Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Intel's QG82945GMESLA9H Memory Controller features 1466 terminals, CMOS technology, and a max supply current of 5500mA. This plastic/epoxy package with grid array style is surface mountable and suitable for various applications requiring power supplies ranging from 1V to 3.3V.
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Corphita
Kepictronics
PLASTIC/EPOXY material helps in reducing the overall weight of the product and provides good insulation properties.
Surface mount technology makes the product easy to assemble on printed circuit boards, saving space and reducing assembly time.
The wide range of power supply options allows for compatibility with different systems, providing flexibility in usage.
Having a large number of terminals allows for connection to multiple memory devices, enabling efficient data transfer.
The grid array package style ensures better heat dissipation and improved electrical performance, making it ideal for high-performance applications.
Bottom terminal position allows for easy and secure connection to the circuit board, enhancing reliability and stability.
CMOS technology offers low power consumption, high speed, and reliability, making the memory controller energy-efficient and high-performing.
Ball terminal form provides superior solder joint reliability and enables high-density mounting, ensuring long-term functionality of the product.
The high maximum supply current capability makes the memory controller suitable for demanding applications that require high power output.
Memory Controllers QG82945GMESLA9H attributes and parameters. Explore more Memory Controllers devices from Intel
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QG82945GMESLA9H Peripheral ICs trade compliance attributes, and parameters.
HTS
8542.31.00.01
SB
8542.31.00.00
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
1N4148WT
Good-ark Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
B340A-13-F
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Rugao Dachang Electronic
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
STM32H753ZIT6
STMicroelectronics
STM32H753ZIT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, offering 20-Ch 16-Bit ADC and 2-Ch 12-Bit DAC channels. With a clock frequency of up to 48 MHz, it is ideal for industrial applications requiring CAN, Ethernet, and USB connectivity. This microcontroller operates b/w -40°C to +85°C temperature range.
1N4148
Terry Semiconductor
RECTIFIER DIODE; Surface Mount: NO; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; JESD-609 Code: e0; Maximum Repetitive Peak Reverse Voltage: 100 V;
LL4148-GS08
Telefunken Microelectronics
RECTIFIER DIODE; Surface Mount: YES; JESD-609 Code: e0; No. of Elements: 1; Maximum Operating Temperature: 175 Cel; Maximum Non Repetitive Peak Forward Current: 2 A;
IRLML6401TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Minimum Operating Temperature: -55 Cel; Avalanche Energy Rating (EAS): 33 mJ;
LM555CM
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
BAV99
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N7002
Onsemi
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Finish: Matte Tin (Sn) - annealed; Transistor Element Material: SILICON;
BSS138
Vishay Semiconductors
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Style (Meter): SMALL OUTLINE; Package Shape: RECTANGULAR; Transistor Application: SWITCHING;
FDN306P
FDN306P by Onsemi is a P-CHANNEL FET with 12V DS Breakdown Voltage, ideal for SWITCHING applications. It features SINGLE configuration with BUILT-IN DIODE and GULL WING terminals. Operating in ENHANCEMENT MODE, it has a max ID of 2.6A and 0.04 ohm RDS(on), suitable for small outline packages at temperatures ranging from -55 to 150°C.
TDK
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); No. of Phases: 1; No. of Elements: 1; Maximum Output Current: .2 A;
MC7805CTG
MC7805CTG by Onsemi is a fixed positive single output standard regulator with an output voltage of 5V and max current of 1A. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring stable voltage regulation. The package style is flange mount with through-hole terminals, ensuring easy installation and reliability in diverse electronic designs.
BAT54SLT1G
BAT54SLT1G by Onsemi is a fast recovery Schottky diode with 2 elements in series connected configuration. It has a max reverse recovery time of 0.005 us and a max forward voltage of 0.8 V. Ideal for applications requiring high-speed rectification, it operates b/w -55 to 150 °C and can handle a max output current of 0.2 A.
2N2222A
Crystalonics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Kec
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Transistor Application: SWITCHING; Package Body Material: PLASTIC/EPOXY;
FSMLF327
Fox Electronics
FSMLF327 by Fox Electronics is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing such as communication systems, industrial automation, and consumer electronics. Operating temperature range from -40 to 85 °C.
ULN2803A
Allegro MicroSystems
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Maximum Operating Temperature: 85 Cel; Terminal Form: THROUGH-HOLE;
SN74LS602N1
Texas Instruments
SN74LS602N1 by Texas Instruments is a Memory Controller with 20 terminals, operating at 5V. It has a max supply current of 85mA and operates b/w 0-70°C. This TTL technology chip in PLASTIC/EPOXY package is ideal for commercial applications requiring reliable memory control.
