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TMS4500AN

Texas Instruments

TMS4500AN by Texas Instruments

TMS4500AN by Texas Instruments is a Memory Controller IC with 16-bit address bus width and CMOS technology. It features 40 terminals in an in-line package style, suitable for DRAM applications. Operating temperature ranges from 0°C to 70°C, making it ideal for commercial-grade memory control systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,890 parts In-Stock

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Digiode

USA . 4,916 parts In-Stock

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One Stop Electronics

USA . 935 parts In-Stock

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$4.000

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935

$4.000

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AZTECH Wire

Italy . 562 parts In-Stock

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$7.476

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562

$7.476

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Corohmni

South Africa . 764 parts In-Stock

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$59.104

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764

$59.104

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Parana Technologies

USA . 1,241 parts In-Stock

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$68.754

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1,241

$68.754

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ChromeModa Solutions

Germany . 902 parts In-Stock

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$77.252

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$63.347

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902

$77.252

$63.347

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IDEA Electronic Components Group

UK . 612 parts In-Stock

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$77.252

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$73.389

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$69.527

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612

$77.252

$73.389

$69.527

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Corphita

USA . 3,215 parts In-Stock

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DigiPath Technology Company

USA . 2,002 parts In-Stock

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$69.650

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Overview

Unlock the power of efficient memory control with the TMS4500AN by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. The TMS4500AN is perfect for a wide range of applications in memory controllers, offering seamless performance and ease of use. Experience the value and benefits of this product as it enhances your system's efficiency and effectiveness. Trust Texas Instruments to provide you with cutting-edge solutions for your memory control needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Using plastic/epoxy as the package body material provides durability and protection to the memory controller, making it a reliable choice for various applications.

Address Bus Width: 16

With a 16-bit address bus width, this memory controller can efficiently handle memory addresses, allowing for faster data retrieval and processing.

Package Shape: RECTANGULAR

The rectangular package shape ensures easy integration and installation of the memory controller into different systems and devices.

No. of Terminals: 40

Having 40 terminals allows for multiple connections and interfaces, enabling compatibility with a wide range of memory modules and components.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures that the memory controller can operate efficiently in varying environmental conditions without overheating.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures that the memory controller can function reliably even in cold environments.

Width: 15.24 mm

The compact width of 15.24 mm makes this memory controller suitable for devices with limited space, allowing for versatile integration.

Length: 52.455 mm

The length of 52.455 mm strikes a balance between compactness and functionality, making it ideal for various electronic applications.

Technical Specifications

Memory Controllers TMS4500AN attributes and parameters. Explore more Memory Controllers devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T40

Length:

52.455 mm

Low Power Mode:

NO

No. of Banks:

2

No. of Terminals:

40

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Peripheral IC Type:

Trade Compliance

TMS4500AN Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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