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TMS4500A-20NL

Texas Instruments

TMS4500A-20NL by Texas Instruments

TMS4500A-20NL by Texas Instruments is a Memory Controller with 16-bit Address Bus, operating at 5V. It has 40 terminals in an IN-LINE package style and supports DRAM technology. Ideal for commercial applications requiring memory control functions within the temperature range of 0 to 70°C.

Median Price

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Lifecycle Status

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In-Stock Inventory

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Vyrian

USA . 2,253 parts In-Stock

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Digiode

USA . 391 parts In-Stock

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Bristol Electronics

USA . 91 parts In-Stock

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Electronic Expediters

USA . 66 parts In-Stock

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A2Z Electronics, Inc.

USA . 55 parts In-Stock

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PC Components Company LLC

USA . 36 parts In-Stock

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Q Components

USA . 26 parts In-Stock

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Component Electronics Inc.

Canada . 18 parts In-Stock

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MISTER SPROCKETS

USA . 10 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 5 parts In-Stock

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MRC Electronics

USA . 3 parts In-Stock

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Digital Electronic Gebert Verwaltungs UG

Germany . 1 parts In-Stock

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J & M Industries LLC

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AZTECH Wire

Italy . 896 parts In-Stock

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One Stop Electronics

USA . 265 parts In-Stock

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Parana Technologies

USA . 432 parts In-Stock

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DigiPath Technology Company

USA . 800 parts In-Stock

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$35.415

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ChromeModa Solutions

Germany . 1,214 parts In-Stock

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IDEA Electronic Components Group

UK . 1,076 parts In-Stock

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$34.331

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$32.524

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Corohmni

South Africa . 636 parts In-Stock

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Corphita

USA . 4,612 parts In-Stock

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Overview

Enhance your electronic devices with the TMS4500A-20NL by Texas Instruments, a top-tier manufacturer known for its superior quality and reliability. This memory controller is designed to optimize performance and efficiency in various applications. Whether you're looking to upgrade your gaming console or streamline your industrial equipment, this product offers unmatched value, benefits, and advantages. Trust Texas Instruments to deliver cutting-edge technology that exceeds your expectations. Choose the TMS4500A-20NL for unparalleled innovation and seamless integration into your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and reliability of the memory controller.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in power input, making it suitable for a variety of applications.

Address Bus Width: 16

With a wide address bus width of 16, this memory controller can handle larger amounts of data efficiently.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration and mounting in electronic systems.

Power Supplies (V): 5

The memory controller operates on a standard power supply voltage of 5V, making it compatible with most systems.

No. of Terminals: 40

Having 40 terminals provides ample connectivity options for interfacing with other components in the system.

Package Style (Meter): IN-LINE

The in-line package style saves space and allows for efficient PCB design and layout.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures stable operation even under fluctuating power conditions.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this memory controller can withstand extended periods of use without overheating.

Minimum Operating Temperature: 0 °C

The memory controller can operate in a wide range of temperatures, making it suitable for various environments.

Terminal Position: DUAL

The dual terminal position ensures secure connections and prevents signal interference.

Maximum Seated Height: 5.08 mm

The low maximum seated height allows for compact and space-saving installations.

Width: 15.24 mm

The memory controller's width is optimized for easy integration and compatibility with standard PCB sizes.

Length: 52.455 mm

The length of the memory controller provides sufficient space for all necessary components and circuitry.

Temperature Grade: COMMERCIAL

Designed for commercial use, this memory controller meets industry standards for performance and reliability.

Peripheral IC Type: MEMORY CONTROLLER, DRAM

As a memory controller for DRAM, this product offers efficient and optimized memory management for high-speed data processing.

Technology: CMOS

Utilizing CMOS technology, this memory controller offers low power consumption and high speed performance.

Terminal Form: THROUGH-HOLE

The through-hole terminal form ensures secure soldering connections for long-term reliability.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V, this memory controller delivers stable and consistent performance.

No. of Banks: 2

Having 2 memory banks allows for efficient data storage and retrieval, enhancing overall system performance.

Terminal Pitch: 2.54 mm

With a standard terminal pitch of 2.54mm, this memory controller is compatible with common connector types and PCB layouts.

Technical Specifications

Memory Controllers TMS4500A-20NL attributes and parameters. Explore more Memory Controllers devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T40

Length:

52.455 mm

Low Power Mode:

NO

No. of Banks:

2

No. of Terminals:

40

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Memory Controllers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

15.24 mm

Peripheral IC Type:

Trade Compliance

TMS4500A-20NL Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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