SN74ALS2967N
SN74ALS2967N by Texas Instruments is a Memory Controller with 18-bit Address Bus, 1M X 16 Memory Organization, and operates at 5V. It is used in DRAM applications, has a package style of IN-LINE, and supports a max supply voltage of 5.5V for commercial temperature grades.
SN74ALS6302N3
SN74ALS6302N3 by Texas Instruments is a Memory Controller with 52 terminals, operating at 5V. It features TTL technology, 220mA max supply current, and operates b/w 0-70°C. This rectangular package is ideal for commercial applications requiring precise memory control in electronic systems.
SN74ALS6301JD
SN74ALS6301JD by Texas Instruments is a Memory Controller with 20-bit Address Bus, 5V Power Supply, and 1M x 16 Memory Organization. It operates b/w 0-70°C and has a max supply current of 220mA. This IC is ideal for DRAM applications due to its commercial temperature grade and through-hole terminal form.
SNC54LS600J
SNC54LS600J by Texas Instruments is a MIL-STD-883 Class B Memory Controller with 20 terminals, operating at temperatures from -55 to 125°C. It utilizes TTL technology, requires 5V supply voltage, and has a max supply current of 85mA. Ideal for military applications due to its rugged design and high temperature tolerance.
L64850GC-33
Broadcom
Memory Controllers; Temperature Grade: COMMERCIAL; Terminal Form: PIN/PEG; No. of Terminals: 223; Package Code: PGA; Package Shape: SQUARE;
SN74LS601ANP1
SN74LS601ANP1 by Texas Instruments is a Memory Controller with 20 terminals, operating at 5V. It features TTL technology, 85mA max supply current, and operates b/w 0-70°C. This rectangular package is commonly used in commercial applications requiring memory control functions.
SN74LS602ANP3
SN74LS602ANP3 by Texas Instruments is a Memory Controller with 20 terminals, operating at 5V. It has a max supply current of 85mA and operates b/w 0-70°C. This TTL technology chip in an IN-LINE package is commonly used in commercial applications requiring memory control functions.
SN74ALS2968FN3
SN74ALS2968FN3 by Texas Instruments is a Memory Controller with 68 terminals, operating at 5V. It features TTL technology, J Bend terminal form, and supports commercial temperature grade. This chip carrier package is ideal for applications requiring a max operating temperature of 70°C in a surface-mount configuration.
SN54ALS6302JD
SN54ALS6302JD by Texas Instruments is a Memory Controller IC with 20-bit Address Bus, operating at 5V. It features MILITARY-grade temperature range (-55 to 125 °C) and consumes up to 220mA supply current. Ideal for DRAM memory control applications in harsh environments.
SN74ALS6302FN
SN74ALS6302FN by Texas Instruments is a Memory Controller with 20-bit Address Bus, 1M X 16 Memory Organization, and 5V Nominal Voltage. It is used in DRAM applications for commercial temperature grade environments.
DP84T22-25
DP84T22-25 by Texas Instruments is a Memory Controller with 22-bit Address Bus, 25 MHz Clock Frequency, and 4M X 1 Memory Organization. It is used in DRAM applications for low power mode operation, featuring a max supply voltage of 5.5V and operating temperature range of 0-70°C.
SN74ALS2967JD
SN74ALS2967JD by Texas Instruments is a Memory Controller with 18-bit Address Bus, 1M X 16 Memory Organization, and 5V Nominal Voltage. It is ideal for DRAM applications, operates b/w 0-70 °C, and has a max supply current of 200 mA.
SN74LS603NP3
SN74LS603NP3 by Texas Instruments is a Memory Controller with 20 terminals, operating at 5V. It has a max supply current of 85mA and operates b/w 0-70°C. This TTL technology chip in PLASTIC/EPOXY package is ideal for commercial applications requiring precise memory control.
TACT83442-20
TACT83442-20 by Texas Instruments is a Memory Controller with 100 terminals, operating at 5V. It features CMOS technology, GULL WING terminals, and operates b/w 0-70°C. This rectangular package is surface mountable and ideal for commercial applications requiring a flatpack style design.
THCT4502BN
THCT4502BN by Texas Instruments is a Memory Controller with 18-bit Address Bus, 5V Power Supplies, and 4 Banks. It is ideal for DRAM applications, featuring CMOS technology and operating temperature range of 0-70°C. Package style is IN-LINE with DUAL terminal position.
KS84C22-25CL
Samsung
Memory Controllers; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 84; Package Code: QCCJ; Package Shape: SQUARE;
SN74LS601N1
SN74LS601N1 by Texas Instruments is a Memory Controller with 20 terminals, operating at 5V. It has a max supply current of 85mA and operates b/w 0-70°C. This TTL technology chip in an IN-LINE package is commonly used in commercial applications requiring memory control functions.
