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DP8421AV-25

Texas Instruments

DP8421AV-25 by Texas Instruments

DP8421AV-25 by Texas Instruments is a Memory Controller with 20-bit Address Bus, 25 MHz Clock Frequency, and 5V Nominal Voltage. It is used in DRAM applications for low power mode operation at temperatures ranging from 0 to 70°C.

Median Price

$23.610

Lifecycle Status

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26

In-Stock Inventory

1k+

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Rochester

USA . 926 parts In-Stock

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$20.430

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DigiKey

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Verical

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$21.500

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Digiode

USA . 2,715 parts In-Stock

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Vyrian

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Bristol Electronics

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Anansix

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DigiKey Marketplace

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Connector Distribution Corp

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Right Parts Inc.

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J & M Industries LLC

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Diverse Electronics

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Lakeland Logistics Inc

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Mil-Aero Solutions, Inc.

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PC Components Company LLC

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ComSIT Distribution GmbH

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EMSNET

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Legend Electronics Inc.

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Prism Electronics

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Electro Mavin

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Corel Iberica Componentes, S.L.

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Northwest PG Solutions

USA . 469 parts In-Stock

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Parana Technologies

USA . 1,357 parts In-Stock

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Corphita

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ChromeModa Solutions

Germany . 1,703 parts In-Stock

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IDEA Electronic Components Group

UK . 1,113 parts In-Stock

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Corohmni

South Africa . 2,523 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Alle Elektronik GmbH

Germany . 3,786 parts In-Stock

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DigiPath Technology Company

USA . 2,132 parts In-Stock

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Native Components

USA . 756 parts In-Stock

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Microchip USA

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Overview

Unlock the next level of performance with the Texas Instruments DP8421AV-25 Memory Controller. Designed with precision and expertise, this innovative product offers seamless integration and reliable functionality for a wide range of applications. From enhancing data processing speed to optimizing memory organization, this chip carrier is a game-changer in the industry. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations, providing you with unmatched value and performance. Choose quality, choose reliability, choose Texas Instruments for all your memory controller needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material offers good durability and protection for the memory controller, making it a reliable choice for long-term use.

Maximum Supply Voltage: 5.5 V

A higher maximum supply voltage allows for greater flexibility in power input, ensuring stable operation even in fluctuating voltage conditions.

Package Shape: SQUARE

The square package shape is compact and space-efficient, making it suitable for devices with limited physical space for components.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this memory controller can withstand high temperatures without sacrificing performance.

Technology: CMOS

CMOS technology offers low power consumption and fast switching speeds, making the memory controller efficient and responsive in data processing.

Technical Specifications

Memory Controllers DP8421AV-25 attributes and parameters. Explore more Memory Controllers devices from Texas Instruments

Specs

Address Bus Width:

20

Boundary Scan:

NO

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e0

Length:

24.2316 mm

Low Power Mode:

YES

Memory Organization:

1M X 1

No. of Banks:

4

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Memory Controllers

Maximum Supply Current:

95 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.2316 mm

Peripheral IC Type:

Trade Compliance

DP8421AV-25 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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