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SN74ALS2968N

Texas Instruments

SN74ALS2968N by Texas Instruments

SN74ALS2968N by Texas Instruments is a Memory Controller with 18-bit Address Bus, 1M X 16 Memory Organization, and operates at 5V. It is used in DRAM applications, has a package style of IN-LINE, and supports up to 4 banks for memory management.

Median Price

$6.720

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 175 parts In-Stock

1+ parts

$6.720

100+ parts

$2.912

1k+ parts

$2.755

10k+ parts

-

175

$6.720

$2.912

$2.755

-

Vyrian

USA . 7,565 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,565

-

-

-

-

Digiode

USA . 4,038 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,038

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 526 parts In-Stock

1+ parts

$13.025

100+ parts

-

1k+ parts

-

10k+ parts

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526

$13.025

-

-

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One Stop Electronics

USA . 1,544 parts In-Stock

1+ parts

$20.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,544

$20.000

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-

-

Corohmni

South Africa . 995 parts In-Stock

1+ parts

$26.708

100+ parts

-

1k+ parts

-

10k+ parts

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995

$26.708

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-

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Parana Technologies

USA . 1,469 parts In-Stock

1+ parts

$54.504

100+ parts

-

1k+ parts

-

10k+ parts

-

1,469

$54.504

-

-

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DigiPath Technology Company

USA . 1,543 parts In-Stock

1+ parts

$60.015

100+ parts

$55.214

1k+ parts

-

10k+ parts

-

1,543

$60.015

$55.214

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ChromeModa Solutions

Germany . 5,409 parts In-Stock

1+ parts

$61.240

100+ parts

$50.217

1k+ parts

-

10k+ parts

-

5,409

$61.240

$50.217

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IDEA Electronic Components Group

UK . 2,011 parts In-Stock

1+ parts

$61.240

100+ parts

$58.178

1k+ parts

$55.116

10k+ parts

-

2,011

$61.240

$58.178

$55.116

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Corphita

USA . 3,734 parts In-Stock

1+ parts

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100+ parts

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3,734

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Assy Fe

Spain . 25 parts In-Stock

1+ parts

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100+ parts

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25

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Overview

Enhance your system's performance with the SN74ALS2968N by Texas Instruments, a top-tier manufacturer known for delivering high-quality components. This memory controller offers seamless integration and reliable operation, making it ideal for a wide range of applications. From enhancing data processing speeds to optimizing memory organization, this product provides exceptional value and benefits to customers looking to elevate their systems' capabilities. Upgrade your technology with the SN74ALS2968N and experience superior performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the memory controller easy to handle and less prone to damage during handling or installation.

Maximum Supply Voltage: 5.5 V

The higher maximum supply voltage ensures stability and reliability in operation, providing a safe operating range for the memory controller.

Address Bus Width: 18

The 18-bit address bus width allows for efficient memory addressing and access, enhancing the overall performance of the memory controller.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy integration into existing circuit designs or PCB layouts, making it a versatile choice for various applications.

Power Supplies (V): 5

The standard 5V power supply ensures compatibility with most systems and devices, offering a reliable power source for the memory controller.

No. of Terminals: 48

The higher number of terminals allows for more connectivity options and signal paths, enabling greater flexibility in system integration and expansion.

Package Style (Meter): IN-LINE

The in-line package style facilitates easy installation and mounting on PCBs, ensuring a secure and compact fit in space-constrained environments.

Minimum Supply Voltage: 4.5 V

The lower minimum supply voltage ensures efficient power usage and reduces the risk of overloading or damaging the memory controller in case of voltage fluctuations.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range allows the memory controller to function reliably even in harsh environmental conditions or extended operation periods.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the memory controller can operate in a wide range of temperature conditions without compromising performance or reliability.

Terminal Position: DUAL

The dual terminal position provides redundancy and improves signal integrity, ensuring robust connectivity and preventing signal loss or interference.

Maximum Seated Height: 5.08 mm

The low maximum seated height allows for a compact and space-saving design, enabling the memory controller to be used in slim and compact devices or systems.

Width: 15.24 mm

The moderate width of the memory controller allows for easy integration into standard PCB layouts or designs, making it a versatile choice for various system configurations.

Length: 61.47 mm

The moderate length of the memory controller ensures compatibility with standard mounting mechanisms and PCB sizes, providing a hassle-free installation process.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures the memory controller meets industry standards for temperature tolerance and reliability, making it suitable for commercial applications.

Peripheral IC Type: MEMORY CONTROLLER, DRAM

The memory controller with DRAM peripheral IC type offers efficient memory management and data access, providing fast and reliable performance for memory-intensive tasks.

Technology: TTL

The TTL technology used in the memory controller ensures low power consumption and robust signal processing capabilities, making it an energy-efficient and high-performance solution.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides secure and reliable connections to the PCB, ensuring stable electrical contact and preventing signal disruption or loss.

Maximum Supply Current: 200 mA

The maximum supply current of 200mA ensures the memory controller operates within safe current limits, preventing overheating or damage due to excessive power consumption.

Nominal Supply Voltage: 5 V

The standard 5V nominal supply voltage ensures compatibility with most systems and devices, providing a reliable and stable power source for the memory controller.

Memory Organization: 1M X 16

The memory organization of 1M X 16 provides efficient data storage and access capabilities, enabling the memory controller to handle large amounts of information with high speed and precision.

No. of Banks: 4

The four banks allow for parallel processing and simultaneous data access, improving overall system performance and efficiency in memory management tasks.

Terminal Pitch: 2.54 mm

The standard 2.54mm terminal pitch ensures compatibility with common socket and connector types, making it easy to integrate the memory controller into existing systems or designs.

Technical Specifications

Memory Controllers SN74ALS2968N attributes and parameters. Explore more Memory Controllers devices from Texas Instruments

Specs

Address Bus Width:

18

Boundary Scan:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T48

Length:

61.47 mm

Low Power Mode:

NO

Memory Organization:

1M X 16

No. of Banks:

4

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP48,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Memory Controllers

Maximum Supply Current:

200 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

15.24 mm

Peripheral IC Type:

Trade Compliance

SN74ALS2968N Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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