S25FS128SAGMFM1D1
Infineon Technologies
Memory Controllers;
SDA8800
Memory Controllers; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 68; Package Code: QCCJ; Package Shape: SQUARE;
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QG82910GMLE/SLA9L
Intel
Memory Controllers; Terminal Form: BALL; No. of Terminals: 1257; Package Code: BGA; Package Shape: RECTANGULAR; Qualification: Not Qualified;
QG82945GSESLB2R
Intel QG82945GSESLB2R is a memory controller with 64M X 16 memory organization. It features an external data bus width of 64, address bus width of 14, and operates at a max supply voltage of 1.1 V. Ideal for applications requiring low power mode and compatibility with USB, PCI, I2C, and LPC buses.
QG82945GM
Memory Controllers; Terminal Form: BALL; No. of Terminals: 1466; Package Code: BGA; Power Supplies (V): 1/1.5,1.5/2.5,1.8,3.3; Package Style (Meter): GRID ARRAY;
QG82945PM
Memory Controllers; Terminal Form: BALL; No. of Terminals: 1466; Package Code: BGA; Power Supplies (V): 1/1.5,1.5/2.5,1.8,3.3; Technology: CMOS;
QG82945GT
Memory Controllers; Terminal Form: BALL; No. of Terminals: 1466; Package Code: BGA; Qualification: Not Qualified; Surface Mount: YES;
QG82945GMS
Memory Controllers; Terminal Form: BALL; No. of Terminals: 998; Package Code: BGA; Package Style (Meter): GRID ARRAY; Surface Mount: YES;
QG82945GME
Memory Controllers; Terminal Form: BALL; No. of Terminals: 1466; Package Code: BGA; Maximum Supply Current: 5500 mA; Surface Mount: YES;
QG82945GMSL8Z2
Memory Controllers; Terminal Form: BALL; No. of Terminals: 1466; Package Code: BGA; Qualification: Not Qualified; Power Supplies (V): 1/1.5,1.5/2.5,1.8,3.3;
QG82945PMSL8Z4
Memory Controllers; Terminal Form: BALL; No. of Terminals: 1466; Package Code: BGA; Surface Mount: YES; Power Supplies (V): 1/1.5,1.5/2.5,1.8,3.3;
QG82945GTSL8Z6
Memory Controllers; Terminal Form: BALL; No. of Terminals: 1466; Package Code: BGA; Package Equivalence Code: BGA1466(UNSPEC); Technology: CMOS;
QG82945GMSSL8TC
Memory Controllers; Terminal Form: BALL; No. of Terminals: 998; Package Code: BGA; Terminal Position: BOTTOM; Qualification: Not Qualified;
QG82945G
Memory Controllers; Terminal Form: BALL; No. of Terminals: 1202; Package Code: BGA; Terminal Position: BOTTOM; Power Supplies (V): 1.5,2.5;
QG82945GSL8FU
Memory Controllers; Terminal Form: BALL; No. of Terminals: 1202; Package Code: BGA; Package Equivalence Code: BGA1202(UNSPEC); Power Supplies (V): 1.5,2.5;
QG82945GZ
Memory Controllers; Terminal Form: BALL; No. of Terminals: 1202; Package Code: BGA; Surface Mount: YES; Package Equivalence Code: BGA1202(UNSPEC);
QG82945GZSL927
Memory Controllers; Terminal Form: BALL; No. of Terminals: 1202; Package Code: BGA; Package Style (Meter): GRID ARRAY; Maximum Supply Current: 13800 mA;
QG82945GCSL9Z8
Memory Controllers; Terminal Form: BALL; No. of Terminals: 1202; Package Code: BGA; Maximum Supply Current: 13800 mA; Package Style (Meter): GRID ARRAY;
QG82945PSL8FV
Memory Controllers; Terminal Form: BALL; No. of Terminals: 1202; Package Code: BGA; Package Body Material: PLASTIC/EPOXY; Package Style (Meter): GRID ARRAY;
QG82945PLSL8V4
Memory Controllers; Terminal Form: BALL; No. of Terminals: 1202; Package Code: BGA; Qualification: Not Qualified; Package Equivalence Code: BGA1202(UNSPEC);
QG82945P
Memory Controllers; Terminal Form: BALL; No. of Terminals: 1202; Package Code: BGA; Maximum Supply Current: 13800 mA; Package Equivalence Code: BGA1202(UNSPEC);
QG82945PL
Memory Controllers; Terminal Form: BALL; No. of Terminals: 1202; Package Code: BGA; Maximum Supply Current: 13800 mA; Package Body Material: PLASTIC/EPOXY;
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