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THCT4502JD

Texas Instruments

THCT4502JD by Texas Instruments

THCT4502JD by Texas Instruments is a Memory Controller with 48 terminals, operating at 5V. It features CMOS technology, operates b/w 0-70°C, and draws a max current of 15mA. Ideal for applications requiring precise memory control in commercial-grade environments.

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Digiode

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Vyrian

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Fibra_Brandt Electronic GMBH

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ComSIT Distribution GmbH

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Odi Ramu Company

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J & M Industries LLC

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MRC Electronics

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AZTECH Wire

Italy . 653 parts In-Stock

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One Stop Electronics

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Corohmni

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Parana Technologies

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DigiPath Technology Company

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ChromeModa Solutions

Germany . 4,562 parts In-Stock

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IDEA Electronic Components Group

UK . 50 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the THCT4502JD by Texas Instruments, a top-tier manufacturer known for exceptional quality and reliability. This memory controller offers seamless integration and superior functionality, making it ideal for a wide range of applications. With a package body material of ceramic and 48 terminals, this product ensures optimal performance in any operating conditions. Upgrade your technology with the THCT4502JD and experience the unmatched value and benefits that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity and mechanical strength, ensuring reliability in various operating conditions.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into circuit boards and provides efficient use of space in electronic devices.

Power Supplies (V): 5

Operating at 5 volts provides a standard power supply that is commonly available, making the product compatible with a wide range of systems.

No. of Terminals: 48

Having 48 terminals allows for increased connectivity and versatility in connecting to other components in the system.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the memory controller can function reliably in a variety of environments without overheating.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the memory controller energy efficient and reliable in data transmission.

Maximum Supply Current: 15 mA

Operating at a maximum supply current of 15 mA reduces power consumption and heat generation, increasing the efficiency and longevity of the product.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for easy and secure connections, ensuring stable performance and reducing the risk of signal interference.

Technical Specifications

Memory Controllers THCT4502JD attributes and parameters. Explore more Memory Controllers devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T48

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP48,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Memory Controllers

Maximum Supply Current:

15 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

THCT4502JD Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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