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SN74LS601J4

Texas Instruments

SN74LS601J4 by Texas Instruments

SN74LS601J4 by Texas Instruments is a TTL memory controller with 20 terminals, operating at 5V. It has a max supply current of 85mA and operates b/w 0-70°C. Commonly used in commercial applications requiring ceramic package material and rectangular shape.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,954 parts In-Stock

1+ parts

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3,954

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Digiode

USA . 2,760 parts In-Stock

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2,760

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 501 parts In-Stock

1+ parts

$8.160

100+ parts

-

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501

$8.160

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One Stop Electronics

USA . 866 parts In-Stock

1+ parts

$26.000

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866

$26.000

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Parana Technologies

USA . 160 parts In-Stock

1+ parts

$33.163

100+ parts

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$120.036

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160

$33.163

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$120.036

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DigiPath Technology Company

USA . 1,292 parts In-Stock

1+ parts

$36.517

100+ parts

$33.595

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1,292

$36.517

$33.595

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ChromeModa Solutions

Germany . 3,564 parts In-Stock

1+ parts

$37.262

100+ parts

$30.555

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3,564

$37.262

$30.555

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IDEA Electronic Components Group

UK . 418 parts In-Stock

1+ parts

$37.262

100+ parts

$35.399

1k+ parts

$33.536

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418

$37.262

$35.399

$33.536

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Corohmni

South Africa . 614 parts In-Stock

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$55.333

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614

$55.333

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Corphita

USA . 3,377 parts In-Stock

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3,377

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Overview

Unlock the power of your memory controllers with the SN74LS601J4 by Texas Instruments. Crafted with precision using high-quality ceramic materials, this product offers unparalleled reliability and performance. Ideal for a wide range of applications, this memory controller stands out for its seamless integration and ease of use. With a nominal supply voltage of 5V and a maximum operating temperature of 70°C, the SN74LS601J4 ensures optimal functionality in any environment. Trust Texas Instruments to deliver top-notch quality and innovation, making this product a valuable investment that guarantees long-term benefits and advantages for all customers.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide excellent protection for delicate electronic components and offer superior thermal performance, making this memory controller durable and reliable.

Power Supplies (V): 5

Operating at a standard voltage of 5V makes this memory controller compatible with a wide range of systems and easy to integrate into existing setups.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this memory controller can function reliably in a variety of environments without risk of overheating.

Technology: TTL

Using TTL technology ensures fast and efficient data transmission, enhancing the overall performance of this memory controller.

Nominal Supply Voltage: 5 V

Consistent supply voltage at 5V allows for stable and reliable operation, ensuring the smooth functioning of this memory controller.

Technical Specifications

Memory Controllers SN74LS601J4 attributes and parameters. Explore more Memory Controllers devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T20

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Sub-Category:

Memory Controllers

Maximum Supply Current:

85 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74LS601J4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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