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DP8422AV-25

Texas Instruments

DP8422AV-25 by Texas Instruments

DP8422AV-25 by Texas Instruments is a Memory Controller with 22-bit Address Bus, 25 MHz Clock Frequency, and 4M X 1 Memory Organization. It is used in DRAM applications for low power mode operation at temperatures ranging from 0 to 70°C.

Median Price

$15.320

Lifecycle Status

Suppliers In-Stock

28

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,164 parts In-Stock

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-

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$13.260

1k+ parts

$11.870

10k+ parts

$11.170

1,164

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$13.260

$11.870

$11.170

DigiKey

USA . 1,164 parts In-Stock

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$15.320

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$15.320

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Verical

USA . 1,164 parts In-Stock

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$16.575

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$14.838

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$13.963

1,164

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$16.575

$14.838

$13.963

Distributors (In-Stock)

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Digiode

USA . 2,652 parts In-Stock

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$13.994

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$13.994

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Vyrian

USA . 4,522 parts In-Stock

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$14.730

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$14.730

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Component Electronics Inc.

Canada . 2 parts In-Stock

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$23.080

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$17.310

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$15.000

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2

$23.080

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$15.000

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Anansix

USA . 1,839 parts In-Stock

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DigiKey Marketplace

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Extreme Components

USA . 646 parts In-Stock

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Electronics Depot

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ComSIT Distribution GmbH

Germany . 146 parts In-Stock

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ComSIT USA

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LIBRA Elektronik GmbH

Germany . 22 parts In-Stock

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GES GmbH

Germany . 19 parts In-Stock

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R&J Components

USA . 10 parts In-Stock

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Inland Empire Components Inc.

USA . 10 parts In-Stock

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Manoshevitz Elec. Sales

Israel . 7 parts In-Stock

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Classic Components Corporation

USA . 6 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 6 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 5 parts In-Stock

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J & M Industries LLC

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MRC Electronics

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Ashlea Components Ltd

UK . 4 parts In-Stock

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Elcom Components

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ACDS - Activité Composants Distribution Service

France . 3 parts In-Stock

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Semtec, LLC

USA . 1 parts In-Stock

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Legend Electronics Inc.

USA . 1 parts In-Stock

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Resion

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Distributors (Availability)

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Corphita

USA . 4,457 parts In-Stock

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$13.257

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$13.257

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Parana Technologies

USA . 394 parts In-Stock

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$23.355

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$23.992

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394

$23.355

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DigiPath Technology Company

USA . 349 parts In-Stock

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$25.717

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$23.660

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349

$25.717

$23.660

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IDEA Electronic Components Group

UK . 784 parts In-Stock

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$26.242

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$24.930

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$23.618

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784

$26.242

$24.930

$23.618

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ChromeModa Solutions

Germany . 92 parts In-Stock

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$26.242

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$21.518

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Corohmni

South Africa . 1,051 parts In-Stock

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$68.118

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Alle Elektronik GmbH

Germany . 4,639 parts In-Stock

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Glotronic Ltd.

UK . 3,500 parts In-Stock

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Northwest PG Solutions

USA . 880 parts In-Stock

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Native Components

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Microchip USA

USA . 345 parts In-Stock

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Overview

Enhance the performance and efficiency of your electronic devices with the DP8422AV-25 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability in their memory controllers. Ideal for a wide range of applications, this product offers unmatched value and benefits to customers. Experience seamless operation and optimized functionality with the DP8422AV-25, making it the perfect choice for all your memory controller needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and resistant to heat, making it suitable for protecting the internal components of the memory controller.

Surface Mount: YES

Surface mount technology allows for easy installation and produces reliable connections, enhancing the overall performance of the memory controller.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this memory controller can handle power fluctuations without compromising its functionality.

Address Bus Width: 22

A wide address bus width of 22 allows for efficient data transfer and access, improving the speed and performance of the memory controller.

Package Shape: SQUARE

Square package shape offers a compact design, making it easy to integrate the memory controller into various electronic devices.

Power Supplies (V): 5

Stable power supply at 5V ensures consistent and reliable operation of the memory controller.

No. of Terminals: 84

Having 84 terminals provides ample connectivity options for interfacing with other components, enhancing the versatility of the memory controller.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers a secure and robust package for the memory controller, protecting it from external elements.

Minimum Supply Voltage: 4.5 V

Low minimum supply voltage ensures efficient power consumption and prolongs the lifespan of the memory controller.

Maximum Operating Temperature: 70 °C

High maximum operating temperature of 70°C allows the memory controller to function reliably even in elevated temperature environments.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature of 0°C ensures that the memory controller can perform well in a wide range of temperature conditions.

Terminal Finish: TIN LEAD

TIN LEAD terminal finish offers good solderability and conductivity, ensuring a secure connection for the memory controller.

Terminal Position: QUAD

Quad terminal position provides stability and ease of installation, enhancing the overall reliability of the memory controller.

Maximum Seated Height: 5.08 mm

Low maximum seated height allows for a slim profile and easy integration of the memory controller into compact electronic devices.

Width: 29.3116 mm

Moderate width of 29.3116 mm offers a balance between compact design and adequate space for the components within the memory controller.

Maximum Clock Frequency: 25 MHz

With a high maximum clock frequency of 25 MHz, the memory controller can operate efficiently and process data quickly.

Length: 29.3116 mm

Similar to width, the length of 29.3116 mm provides a compact form factor for easy integration of the memory controller into electronic devices.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures that the memory controller meets industry standards for stability and performance in commercial applications.

Peripheral IC Type: MEMORY CONTROLLER, DRAM

This memory controller is specifically designed for managing DRAM memory, ensuring optimal compatibility and performance with DRAM modules.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the memory controller efficient and reliable in various operating conditions.

Terminal Form: J BEND

J BEND terminal form provides mechanical strength and reliable connections, ensuring long-term performance of the memory controller.

Maximum Supply Current: 95 mA

With a maximum supply current of 95 mA, the memory controller operates efficiently without drawing excessive power, prolonging battery life in portable devices.

Nominal Supply Voltage: 5 V

Nominal supply voltage of 5V ensures stable operation and compatibility with standard power sources, making the memory controller versatile for different applications.

Memory Organization: 4M X 1

Memory organization of 4M X 1 allows for efficient storage and retrieval of large amounts of data, enhancing the memory capacity of the controller.

No. of Banks: 4

Having 4 banks allows for parallel access to memory storage, improving the overall performance and speed of the memory controller.

Terminal Pitch: 1.27 mm

Terminal pitch of 1.27 mm offers easy soldering and connection options, ensuring a reliable interface for the memory controller.

Low Power Mode: YES

Low power mode feature enables energy-efficient operation of the memory controller, reducing power consumption and prolonging battery life in electronic devices.

Technical Specifications

Memory Controllers DP8422AV-25 attributes and parameters. Explore more Memory Controllers devices from Texas Instruments

Specs

Address Bus Width:

22

Boundary Scan:

NO

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-J84

JESD-609 Code:

e0

Length:

29.3116 mm

Low Power Mode:

YES

Memory Organization:

4M X 1

No. of Banks:

4

No. of Terminals:

84

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC84,1.2SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Memory Controllers

Maximum Supply Current:

95 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

29.3116 mm

Peripheral IC Type:

Trade Compliance

DP8422AV-25 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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