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SN74ACT4503N

Texas Instruments

SN74ACT4503N by Texas Instruments

SN74ACT4503N by Texas Instruments is a Memory Controller IC with 20-bit address bus width, 5V nominal voltage, and 4 banks. It is designed for DRAM applications, featuring CMOS technology and operating temperature range of 0-70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,380 parts In-Stock

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3,380

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Vyrian

USA . 2,899 parts In-Stock

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2,899

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 862 parts In-Stock

1+ parts

$9.190

100+ parts

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862

$9.190

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One Stop Electronics

USA . 1,298 parts In-Stock

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$22.000

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-

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1,298

$22.000

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Parana Technologies

USA . 432 parts In-Stock

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$35.680

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432

$35.680

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DigiPath Technology Company

USA . 1,852 parts In-Stock

1+ parts

$39.288

100+ parts

$36.145

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1,852

$39.288

$36.145

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ChromeModa Solutions

Germany . 5,385 parts In-Stock

1+ parts

$40.090

100+ parts

$32.874

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5,385

$40.090

$32.874

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IDEA Electronic Components Group

UK . 837 parts In-Stock

1+ parts

$40.090

100+ parts

$38.086

1k+ parts

$36.081

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837

$40.090

$38.086

$36.081

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Corohmni

South Africa . 2,523 parts In-Stock

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$55.915

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2,523

$55.915

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Corphita

USA . 2,392 parts In-Stock

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Overview

Unlock the power of efficient memory control with the SN74ACT4503N by Texas Instruments. As a leader in semiconductor manufacturing, Texas Instruments ensures top-quality products for all applications. The SN74ACT4503N is a versatile memory controller designed to optimize performance and reliability in various electronic devices. With its durable construction and innovative technology, this product offers customers unparalleled value and benefits. Upgrade your system with the SN74ACT4503N and experience seamless operation and enhanced productivity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the product easy to handle and long-lasting.

Address Bus Width: 20

Having a wider address bus width allows for more efficient data transfer and processing, enhancing overall performance.

Power Supplies (V): 5

Operating at a standard voltage of 5V ensures compatibility with a wide range of systems and devices.

No. of Terminals: 52

Having a high number of terminals provides connectivity options for various components, improving versatility.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can withstand demanding usage conditions without overheating.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation, making the product efficient and reliable.

Nominal Supply Voltage: 5 V

Operating at a standard voltage of 5V ensures stable performance and compatibility with a wide range of systems.

No. of Banks: 4

Multiple memory banks allow for simultaneous access to data, increasing efficiency and speed.

Technical Specifications

Memory Controllers SN74ACT4503N attributes and parameters. Explore more Memory Controllers devices from Texas Instruments

Specs

Address Bus Width:

20

Boundary Scan:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T52

Length:

66.55 mm

Low Power Mode:

NO

No. of Banks:

4

No. of Terminals:

52

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP52,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Memory Controllers

Maximum Supply Current:

50 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

15.24 mm

Peripheral IC Type:

Trade Compliance

SN74ACT4503N Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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