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SN74LS602ADWR

Texas Instruments

SN74LS602ADWR by Texas Instruments

SN74LS602ADWR by Texas Instruments is a Memory Controller IC with 16K X 1 memory organization. It operates b/w 0-70°C, with supply voltage range of 4.75-5.25 V. Suitable for DRAM applications due to its TTL technology and small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,959 parts In-Stock

1+ parts

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1k+ parts

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6,959

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Digiode

USA . 1,009 parts In-Stock

1+ parts

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1k+ parts

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1,009

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 857 parts In-Stock

1+ parts

$6.404

100+ parts

-

1k+ parts

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10k+ parts

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857

$6.404

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Corohmni

South Africa . 2,554 parts In-Stock

1+ parts

$18.795

100+ parts

-

1k+ parts

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10k+ parts

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2,554

$18.795

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Parana Technologies

USA . 1,640 parts In-Stock

1+ parts

$18.863

100+ parts

$1,751.684

1k+ parts

$16.976

10k+ parts

-

1,640

$18.863

$1,751.684

$16.976

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DigiPath Technology Company

USA . 1,622 parts In-Stock

1+ parts

$20.770

100+ parts

-

1k+ parts

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10k+ parts

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1,622

$20.770

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ChromeModa Solutions

Germany . 3,118 parts In-Stock

1+ parts

$21.194

100+ parts

$17.379

1k+ parts

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10k+ parts

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3,118

$21.194

$17.379

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IDEA Electronic Components Group

UK . 1,765 parts In-Stock

1+ parts

$21.194

100+ parts

$20.134

1k+ parts

$19.075

10k+ parts

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1,765

$21.194

$20.134

$19.075

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One Stop Electronics

USA . 505 parts In-Stock

1+ parts

$34.000

100+ parts

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505

$34.000

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Corphita

USA . 3,354 parts In-Stock

1+ parts

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3,354

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Overview

Enhance your memory control systems with the SN74LS602ADWR by Texas Instruments, a leading manufacturer known for top-quality components. This small outline package offers high reliability and precision in memory controller applications. With a wide address bus width of 7, this device ensures seamless data management while operating within a temperature range of 0 to 70°C. Upgrade your systems today with the SN74LS602ADWR and experience superior performance and efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durable and lightweight construction, making the product easy to handle and transport.

Surface Mount: YES

Being surface mountable allows for easy and convenient mounting on circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage tolerance provides flexibility and reliability in operation, reducing the risk of damage due to voltage fluctuations.

Address Bus Width: 7

With a wider address bus width, the memory controller can handle larger amounts of data efficiently, enabling faster processing speeds.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into various system designs, optimizing space utilization and compatibility.

No. of Terminals: 20

Having a sufficient number of terminals facilitates secure connections and ensures proper functionality within the system.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage requirement enables the product to operate effectively even under low power conditions, enhancing overall reliability.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range allows for reliable performance in various environmental conditions, enhancing product durability and longevity.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures functionality in colder environments, making the product suitable for a wide range of applications.

Terminal Position: DUAL

The dual terminal position provides flexibility in mounting options and facilitates secure connections, ensuring stable performance in the system.

Maximum Seated Height: 2.65 mm

The maximum seated height specification allows for compatibility with compact designs and slim profile requirements, making the product versatile in various applications.

Width: 7.5 mm

The compact width dimension enables easy integration into tight spaces, optimizing PCB layout and system design efficiency.

Length: 12.8 mm

The moderate length dimension offers a balance between space-saving and functionality, making the product suitable for diverse system configurations.

Temperature Grade: COMMERCIAL

Designed for commercial use, the temperature grade ensures reliable performance in standard operating conditions, providing consistent functionality for commercial applications.

Peripheral IC Type: MEMORY CONTROLLER, DRAM

The specific peripheral IC type indicates the product's compatibility with memory controller and DRAM components, ensuring seamless integration and efficient memory management.

Technology: TTL

Utilizing TTL technology ensures high-speed data processing and reliable communication within the system, enhancing overall performance and efficiency.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and secure connections, ensuring reliable electrical contact and stable operation of the product.

Nominal Supply Voltage: 5 V

The nominal supply voltage specification indicates the standard voltage requirement for optimal performance, ensuring compatibility with common power sources.

Memory Organization: 16K X 1

The memory organization specification denotes the product's memory capacity and configuration, allowing for efficient storage and retrieval of data for various applications.

Terminal Pitch: 1.27 mm

The small terminal pitch enables high-density mounting on PCBs, optimizing space utilization and supporting compact system designs.

Technical Specifications

Memory Controllers SN74LS602ADWR attributes and parameters. Explore more Memory Controllers devices from Texas Instruments

Specs

Address Bus Width:

7

Boundary Scan:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Low Power Mode:

NO

Memory Organization:

16K X 1

No. of Banks:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

SN74LS602ADWR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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