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SN74ALS6302FN

Texas Instruments

SN74ALS6302FN by Texas Instruments

SN74ALS6302FN by Texas Instruments is a Memory Controller with 20-bit Address Bus, 1M X 16 Memory Organization, and 5V Nominal Voltage. It is used in DRAM applications for commercial temperature grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,743 parts In-Stock

1+ parts

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7,743

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Digiode

USA . 1,230 parts In-Stock

1+ parts

-

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1,230

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,211 parts In-Stock

1+ parts

$9.000

100+ parts

-

1k+ parts

-

10k+ parts

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1,211

$9.000

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AZTECH Wire

Italy . 799 parts In-Stock

1+ parts

$19.356

100+ parts

-

1k+ parts

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799

$19.356

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Corohmni

South Africa . 2,998 parts In-Stock

1+ parts

$42.667

100+ parts

-

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2,998

$42.667

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Parana Technologies

USA . 866 parts In-Stock

1+ parts

$72.644

100+ parts

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10k+ parts

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866

$72.644

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DigiPath Technology Company

USA . 1,421 parts In-Stock

1+ parts

$79.990

100+ parts

$73.590

1k+ parts

-

10k+ parts

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1,421

$79.990

$73.590

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ChromeModa Solutions

Germany . 4,174 parts In-Stock

1+ parts

$81.622

100+ parts

$66.930

1k+ parts

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10k+ parts

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4,174

$81.622

$66.930

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IDEA Electronic Components Group

UK . 1,253 parts In-Stock

1+ parts

$81.622

100+ parts

$77.541

1k+ parts

$73.460

10k+ parts

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1,253

$81.622

$77.541

$73.460

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Corphita

USA . 447 parts In-Stock

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447

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Overview

Unlock the power of efficient memory control with the SN74ALS6302FN by Texas Instruments. Known for their high-quality products, Texas Instruments delivers outstanding performance in memory controllers. Ideal for a wide range of applications, this product offers exceptional value and benefits to customers seeking reliable and versatile solutions. Experience seamless operation and enhanced functionality with the SN74ALS6302FN, setting new standards in memory controller technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material is cost-effective and durable, making the product reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and secure installation on PCBs, saving time and effort during assembly.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, allowing for flexible power options in different applications.

Address Bus Width: 20

A wider address bus width allows for greater memory addressing capabilities, enabling the controller to handle larger data sets efficiently.

Package Shape: SQUARE

Square package shape facilitates easier placement and handling during assembly, optimizing space utilization on the PCB.

Power Supplies (V): 5

Operates efficiently on standard 5V power supply, making it compatible with a wide range of systems and devices.

No. of Terminals: 68

A higher number of terminals provide more connectivity options for interfacing with other components, enhancing the versatility of the product.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers better thermal performance and reliability, ensuring stable operation under varying temperature conditions.

Minimum Supply Voltage: 4.5 V

Provides a reliable lower limit for supply voltage, safeguarding the controller against power fluctuations and ensuring consistent performance.

Maximum Operating Temperature: 70 °C

High maximum operating temperature tolerance allows the controller to function reliably even in harsh environmental conditions, increasing its durability.

Minimum Operating Temperature: 0 °C

Supports operation at lower temperatures, making the product suitable for a wide range of operating environments and applications.

Terminal Position: QUAD

Quad terminal position enhances stability and ease of soldering during installation, ensuring a secure and reliable connection on the PCB.

Maximum Seated Height: 4.57 mm

Low seated height reduces the overall profile of the component, making it suitable for slim and compact designs where space is limited.

Width: 24.2316 mm

Standard width dimension allows for easy integration into standard PCB layouts, ensuring compatibility with existing designs and setups.

Length: 24.2316 mm

Standard length dimension facilitates proper fit and alignment on the PCB, enabling seamless integration within the system.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable performance in typical operating conditions, making the product suitable for commercial applications.

Peripheral IC Type: MEMORY CONTROLLER, DRAM

Designed specifically for memory control and management, ensuring efficient and reliable operation of DRAM modules in a variety of systems.

Technology: BIPOLAR

Bipolar technology offers high-speed operation and low power consumption, making the controller suitable for high-performance applications requiring efficient data processing.

Terminal Form: J BEND

J Bend terminal form provides secure connection points and ease of soldering during installation, enhancing the reliability and durability of the product.

Maximum Supply Current: 220 mA

Low maximum supply current requirement reduces power consumption and heat generation, ensuring energy efficiency and stable operation of the controller.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage ensures compatibility with common power sources, making it easy to integrate into existing systems without the need for additional power adjustments.

Memory Organization: 1M X 16

1M X 16 memory organization offers high data storage capacity and efficient data access, enabling fast and reliable memory operations in the system.

No. of Banks: 4

Multiple banks provide parallel access to memory, enhancing data retrieval and manipulation speeds, making the controller suitable for high-performance computing applications.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for easy connection and compatibility with standard PCB layouts, ensuring seamless integration into various electronic systems.

Technical Specifications

Memory Controllers SN74ALS6302FN attributes and parameters. Explore more Memory Controllers devices from Texas Instruments

Specs

Address Bus Width:

20

Boundary Scan:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-J68

Length:

24.2316 mm

Low Power Mode:

NO

Memory Organization:

1M X 16

No. of Banks:

4

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Memory Controllers

Maximum Supply Current:

220 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24.2316 mm

Peripheral IC Type:

Trade Compliance

SN74ALS6302FN Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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