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SNC54LS602J

Texas Instruments

SNC54LS602J by Texas Instruments

SNC54LS602J by Texas Instruments is a MIL-STD-883 Class B Memory Controller with 20 terminals, operating at -55 to 125°C. It utilizes TTL technology, has a supply voltage of 5V, and is ideal for military applications requiring high reliability in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,914 parts In-Stock

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2,914

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Digiode

USA . 1,652 parts In-Stock

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1,652

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 742 parts In-Stock

1+ parts

$6.846

100+ parts

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742

$6.846

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One Stop Electronics

USA . 219 parts In-Stock

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$8.000

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219

$8.000

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Parana Technologies

USA . 494 parts In-Stock

1+ parts

$17.838

100+ parts

$1,656.554

1k+ parts

$16.054

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494

$17.838

$1,656.554

$16.054

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DigiPath Technology Company

USA . 2,307 parts In-Stock

1+ parts

$19.642

100+ parts

$18.071

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2,307

$19.642

$18.071

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ChromeModa Solutions

Germany . 2,638 parts In-Stock

1+ parts

$20.043

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$16.435

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2,638

$20.043

$16.435

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IDEA Electronic Components Group

UK . 2,325 parts In-Stock

1+ parts

$20.043

100+ parts

$19.041

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$18.039

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2,325

$20.043

$19.041

$18.039

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Corohmni

South Africa . 550 parts In-Stock

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$29.783

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550

$29.783

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Corphita

USA . 879 parts In-Stock

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879

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Overview

Experience the unparalleled quality and reliability of Texas Instruments with the SNC54LS602J memory controller. Designed with cutting-edge technology and built to military-grade standards, this product offers unmatched performance in a wide range of applications. From aerospace to telecommunications, this component ensures optimal functionality and efficiency. Trust in Texas Instruments to deliver value and innovation with every product, providing you with the competitive edge you need to succeed.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide excellent thermal stability and can withstand high temperatures, ensuring reliable operation in harsh environments.

Screening Level: MIL-STD-883 Class B (Modified)

This level of screening ensures that the memory controller meets stringent military standards for reliability and performance, making it suitable for mission-critical applications.

Power Supplies (V): 5

Operating at a standard voltage of 5V, this memory controller is compatible with a wide range of systems and devices.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this memory controller can function effectively in high-temperature environments without overheating.

Technology: TTL

Using TTL technology ensures high-speed data processing and reliable performance, making this memory controller ideal for demanding applications.

Nominal Supply Voltage: 5 V

Operating at a standard voltage of 5V ensures compatibility with a wide range of systems and devices.

Technical Specifications

Memory Controllers SNC54LS602J attributes and parameters. Explore more Memory Controllers devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T20

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Memory Controllers

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SNC54LS602J Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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