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SNC54LS602AJ

Texas Instruments

SNC54LS602AJ by Texas Instruments

SNC54LS602AJ by Texas Instruments is a MIL-STD-883 Class B Memory Controller with 20 terminals, operating at temperatures from -55°C to 125°C. It utilizes TTL technology, has a supply voltage of 5V, and is commonly used in military applications due to its ceramic package and through-hole terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,455 parts In-Stock

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Digiode

USA . 3,945 parts In-Stock

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3,945

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Distributors (Availability)

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AZTECH Wire

Italy . 415 parts In-Stock

1+ parts

$13.772

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415

$13.772

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One Stop Electronics

USA . 506 parts In-Stock

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$14.000

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$14.000

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Parana Technologies

USA . 152 parts In-Stock

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$15.311

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$15.705

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152

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$15.705

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Corohmni

South Africa . 5,145 parts In-Stock

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$16.366

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5,145

$16.366

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DigiPath Technology Company

USA . 269 parts In-Stock

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$16.859

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$15.510

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269

$16.859

$15.510

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ChromeModa Solutions

Germany . 2,112 parts In-Stock

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$17.203

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$14.106

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2,112

$17.203

$14.106

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IDEA Electronic Components Group

UK . 928 parts In-Stock

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$17.203

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$16.343

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$15.483

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928

$17.203

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$15.483

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Corphita

USA . 3,746 parts In-Stock

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Overview

Elevate your electronics projects with the SNC54LS602AJ by Texas Instruments, a high-quality memory controller designed to meet MIL-STD-883 Class B standards. This rectangular package offers 20 terminals and operates at temperatures ranging from -55 to 125°C, making it ideal for military-grade applications. Whether you're working on aerospace systems or industrial machinery, this TTL technology product provides reliable performance and precise control. Trust Texas Instruments for exceptional quality and reliability in every project.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides high thermal conductivity and excellent resistance to shock and vibration, making this memory controller suitable for rugged environments.

Screening Level: MIL-STD-883 Class B (Modified)

This modified MIL-STD-883 Class B screening level ensures that the memory controller meets the necessary reliability and quality standards for military applications.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy integration into electronic systems and offers efficient use of board space.

Power Supplies (V): 5

Operating at a standard voltage of 5V makes this memory controller compatible with a wide range of systems and applications.

No. of Terminals: 20

With 20 terminals, this memory controller provides sufficient connectivity options for interfacing with other components in a system.

Package Style (Meter): IN-LINE

The in-line package style allows for easy installation and secure mounting on circuit boards.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliable performance even in harsh operating conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C allows for operation in a wide range of environmental conditions.

Terminal Position: DUAL

Dual terminal position provides redundancy and ensures more stable and reliable connections.

Temperature Grade: MILITARY

Designed to meet military-grade temperature requirements, ensuring the memory controller's performance in extreme temperature conditions.

Technology: TTL

Utilizing TTL technology allows for high-speed data transfer and compatibility with a wide range of TTL-compatible devices.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides secure connections and ease of soldering during installation on circuit boards.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources and reduces the need for additional power regulation.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54mm, this memory controller offers easy access for testing and troubleshooting during system integration.

Technical Specifications

Memory Controllers SNC54LS602AJ attributes and parameters. Explore more Memory Controllers devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T20

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Memory Controllers

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SNC54LS602AJ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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