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DP8421AV-20

Texas Instruments

DP8421AV-20 by Texas Instruments

DP8421AV-20 by Texas Instruments is a Memory Controller with 20-bit Address Bus, 5V Power Supply, and 20MHz Clock Frequency. Ideal for DRAM applications, it features low power mode and operates in commercial temperature range of 0-70°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,740 parts In-Stock

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Digiode

USA . 4,670 parts In-Stock

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4,670

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Anansix

USA . 291 parts In-Stock

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291

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First Choice Components Inc.

USA . 42 parts In-Stock

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J & M Industries LLC

USA . 27 parts In-Stock

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Q Components

USA . 26 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 14 parts In-Stock

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Manoshevitz Elec. Sales

Israel . 8 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 2 parts In-Stock

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Odi Ramu Company

Canada . 1 parts In-Stock

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One Stop Electronics

USA . 1,177 parts In-Stock

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$2.000

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Native Components

USA . 596 parts In-Stock

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$7.010

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AZTECH Wire

Italy . 416 parts In-Stock

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$14.828

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Parana Technologies

USA . 866 parts In-Stock

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$52.859

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DigiPath Technology Company

USA . 1,672 parts In-Stock

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$58.204

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$53.548

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Corohmni

South Africa . 58 parts In-Stock

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ChromeModa Solutions

Germany . 6,225 parts In-Stock

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$48.701

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IDEA Electronic Components Group

UK . 1,758 parts In-Stock

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$59.392

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$56.422

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$53.453

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Glotronic Ltd.

UK . 3,500 parts In-Stock

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Northwest PG Solutions

USA . 1,312 parts In-Stock

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Corphita

USA . 1,270 parts In-Stock

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Microchip USA

USA . 473 parts In-Stock

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Kepictronics

USA . 330 parts In-Stock

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A-Plus Industry Inc.

USA . 5 parts In-Stock

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Overview

Unlock the power of seamless memory control with the DP8421AV-20 by Texas Instruments. Crafted with precision and expertise, this memory controller offers unparalleled quality and reliability. Ideal for a wide range of applications, this product delivers exceptional performance and efficiency. Experience the value and benefits that come with choosing Texas Instruments as your trusted manufacturer. Elevate your projects with the DP8421AV-20 and witness the difference in quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the memory controller, making it a reliable choice for long-term use.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5V, this memory controller can handle higher voltages, offering flexibility in power supply options.

Address Bus Width: 20

A wider address bus width of 20 allows for efficient data transfer and access, enhancing the performance of the memory controller.

Maximum Operating Temperature: 70 °C

The memory controller can operate at a maximum temperature of 70°C, ensuring reliable performance even under high temperature conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the memory controller energy-efficient and reliable.

Maximum Clock Frequency: 20 MHz

The high clock frequency of 20 MHz enables fast data processing and communication within the memory controller, improving overall system performance.

Technical Specifications

Memory Controllers DP8421AV-20 attributes and parameters. Explore more Memory Controllers devices from Texas Instruments

Specs

Address Bus Width:

20

Boundary Scan:

NO

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e0

Length:

24.2316 mm

Low Power Mode:

YES

Memory Organization:

1M X 1

No. of Banks:

4

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Memory Controllers

Maximum Supply Current:

75 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.2316 mm

Peripheral IC Type:

Trade Compliance

DP8421AV-20 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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