, enhancing overall memory performance.

Terminal Pitch: 1.27 mm

Optimal terminal pitch for easy soldering and connections, enabling smooth integration into PCB designs and assembly processes.

Low Power Mode: YES

Low power mode option helps in reducing energy consumption and heat generation, ideal for power-efficient and battery-operated devices.

Technical Specifications

Memory Controllers DP8422AV-20 attributes and parameters. Explore more Memory Controllers devices from Texas Instruments

Specs

Address Bus Width:

22

Boundary Scan:

NO

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-J84

JESD-609 Code:

e0

Length:

29.3116 mm

Low Power Mode:

YES

Memory Organization:

4M X 1

No. of Banks:

4

No. of Terminals:

84

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC84,1.2SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Memory Controllers

Maximum Supply Current:

75 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

29.3116 mm

Peripheral IC Type:

Trade Compliance

DP8422AV-20 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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