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LE82GM965

Intel

LE82GM965 by Intel

LE82GM965 by Intel is a memory controller with 64-bit external data bus width, 256M x 64 memory organization, and low power mode. It is suitable for applications requiring ATA, I2C, ISA, LPC, PCI, SIO, SMBUS, SPI, or USB bus compatibility. The package style is grid array with a square shape and plastic/epoxy material.

Median Price

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Vyrian

USA . 458 parts In-Stock

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Digiode

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Nova Conductors

Japan . 42 parts In-Stock

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Ampacity Inc.

Singapore . 1,460 parts In-Stock

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$16.000

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$16.000

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MARBEL Systems

Belgium . 2,050 parts In-Stock

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$19.110

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Texas Native Microelectronics

USA . 1,790 parts In-Stock

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$21.966

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$20.428

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$19.330

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$19.330

Kenton Components

USA . 19,960 parts In-Stock

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$26.359

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$23.196

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Andel Nordic

Denmark . 3,498 parts In-Stock

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$40.980

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$28.687

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$28.687

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$28.687

Qasali Group International

UK . 482 parts In-Stock

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$59.308

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Corohmni

South Africa . 2,075 parts In-Stock

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Argo Parts USA

USA . 5,755 parts In-Stock

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Continental Prestige Electronics

USA . 2,292 parts In-Stock

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Corphita

USA . 398 parts In-Stock

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Kepictronics

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Aranea Global

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Overview

Enhance your device's performance with the Intel LE82GM965 Memory Controller. Manufactured by Intel, this cutting-edge component offers unmatched quality and reliability. Perfect for a wide range of applications, this memory controller delivers seamless data processing and efficient power management. Upgrade your system today and experience the superior value and benefits that only Intel can provide. Unlock new possibilities and take your device to the next level with the LE82GM965.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount capability enables easy integration onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 1.1025 V

The high maximum supply voltage allows for stable performance in various operating conditions.

Address Bus Width: 15

With a wider address bus width, the memory controller can efficiently handle larger amounts of data.

Package Shape: SQUARE

The square package shape offers uniformity and ease of mounting on the PCB.

No. of Terminals: 1299

Having a high number of terminals enables connectivity with various components, enhancing versatility.

Package Style (Meter): GRID ARRAY

The grid array package style provides reliable connections and efficient heat dissipation for improved performance.

Minimum Supply Voltage: 0.9975 V

The low minimum supply voltage ensures power efficiency and extends the product's battery life.

Terminal Position: BOTTOM

Bottom terminal position simplifies the assembly process and facilitates better heat dissipation.

Maximum Seated Height: 1.73 mm

The low maximum seated height allows for a compact design, suitable for slim devices.

Width: 35 mm

The moderate width size enables easy integration into different device form factors.

External Data Bus Width: 64

A wider external data bus width enhances data transfer speeds and overall system performance.

Length: 35 mm

The matching length and width dimensions make the memory controller suitable for various compact designs.

Peripheral IC Type: MEMORY CONTROLLER, DRAM

Being a memory controller with DRAM support, it ensures efficient management and access to memory resources.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliability for optimal performance.

Terminal Form: BALL

Ball terminal form provides secure connections and facilitates easier installation on the PCB.

Nominal Supply Voltage: 1.05 V

The nominal supply voltage ensures stable and efficient operation within the specified voltage range.

Memory Organization: 256M X 64

The memory organization configuration allows for handling large amounts of data efficiently and effectively.

No. of Banks: 8

Having multiple banks enhances memory management capabilities and data access performance.

Bus Compatibility: ATA, I2C, ISA, LPC, PCI, SIO, SMBUS, SPI, USB

Compatibility with various bus standards ensures seamless integration with a wide range of devices and systems.

Low Power Mode: YES

The low power mode feature enhances energy efficiency and prolongs battery life, making it an ideal choice for portable devices.

Technical Specifications

Memory Controllers LE82GM965 attributes and parameters. Explore more Memory Controllers devices from Intel

Specs

Address Bus Width:

15

Boundary Scan:

NO

Bus Compatibility:

ATA, I2C, ISA, LPC, PCI, SIO, SMBUS, SPI, USB

External Data Bus Width:

64

JESD-30 Code:

S-PBGA-B1299

Length:

35 mm

Low Power Mode:

YES

Memory Organization:

256M X 64

No. of Banks:

8

No. of Terminals:

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

1.73 mm

Maximum Supply Voltage:

1.1025 V

Minimum Supply Voltage:

.9975 V

Nominal Supply Voltage:

1.05 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Position:

BOTTOM

Width:

35 mm

Peripheral IC Type:

Trade Compliance

LE82GM965 Peripheral ICs trade compliance attributes, and parameters.

ECCN

4A994

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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