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SN74LS601N3

Texas Instruments

SN74LS601N3 by Texas Instruments

SN74LS601N3 by Texas Instruments is a Memory Controller with 20 terminals, operating at 5V. It features TTL technology, operates b/w 0-70°C, and has a max supply current of 85mA. This rectangular package is commonly used in commercial applications requiring memory control functions.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,218 parts In-Stock

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Digiode

USA . 60 parts In-Stock

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60

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AZTECH Wire

Italy . 536 parts In-Stock

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$8.190

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536

$8.190

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One Stop Electronics

USA . 1,093 parts In-Stock

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$12.000

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Parana Technologies

USA . 188 parts In-Stock

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$49.729

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$49.729

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Corohmni

South Africa . 1,122 parts In-Stock

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$51.826

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DigiPath Technology Company

USA . 1,763 parts In-Stock

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$54.758

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$50.377

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ChromeModa Solutions

Germany . 5,764 parts In-Stock

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$55.875

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$45.818

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$55.875

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IDEA Electronic Components Group

UK . 61 parts In-Stock

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$55.875

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$53.081

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$50.288

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Corphita

USA . 1,558 parts In-Stock

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Overview

Unleash the power of reliable memory control with Texas Instruments' SN74LS601N3. Crafted with precision and quality, this memory controller offers seamless performance for a wide range of applications. From industrial automation to consumer electronics, this product ensures optimal functionality and efficiency. Trust in Texas Instruments' expertise to deliver unmatched value and benefits to your projects. Upgrade to the SN74LS601N3 today and experience the difference in quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the memory controller, making it a reliable choice for long-term use.

Power Supplies (V): 5

Operating at a standard voltage of 5V makes this memory controller compatible with a wide range of systems and devices.

No. of Terminals: 20

Having 20 terminals allows for efficient connectivity and communication with other components, enhancing the overall performance of the memory controller.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this memory controller can withstand high heat levels, ensuring consistent performance in various environments.

Minimum Operating Temperature: 0 °C

The ability to operate at temperatures as low as 0°C makes this memory controller suitable for use in a wide range of conditions and settings.

Technology: TTL

Utilizing TTL (transistor-transistor logic) technology ensures reliable and fast data processing, making this memory controller an efficient choice for data-intensive applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides easy installation and secure connections, enhancing the overall reliability and performance of the memory controller.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures consistent and stable power delivery to the memory controller, enhancing its overall performance and reliability.

Technical Specifications

Memory Controllers SN74LS601N3 attributes and parameters. Explore more Memory Controllers devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T20

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Sub-Category:

Memory Controllers

Maximum Supply Current:

85 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74LS601N3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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